초록 ▼

A heat dissipation system includes an enclosure ( 10 ), a motherboard ( 30 ), a CPU module, a plurality of first system fan ( 80 ) and a second fan ( 90 ). The enclosure includes a first panel ( 12 ), a second panel ( 14 ) perpendicular to the first panel and a third panel ( 16 ) parallel to the fir

A heat dissipation system includes an enclosure ( 10 ), a motherboard ( 30 ), a CPU module, a plurality of first system fan ( 80 ) and a second fan ( 90 ). The enclosure includes a first panel ( 12 ), a second panel ( 14 ) perpendicular to the first panel and a third panel ( 16 ) parallel to the first panel. A plurality of air inlets ( 18 ) is defined in the third panel. The motherboard is mounted inside the enclosure parallel to but opposite from the second panel. The CPU module is secured to the motherboard. The first fan is secured to the first panel for expelling air inside the enclosure to an outside of the enclosure. The second fan is secured to the second panel for causing air entering the enclosure via the air inlets to be directed generally toward the CPU module.

대표청구항 ▼

1. A heat dissipation system comprising:an enclosure comprising a first panel, a second panel perpendicular to the first panel, and a third panel parallel to and opposite from the first panel, a plurality of air inlets being defined in the third panel;a circuit board secured in the enclosure opposit

1. A heat dissipation system comprising:an enclosure comprising a first panel, a second panel perpendicular to the first panel, and a third panel parallel to and opposite from the first panel, a plurality of air inlets being defined in the third panel;a circuit board secured in the enclosure opposite from the second panel;an electronic package secured to the circuit board;a first fan secured to the first panel for expelling air inside the enclosure to an outside of the enclosure; anda second fan secured to the second panel and aligned with the electronic package, for causing air entering the enclosure via the air inlets to be directed generally toward the electronic package, the second fan comprising a flat base having a plurality of legs. 2. The heat dissipation system of claim 1, wherein the first fan is a system fan. 3. The heat dissipation system of claim 1, wherein a plurality of bores is defined in the base of the second fan. 4. The heat dissipation system of claim 3, wherein a plurality of fastening holes is defined in the second panel, corresponding to the bores. 5. The heat dissipation system of claim 4, wherein a plurality of fasteners extends through the bores and is engaged in the fastening holes, thereby securing the second fan to the second panel. 6. The heat dissipation system of claim 1, further comprising a heat sink attached to the electronic package. 7. A heat dissipation system comprising:an enclosure defining a space therein;a heat generating device located at a position in said space;a first fan positioned on the enclosure and facing said space in a first direction and communicating with an exterior;a second fan positioned on an inside of the enclosure without direct communication with the exterior and facing said space and spatially directing to said heat generating device a second direction different from said first direction; anda plurality of inlets located in the enclosure to allow a cool air from the exterior into the space; whereinthe cool air entering the space is forced by the second fan toward the heat generating device; whereinsaid second heat generating device are substantially located on two sides of said space. 8. The system of claim 7, wherein said first fan is to expel air in the space to the exterior. 9. The system of claim 8, wherein said inlets are opposite to said first fan in said first direction. 10. The system of claim 7, wherein said first direction and said second direction are perpendicular to each other. 11. The system of claim 7, wherein said enclosure defines a rectangular parallelpiped with thereof a long axis and a short axis perpendicular to each other, said long axis being in said first direction and said short axis being in said second direction. 12. A method of removing hot air from an computer enclosure, comprising steps of:providing the enclosure with opposite first and second sides and a third side located between said first and second sides;providing a space in said enclosure and surrounded by said first, second and third sides;providing a heat generating in the space;providing a first fan for communicating air between the space and an exterior outside the enclosure;providing a second fan for forcible circulation of air in said space; whereinsaid second fan is spaced from said heat generating device with a distance for enhancement of said circulation in the whole space; further including a step of providing inlets in the second side to allow cool air from the exterior into the space; whereinsaid first side and said second side commonly define a long axis of said enclosure while said second fan and said heat generating device commonly define a short axis of said enclosure, under a condition that said second fan and said heat generating device are respectively located by two sides of said space. 13. The method of claim 12, wherein said second fan is located on an inside of the side and facing the heating generating device. 14. The method of claim 12, wherein said firs t fan is located in the first side. 15. The method of claim 13, wherein said second fan does not directly communicate with the exterior but shielded by the third side.