A semiconductor manufacturing method whereby reactive gas processing such as selective epitaxial growth can be carried out with high precision by correctly adjusting conditions during processing is performed by a semiconductor manufacturing apparatus which can restrict increases in the moisture cont
A semiconductor manufacturing method whereby reactive gas processing such as selective epitaxial growth can be carried out with high precision by correctly adjusting conditions during processing is performed by a semiconductor manufacturing apparatus which can restrict increases in the moisture content, prevent heavy metal pollution and the like, and investigate the correlation between moisture content in the process chamber and outside regions. The moisture content in a reaction chamber and in a gas discharge system of the reaction chamber are measured when a substrate is provided, and the conditions for reactive gas processing are adjusted based on the moisture content. Furthermore, the moisture content in the airtight space is measured by a first moisture measuring device which is connected to the airtight space, and thereafter, the substrate is inserted and ejected by a substrate carrying system, and a reactive gas is processed while measuring the moisture content in the reaction chamber by a second moisture measuring device, which is connected to the reaction chamber, after the moisture content in the airtight space is measured.
대표청구항▼
1. A semiconductor manufacturing apparatus for performing reactive gas processing when a substrate carrying system inserts a substrate from an airtight space in the substrate carrying system into a reaction chamber, and when said substrate is ejected from said reaction chamber to said airtight space
1. A semiconductor manufacturing apparatus for performing reactive gas processing when a substrate carrying system inserts a substrate from an airtight space in the substrate carrying system into a reaction chamber, and when said substrate is ejected from said reaction chamber to said airtight space, the semiconductor manufacturing apparatus feeding reactive gas into said reaction chamber and reacting the reactive gas therein, said apparatus comprising:a first moisture measuring device, which is one of a laser moisture measuring device, an absorbant moisture measuring device, an electrostatic capacity moisture measuring device, and a qualitative analysis moisture measuring device, for measuring the moisture content in said airtight space of said substrate carrying system; anda second moisture measuring device which measures the moisture content in said reaction chamber. 2. The semiconductor manufacturing apparatus according to claim 1, comprising a plurality of reaction chambers, said first moisture measuring device being capable of measuring the moisture content in each of said reaction chambers. 3. The semiconductor manufacturing apparatus according to claim 2, further comprising a switching unit which can switch an object connected to said first moisture measuring device to any one of said reaction chambers. 4. The semiconductor manufacturing apparatus according to claim 1, said first moisture measuring device and said second moisture measuring device comprising a single moisture measuring device; the apparatus further comprisinga switching unit which can switch an object connected to said moisture measuring device to said airtight space and said reaction chamber. 5. The semiconductor manufacturing apparatus according to claim 1, at least one of said first moisture measuring device and said second moisture measuring device comprising a laser moisture measuring device which radiates laser light into a tubular cell main body, connected to said airtight space and said reaction chamber, and measures the absorption spectrum of transmitted laser light. 6. A semiconductor manufacturing apparatus for performing reactive gas processing on a substrate, the apparatus comprising:at least one reaction chamber, the reaction chamber being connectable to a source of reactive gas;a substrate carrying system that carries substrates into and out of the at least one reaction chamber, the substrate carrying system including an airtight space;a first moisture measuring device for measuring the moisture content in the airtight space, the first moisture measuring device being one of a laser moisture measuring device, an absorbant moisture measuring device, an electrostatic capacity moisture measuring device, and a qualitative analysis moisture measuring device; anda second moisture measuring device for measuring the moisture content in the at least lone reaction chamber. 7. The semiconductor manufacturing apparatus according to claim 6, wherein the second moisture measuring device is a laser moisture measuring device. 8. The semiconductor manufacturing apparatus according to claim 7, wherein the second moisture measuring device comprises:a tubular main body, the tubular main body being connected at a first end to the at least one reaction chamber by a sampling pipe and connected at a second end to a connecting pipe connectable to a discharge system;a laser for transmitting light through the tubular main body along a longitudinal axis of the tubular main body; anda photodetector that measures the absorption spectrum of transmitted light. 9. The semiconductor manufacturing apparatus according to claim 8, wherein the second moisture measuring device further comprises:a heater wound around the sampling pipe and the connecting pipe; andan insulator wound around the heater. 10. The semiconductor manufacturing apparatus according to claim 8, wherein the second moisture measuring device further comprises;a heater on the tubular main body. 11. A semicondu ctor manufacturing apparatus for performing reactive gas processing on a substrate, the apparatus comprising:at least one reaction chamber, the reaction chamber being connectable to a source of reactive gas;a substrate carrying system that carries substrates into and out of the at least one reaction chamber, the substrate carrying system including an airtight space;a moisture measuring device for measuring the moisture content in one of the at least one reaction chamber and the airtight space; anda switching unit for switching the moisture measuring device between measuring the moisture content of the airtight space and the moisture content of the at least one reaction chamber. 12. A semiconductor manufacturing apparatus according to claim 11, wherein the at least one reaction chamber comprises a plurality of reaction chambers and the switching unit switches the moisture measuring device between reaction chambers. 13. The semiconductor manufacturing apparatus according to claim 11, wherein the second moisture measuring device is a laser moisture measuring device. 14. The semiconductor manufacturing apparatus according to claim 11, wherein the second moisture measuring device comprises:a tubular main body, the tubular main body being connected at a first end to the at least one reaction chamber by a sampling pipe and connected at a second end to a connecting pipe connectable to a discharge system;a laser for transmitting light through the tubular main body along a longitudinal axis of the tubular main body; anda photodetector that measures the absorption spectrum of transmitted light. 15. The semiconductor manufacturing apparatus according to claim 14, wherein the second moisture measuring device further comprises:a heater wound around the sampling pipe and the connecting pipe; andan insulator wound around the heater. 16. The semiconductor manufacturing apparatus according to claim 14, wherein the second moisture measuring device further comprises;a heater on the tubular main body.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (13)
Kashiwagi Akihide,JPX ; Kataoka Toyotaka,JPX ; Suzuki Toshihiko,JPX, Apparatus for forming silicon oxide film and method of forming silicon oxide film.
Tapp Frederick (Hillsborough NC) Berger Henry (Durham NC), Method of performing an instantaneous moisture concentration measurement and for determining the drydown characteristics.
Walker Charles W. E. (591 W. 57th Ave. #301 Vancouver ; British Columbia CAX), Microwave moisture measurement of moving particulate layer after thickness leveling.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.