초록 ▼

A modular computer system, for example a high density server system, includes an enclosure for receiving a number of computer system modules. A number of information processing modules, for example server blades, are receivable at a first face of the enclosure. A number of support modules of a first

A modular computer system, for example a high density server system, includes an enclosure for receiving a number of computer system modules. A number of information processing modules, for example server blades, are receivable at a first face of the enclosure. A number of support modules of a first type, for example combined switch and service processor modules, and a number of support modules of a second type, for example power supply modules, are receivable at the second face of the enclosure. In order to provide cooling air to the first type of support modules, which are temperature sensitive, a plenum chamber provides a flow path for cooling air that bypasses the information processing modules. For the second type of support module, which is not as temperature sensitive, a flow path for cooling air is provided that passes through the information processing modules.

대표청구항 ▼

1. An enclosure for a modular computer system, the enclosure comprising:a first face including at least one first module receiving location for receiving at least one removable first computer system module;a second face including at least one second module receiving location for receiving at least o

1. An enclosure for a modular computer system, the enclosure comprising:a first face including at least one first module receiving location for receiving at least one removable first computer system module;a second face including at least one second module receiving location for receiving at least one removable second computer system module;at least one opening in the first face; andat least one passage defining a flow path for cooling air between said at least one opening and said at least one second module receiving location, which flow path bypasses said at least one first module receiving location. 2. The enclosure of claim 1, comprising a plurality of first module receiving locations. 3. The enclosure of claim 1, comprising a plurality of second module receiving locations. 4. The enclosure of claim 1, wherein the passage is located between said at least one first module receiving location and a third face of the housing. 5. The enclosure of claim 1, comprising at least one third module receiving location provided in said second face for receiving at least one removable third computer system module, a further flow path for cooling air separate from the flow path that passes via the passage, the further flow path including said at least one first module receiving location and said at least one third module receiving location. 6. The enclosure of claim 5, comprising a plurality of third module receiving locations. 7. The enclosure of claim 5, comprising an interconnection member configured to interconnect received computer system modules and provided with at least one aperture to permit a flow of air, whereby the further flow path includes said at least one first module receiving location, said at least one aperture in the interconnection member and said at least one third module receiving location. 8. The enclosure of claim 7, wherein the interconnection member is a midplane having at least one aperture. 9. The enclosure of claim 5, further comprising a path separator to keep air in the further flow path away from said at least one second module receiving location. 10. The enclosure of claim 9, wherein the path separator is further operable to keep air in the flow path that passes via the passage away from said at least one second module receiving location. 11. The enclosure of claim 1, wherein the first face of the enclosure is a front face and the second face of the enclosure is a rear face, and wherein the enclosure is arranged to be cooled by a flow of cooling air in a direction substantially from the front face to the rear face. 12. The enclosure of claim 1, wherein openings are provided in side walls of the enclosure into the passage to increase the flow of air to said at least one second module receiving location. 13. The enclosure of claim 1, configured as a rack mountable shelf. 14. A modular computer system comprising an enclosure for receiving computer system modules, the enclosure including:a first face including at least one first module receiving location for receiving at least one removable first computer system module;a second face including at least one second module receiving location for receiving at least one removable second computer system module;at least one opening in the first face;at least one passage defining a flow path for cooling air between said at least one opening and said at least one second module receiving location, which flow path bypasses said at least one first module receiving location;at least one removable first computer system module received at said at least one first module receiving location and arranged to be cooled by a flow of air therethrough; andat least one removable second computer system module received at said at least one second module receiving location and arranged to be cooled by a flow of air therethrough. 15. The modular computer system of claim 14, comprising a plurality of first module receiving locations. 16. The modular computer system of claim 14, comprising a plurality of second module receiving locations. 17. The modular computer system of claim 14, wherein the passage is located between said at least one first module receiving location and a third face of the housing. 18. The modular computer system of claim 14, comprising at least one third module receiving location provided in said second face for receiving at least one removable third computer system module, a further flow path for cooling air separate from the flow path that passes via the passage, the further flow path including said at least one first module receiving location and said at least one third module receiving location. 19. The modular computer system of claim 18, comprising a plurality of third module receiving locations. 20. The modular computer system of claim 18, comprising an interconnection member configured to interconnect received computer system modules and provided with at least one aperture to permit a flow of air, whereby said further flow path includes said at least one first module receiving location, said at least one aperture in the interconnection member and said at least one third module receiving location. 21. The modular computer system of claim 20, wherein the interconnection member is a midplane having at least one aperture. 22. The modular computer system of claim 18, further comprising a path separator to keep air in the further flow path away from said at least one second module receiving location. 23. The modular computer system of claim 22, wherein the path separator is further operable to keep air in the flow path that passes via the passage away from said at least one second module receiving location. 24. The modular computer system of claim 18, further comprising at least one removable third computer system module received at said at least one third module receiving location and arranged to be cooled by a flow of air therethrough. 25. The modular computer system of claim 24, wherein said at least one removable third computer system module is a power supply module arranged to provide power to other removable computer system modules. 26. The modular computer system of claim 14, wherein said at least one removable second computer system module is a support module arranged to provide enclosure level support. 27. The modular computer system of claim 26, wherein the support module comprises a switch part operable to distribute information signals and a service processor part operable to process system management signals. 28. The modular computer system of claim 14, wherein said at least one removable first computer system module receivable is an information processing module operable to perform information processing. 29. The modular computer system of claim 28, wherein the information processing module is a server blade. 30. The modular computer system of claim 14, wherein the first face of the enclosure is a front face and the second face of the enclosure is a rear face, and wherein the enclosure is arranged to be cooled by flow of cooling air in a direction substantially from the front face to the rear face. 31. The modular computer system of claim 14, wherein openings are provided in side walls of the enclosure into the passage to increase the flow of air to said at least one second module receiving location. 32. The modular computer system of claim 14, wherein the flow of air through the enclosure is driven by a fan provided within at least one of said removable first and second computer system modules. 33. The modular computer system of claim 32, wherein at least one removable computer system module comprises two fans arranged to drive the flow of air therethrough. 34. The modular computer system of claim 14, wherein the enclosure is configured as a rack mountable shelf. 35. The modular computer system of claim 14, wherein the modular computer system is a high density server system. 36. A high density server system comprising an enclosure for receiving computer system modules, whe rein:a plurality of information processing modules are receivable at a first face of the enclosure;a plurality of first support modules are receivable at a second face of the enclosure;a plurality of second support modules are receivable at the second face of the enclosure; andthe enclosure includes a plenum chamber to provide a flow path for air for cooling received first support modules to bypass received information processing modules. 37. The high density server system of claim 36, wherein air for cooling received first support modules is drawn from the first face via the plenum chamber bypassing received information processing modules. 38. The high density server system of claim 36, wherein air for cooling received second support modules passes via a further flow path that includes received information processing modules. 39. The high density server system of claim 38, comprising an interconnection member operable to interconnect received modules, the interconnection member being configured to form part of the further flow path. 40. The high density server system of claim 36, wherein the enclosure further includes an air flow separator between received first support modules and received second support modules. 41. The high density server system of claim 36, wherein at least one information processing module is a server blade. 42. The high density server system of claim 36, wherein at least one first support module includes a service processor. 43. The high density server system of claim 36, wherein at least one first support module includes a switch module. 44. The high density server system of claim 36, wherein at least one first support module comprises a combined switch and service processor module. 45. The high density server system of claim 36, wherein at least one second support module comprises a power supply module. 46. The high density server system of claim 36, wherein fans are provided in at least some received modules for drawing air through received modules. 47. The high density server system of claim 36, wherein air is drawn substantially in a direction from the first face to the second face. 48. A method of cooling a high density server system comprising an enclosure for receiving computer system modules, wherein a plurality of information processing modules are receivable at a first face of the enclosure, a plurality of first support modules are receivable at a second face of the enclosure and a plurality of second support modules are receivable at the second face of the enclosure, the method comprising:installing the information processing modules, the first support modules and the second support modules; andsupplying cooling air to received first support modules by drawing air along a flow path that includes a plenum chamber bypassing received information processing modules. 49. The method of claim 48, comprising drawing air for cooling received first support modules from the first face via the plenum chamber bypassing received information processing modules. 50. The method of claim 48, comprising passing air for cooling received second support modules via a further flow path that includes received information processing modules. 51. The method of claim 50, comprising passing air for cooling received second support modules via an interconnection member that is operable to interconnect received modules and is configured to form part of the further flow path. 52. The method of claim 48, comprising separating respective flow paths using an air flow separator between received first support modules and received second support modules. 53. The method of claim 48, wherein at least one information processing module is a server blade. 54. The method of claim 48, wherein at least one first support module includes a service processor. 55. The method of claim 48, wherein at least one first support module includes a switch module. 56. The method of claim 48, wherein at least one first support module comprises a combi ned switch and service processor module. 57. The method of claim 48, wherein at least one second support module comprises a power supply module. 58. The method of claim 48, comprising drawing air through the received modules by fans contained within at least some of received modules. 59. The method of claim 48, comprising drawing air substantially in a direction from the first face to the second face. 60. The method of claim 48, comprising drawing air substantially in a direction from the second face to the first face. 61. A modular computer system comprising enclosure means for receiving computer system modules, wherein:a plurality of first computer module means are receivable at a first face of the enclosure means;a plurality of second computer module means are receivable at a second face of the enclosure means;a plurality of third computer module means are receivable at the second face of the enclosure means; andthe enclosure means includes plenum means to provide a flow path for air for cooling received second computer module means to bypass received first computer module means.