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Cooling device with multiple compliant elements 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0308225 (2002-12-02)
발명자 / 주소
  • Messina, Gaetano P.
  • Mok, Lawrence S.
  • Yuan, Tsorng-Dih
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Morris Daniel P.
인용정보 피인용 횟수 : 23  인용 특허 : 16

초록

A cooling device having a common cooling distribution unit with multiple compliant cooling elements. Mechanisms are built in to ensure the cooling elements are in good thermal contact with heat generating semiconductor chips of different heights and sizes on a common carrier. The cooling distributio

대표청구항

1. An apparatus for cooling a plurality of devices, comprising;a bottom plate;a cover;a first flexible member supported in said cover, said first flexible member having first openings therein;a second flexible coolant blockage member supported between said cover and said bottom plate, said second fl

이 특허에 인용된 특허 (16)

  1. Young Steven P. (LaGrangeville NY) Acocella John (Hopewell Junction NY) Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Song Seaho (Highland NY), Apparatus for indirect impingement cooling of integrated circuit chips.
  2. Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Pavelka John B. (Beacon NY) Sherif Raed A. (Pleasant Valley NY), Blind hole cold plate cooling system.
  3. Chu Richard C. (Poughkeepsie NY) Hwang Un-pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Conduction cooled module.
  4. Onodera Yasushi (Kawasaki JPX) Ueda Akira (Kawasaki JPX), Cooling device for integrated circuit element.
  5. Umezawa Kazuhiko (Tokyo JPX), Cooling structure for integrated circuits.
  6. Galyon George T. (Fishkill NY) Jordhamo George M. (Wappingers Falls NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cross-hatch flow distribution and applications thereof.
  7. Chao-Fan Chu Richard (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels.
  8. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
  9. Lamb Charles Robert ; Li Kang-Wah ; Papanicolaou Elias,DEX ; Tai Charles Chaolee, Flexible cold plate having a one-piece coolant conduit and method employing same.
  10. Lipschutz Lewis D. (Poughkeepsie NY), Flexible thermal conduction element for cooling semiconductor devices.
  11. Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Harvilchuck Joseph M. (Billings NY), High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology.
  12. Messina Gaetano P. (Hopewell Junction NY), Integral cooling system for electric components.
  13. Shmunis Gregory (San Carlos CA), Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling.
  14. Kawamura Keizo,JPX ; Ashiwake Noriyuki,JPX ; Daikoku Takahiro,JPX ; Idei Akio,JPX ; Kasai Kenichi,JPX ; Kimura Hideyuki,JPX ; Nishihara Atsuo,JPX ; Hatada Toshio,JPX ; Sasaki Shigeyuki,JPX, Low thermal resistant, fluid-cooled semiconductor module.
  15. Nelson Richard D. (Austin TX) Gupta Omkarnath R. (Englewood CO) Herrell Dennis J. (Austin TX), Method and apparatus for adjustably mounting a heat exchanger for an electronic component.
  16. Akamatsu Shinya (Tokyo JPX) Mine Shinji (Tokyo JPX) Seguchi Hideki (Tokyo JPX), Structure for cooling an integrated circuit.

이 특허를 인용한 특허 (23)

  1. Straznicky, Ivan; Power Fardy, Richard Jude, Adjustable height liquid cooler in liquid flow through plate.
  2. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Composite heat sink structures.
  3. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Composite heat sink structures.
  4. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Composite heat sink structures.
  5. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  6. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  7. Fukuda, Hiroshi; Fujita, Kenji, Cooling structure for disk storage device.
  8. Bodenweber, Paul F.; Marston, Kenneth C.; Sikka, Kamal K.; Toy, Hilton T.; Werner, Randall J.; Zitz, Jeffrey A., Cooling structure for electronic boards.
  9. Bodenweber, Paul F.; Marston, Kenneth C.; Sikka, Kamal K.; Toy, Hilton T.; Werner, Randall J.; Zitz, Jeffrey A., Cooling structure for electronic boards.
  10. Benoit, Paul, Electric radiator using calculating processors as a heat source.
  11. Benoit, Paul, Electric radiator using calculating processors as a heat source.
  12. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Fabricating multi-component electronic module with integral coolant-cooling.
  13. Koontz, Christopher R.; Chu, Charles; Flores, Gilbert A., Flexible electronic package integrated heat exchanger with cold plate and risers.
  14. Straznicky, Ivan; Ratliff, William Edward, Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module.
  15. Wright, Nathan W., Heat transfer apparatus for burn-in board.
  16. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Liquid-cooled heat sink assemblies.
  17. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Liquid-cooled heat sink assemblies.
  18. Boday, Dylan J.; Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E.; Singh, Prabjit; Wertz, Jason T., Liquid-cooled, composite heat sink assemblies.
  19. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
  20. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
  21. Sauer, Rohn; Johnson, Scott; Garcia, Ediberto R., Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same.
  22. Johnson, Scott T.; Merhi, Shadi S., Semiconductor cooling apparatus.
  23. Koontz, Christopher R.; Chu, Charles; Vidaurri, Rosalio S., Semiconductor cooling apparatus.
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