초록 ▼

One or more pre-molded resin inserts ( 2 ) are placed in a metal mold and an outer molded resin body ( 3 ) is formed about the insert. The cooling speed is increased by: forming the insert with projections ( 21 ) to space a rear part of the insert from walls of the metal mold so that molten resin fl

One or more pre-molded resin inserts ( 2 ) are placed in a metal mold and an outer molded resin body ( 3 ) is formed about the insert. The cooling speed is increased by: forming the insert with projections ( 21 ) to space a rear part of the insert from walls of the metal mold so that molten resin flows into position about the insert; forming convex parts ( 22 ) on portions of the outer resin body adjacent the insert ( 2 ); forming recesses ( 23 ) in the molded outer housing, the recesses extending between the inserts and formed to receive fins of a front metal mold part; forming plural pin carrier inserts as one unit; or forming the inserts as layered bodies. This increases heat transfer from the outer body molten material to the cooler metal mold parts at regions adjacent to the pre-molded insert.

대표청구항 ▼

1. An electronic device comprising:a combined integrally molded product having a frame like shape;at least one electronic element located in a space within the frame like shape of said combined integrally molded product; andcover plates sealingly covering the frame like shape of said combined integr

1. An electronic device comprising:a combined integrally molded product having a frame like shape;at least one electronic element located in a space within the frame like shape of said combined integrally molded product; andcover plates sealingly covering the frame like shape of said combined integrally molded product;said combined integrally molded product comprising at least one pre-molded member, in which wiring terminals for connecting said electronic element with outside terminals are molded by a pre-molding resin, and an injection molding resin part by which said at least one pre-molded member is integrally injection molded by an injection molding resin, whereinsaid at least one pre-molded member is located to extend forwardly from the injection molding resin region in the combined integrally molded product to form mold clamp areas on opposite surfaces thereof to be clamped by molds upon injection molding, anda boundary between the pre-molding resin and the injection molding resin appears in only outer surface of said combined integrally molded product. 2. An electronic device according to claim 1, wherein said areas to be clamped by the molds upon injection molding comprise areas located outside the space within the frame like shape of said combined integrally molded product, and the boundary appears only in the outer surface of said combined integrally molded product. 3. An electronic device according to claim 1, wherein said at least one pre-molded member comprises a plurality of pre-molded members and a recess is formed between adjacent pre-molded members. 4. An electronic device according to claim 2, wherein said at least one pre-molded member comprises a plurality of pre-molded members and a recess is formed between adjacent pre-molded members.