초록 ▼

The invention is directed to a controlled environment processing chamber into which solvents, water and/or gases can be introduced for cleaning of an object. The process includes first applying a negative gauge pressure to the chamber to non-condensable gases and then introducing a solvent, solvent

The invention is directed to a controlled environment processing chamber into which solvents, water and/or gases can be introduced for cleaning of an object. The process includes first applying a negative gauge pressure to the chamber to non-condensable gases and then introducing a solvent, solvent mixture, water or gas in either a liquid or vapor state to remove soluble contaminants from the surface of an object being processed in the chamber. Further steps recover residual solvent or solution from the object and chamber. A secondary cleaning step directs a vapor state fluid at high velocity at a solid surface of the object to remove insoluble material left behind after the pretreatment step. A final series of steps recovers any loose impediments or residual liquid or vapor from the chamber and returns the chamber to atmospheric pressure for removal of the cleaned object.

대표청구항 ▼

1. A method of removing non-volatile solvent residue in a closed circuit processing system, said system including a chamber, a first fluid supply tank in communication with said chamber and a second fluid supply tank in communication with said chamber, said method comprising the steps of:placing an

1. A method of removing non-volatile solvent residue in a closed circuit processing system, said system including a chamber, a first fluid supply tank in communication with said chamber and a second fluid supply tank in communication with said chamber, said method comprising the steps of:placing an object to be processed in a chamber;sealing said chamber;evacuating non-condensable gasses from said chamber; to create an evacuated condition;introducing a first fluid into said evacuated chamber from a first fluid supply tank to clean said object contained in said chamber;recovering and retaining said first fluid from said chamber whereby said chamber is returned to said evacuated condition;heating a second fluid to a heated vapor state;directing said second fluid at a high velocity against the surface of said object to dislodge said non-volatile residue from the surface of said object;recovering and retaining said second fluid from said chamber whereby said chamber is returned to said evacuated condition;introducing a non-condensable gas to said chamber to return said chamber to atmospheric pressure; andopening said chamber and removing said object. 2. The method of removing non-volatile residue from an object in claim 1, wherein said step of reducing the pressure within said chamber comprises reducing the pressure to between atmospheric pressure and zero absolute pressure. 3. The method of removing non-volatile residue from an object in claim 1, wherein the method used in the step of introducing said first fluid into said chamber is selected from the group consisting of: liquid spray and liquid soak. 4. The method of removing non-volatile residue from an object in claim 1, wherein the fluid state of said first fluid during the step of introducing said first fluid into said chamber is selected from the group consisting of: vapor, gas-vapor mixture and aerosol spray. 5. The method of removing non-volatile residue from an object in claim 1, wherein said first fluid and said second fluid are the same fluids. 6. The method of removing non-volatile residue from an object in claim 1, wherein said second fluid is selected from the group consisting of: recycled air, clean air, nitrogen, carbon dioxide pellets and non-condensable gas. 7. The method of removing non-volatile residue from an object in claim 1, wherein said steps of recovering and retaining said first and second fluids from said chamber further comprise:withdrawing a first portion of said first and second fluids from said chamber in a liquid state; andwithdrawing the remaining portion of said first and second fluids from said chamber in a vapor state. 8. The method of removing non-volatile residue from an object in claim 7, wherein said step of withdrawing said first and second fluids in a vapor state further comprises:reducing the pressure in said chamber causing said first and second fluids to flash to form a vapor; andwithdrawing said vapor from said chamber. 9. The method of removing non-volatile residue from an object in claim 1, wherein said steps of recovering and retaining said first and second fluids includes filtering the first and second fluids to remove particles and other non volatile residue prior to condensing said first and second fluids to the liquid state. 10. The method of removing non-volatile residue from an object in claim 1, wherein said second fluid is directed at the surface of said object using a jet nozzle, said jet nozzle being cycled on and off to create alternating fluid jetting and low pressure environments at the surface of said object. 11. A method of removing non-volatile solvent residue in a closed circuit processing system, said system including a chamber and a fluid supply tank in communication with said chamber, said method comprising the steps of:placing an object to be processed in a chamber;sealing said chamber;evacuating non-condensable gasses from said chamber;introducing a fluid to said evacuated chamber from said fluid supply tank to clean said object contained in said chamber;recovering and retaining said fluid from said chamber;heating said fluid to a heated vapor state;directing said heated vapor state fluid at a high velocity against the surface of said object to dislodge said non-volatile residue from the surface of said object;recovering and retaining said fluid from said chamber;introducing a non-condensable gas to said chamber to return said chamber to atmospheric pressure; andopening said chamber and removing said object. 12. The method of removing non-volatile residue from an object in claim 11, wherein said step of reducing the pressure within said chamber comprises reducing the pressure to between atmospheric pressure and zero absolute pressure. 13. The method of removing non-volatile residue from an object in claim 11, wherein the method used for directing said heated vapor state fluid is selected from the group consisting of: liquid spray, liquid soak, vapor spray, gas-vapor mixture and aerosol spray. 14. The method of removing non-volatile residue from an object in claim 11, wherein said steps of recovering and retaining said fluid from said chamber further comprise:withdrawing a first portion of said fluid from said chamber in a liquid state; andwithdrawing the remaining portion of said fluid from said chamber in a vapor state. 15. The method of removing non-volatile residue from an object in claim 14, wherein said step of withdrawing said fluid in a vapor state further comprises:reducing the pressure in said chamber causing said fluid to flash to form a vapor; andwithdrawing said vapor from said chamber. 16. The method of removing non-volatile residue from an object in claim 11, wherein said heated vapor state fluid is directed at high velocity using a jet nozzle, said jet nozzle being cycled on and off to create alternating fluid jetting and low pressure environments at the surface of said object.