IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0322674
(2002-12-19)
|
우선권정보 |
KR-0010557 (2002-02-27); KR-0011372 (2002-03-04) |
발명자
/ 주소 |
- Lee, Sang Seok
- Park, Sang Ho
|
출원인 / 주소 |
|
대리인 / 주소 |
McKenna Long & Aldridge LLP
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
38 |
초록
▼
Method for fabricating an LCD having the liquid crystal dropping method applied thereto, including providing a first substrate and a second substrate having seals formed thereon, loading the first and second substrates into a bonding chamber, bonding the first and second substrates, setting the bond
Method for fabricating an LCD having the liquid crystal dropping method applied thereto, including providing a first substrate and a second substrate having seals formed thereon, loading the first and second substrates into a bonding chamber, bonding the first and second substrates, setting the bonded first and second substrates, venting the bonding chamber for applying a pressure to the first and second substrates, and unloading the first and second substrates having the pressure applied thereto.
대표청구항
▼
1. A method for fabricating a liquid crystal display (LCD) comprising:providing a first substrate and a second substrate having seals formed thereon;loading the first and second substrates into a bonding chamber;bonding the first and second substrates;setting the bonded first and second substrates;v
1. A method for fabricating a liquid crystal display (LCD) comprising:providing a first substrate and a second substrate having seals formed thereon;loading the first and second substrates into a bonding chamber;bonding the first and second substrates;setting the bonded first and second substrates;venting the bonding chamber for applying a pressure to the bonded first and second substrates; andunloading the first and second substrates having the pressure applied thereto. 2. The method as claimed in claim 1, wherein loading includes:providing upper and lower stages holding the first and second substrates by vacuum in the bonding chamber, respectively,pre-aligning the first and second substrates,positioning a glass receiver of a bonding machine under the second substrate held at the upper stage,subjecting respective stages holding the first and second substrates to electro static charge (ESC),evacuating the bonding chamber, andreturning the glass substrate to an original position. 3. The method as claimed in claim 1, wherein bonding includes varying the pressure in at least two stages. 4. The method as claimed in claim 1, wherein setting bonded first and second substrates includes one of directing light, applying heat to the sealant of photo, and thermosetting material, for setting the bonded substrates. 5. The method as claimed in claim 1, wherein the sealant includes main seals and setting seals, and setting the bonded first and second substrates includes setting the setting seals for setting the two substrates. 6. The method as claimed in claim 1, wherein the sealant includes main seals for sealing the liquid crystal dropped on the plurality of panels, a dummy seal for protecting the plurality of main seals, and setting seals for setting the bonded two substrates; and setting the bonded first and second substrates includes setting the setting seals for setting the first and second substrates. 7. The method as claimed in claim 6, wherein the setting seals are formed on one of a periphery of the substrate and between the panels. 8. The method as claimed in claim 1, wherein the sealant includes main seals for sealing the liquid crystal dropped on the plurality of panels, and a plurality of dummy seals for protecting the plurality of main seals respectively; and setting the bonded first and second substrates includes selling the dummy seals for setting the first and second substrates. 9. The method as claimed in claim 1, wherein venting the bonding chamber for applying a pressure to the first and second substrates includes:finishing moving an upper stage of the bonding chamber upward, and injecting one of gas and dry air into the bonding chamber. 10. The method as claimed in claim 1, wherein venting the bonding chamber for applying a pressure to the first and second substrates includes:injecting one of gas and dry air into the bonding chamber after moving an upper stage of the bonding chamber upward and before finishing the moving of the upper stage upward. 11. The method as claimed in claim 1, wherein venting the bonding chamber for applying a pressure to the first and second substrates includes:injecting one of gas and dry air into the bonding chamber at the same time while moving an upper stage upward of the bonding chamber. 12. The method as claimed in claim 11, wherein one of gas and dry air is blown through vacuum suction holes in th upper stage while the upper stage of the bonding chamber is moved upward. 13. The method as claimed in claim 1, wherein venting the bonding chamber for applying a pressure to the first and second substrates includes:starting injection of one of gas and dry air into the bonding chamber, andmoving an upper stage of the bonding chamber upward. 14. The method as claimed in claim 13, wherein moving the upper stage upward is carried out while one of gas and dry air is blown through vacuum suction holes in the upper stage. 15. The method as claimed in claim 1, wherein venting the bonding chamber for applying a pressure to the first and second substrates includes:injecting one of the gas and the dry air into the bonding chamber in two stages. 16. The method as claimed in claim 1, wherein venting the bonding chamber includes:applying a pressure until a gap between the two bonded substrates is below about 5 μm. 17. The method as claimed in claim 1, wherein liquid crystal is dropped on the first substrate. 18. The method as claimed in claim 1, wherein unloading includes:loading at least one of the first and second substrates to be bonded next on the upper or the lower stages, andunloading the set substrates. 19. A method for fabricating a liquid crystal display (LCD), comprising:loading first and second substrates having liquid crystal dropped thereon and seals formed thereon into a bonding chamber;bonding the first and second substrates;venting the bonding chamber for applying a pressure to the bonded first and second substrates; andunloading the first and second substrates. 20. The method as claimed in claim 19, further comprising aligning the first and second substrates before bonding the first and second substrates. 21. A method for fabricating a liquid crystal display (LCD), comprising:loading a first substrate, and second substrate having sealant coated thereon into a bonding chamber;bonding the first and second substrates;venting the bonding chamber for applying a pressure to the bonded first and second substrates; andunloading the set first and second substrates. 22. The method as claimed in claim 21, wherein the sealant includes main seals and setting seals, and setting the pressed first and second substrates includes setting the setting seals for setting the first and second substrates. 23. The method as claimed in claim 22, wherein a plurality of the setting seals are formed on a periphery of the substrate. 24. The method as claimed in claim 21, wherein the sealant includes main seals for sealing the liquid crystal dropped on the plurality of panels, a dummy seal for protecting the plurality of main seals, and setting seals for setting the bonded two substrates; and setting the pressed first and second substrates includes setting the setting seals for setting the first and second substrates. 25. The method as claimed in claim 24, wherein a plurality of the dummy seals are formed on an outer periphery of the plurality of main seals. 26. The method as claimed in claim 21, wherein the sealant includes main seals for sealing the liquid crystal dropped on the plurality of panels, and a plurality of dummy seals for protecting the plurality of main seals respectively, and setting the pressed first and second substrates includes setting the dummy seals for setting the first and second substrates. 27. The method as claimed in claim 26, wherein the dummy seals are set partly. 28. The method as claimed in claim 1, wherein setting the pressed first and second substrates includes:coating adhesive having a setting capability superior to the sealant on one of a cutting part and a periphery of the second substrate in forming the seals, andsetting the pressed substrate by the adhesive. 29. A method for fabricating a liquid crystal display (LCD), comprising:holding a first substrate at a lower stage within a bonding chamber;holding a second substrate at an upper stage within the bonding chamber, wherein sealant material is disposed between the held first and second substrates;evacuating the bonding chamber to a predetermined vacuum pressure;bonding the first and second substrates together within the evacuated bonding chamber via the sealant material;venting the evacuated bonding chamber after the bonding by injecting gas; andunloading the bonded first and second substrates from the vented bonding chamber. 30. The method as claimed in claim 29, further comprising raising the upper stage with respect to the bonded first and second substrates after the bonding. 31. The method as claimed in claim 30, wherein the injecting begins a fter raising of the upper stage begins. 32. The method as claimed in claim 30, wherein the injecting begins before raising of the upper stage is completed. 33. The method as claimed in claim 30, wherein the injecting occurs during raising of the upper stage. 34. The method as claimed in claim 30, wherein the injecting begins simultaneously with the raising of the upper stage. 35. The method as claimed in claim 30, wherein raising of the upper stage begins after the injecting begins. 36. The method as claimed in claim 30, wherein raising of the upper stage begins after the injecting is complete. 37. The method as claimed in claim 29, wherein the gas is nitrogen or clean dry air. 38. The method as claimed in claim 29, further comprising setting the sealant material after the bonding. 39. The method as claimed in claim 38, further comprising setting the sealant before the injecting. 40. The method as claimed in claim 38, further comprising setting the sealant after the injecting. 41. The method as claimed in claim 40, further comprising setting the sealant before the unloading.
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