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A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat

A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.

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1. A cooling apparatus comprising:a base having a peripheral surface, a heat contact surface and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;a plurality of heat pipes including a first

1. A cooling apparatus comprising:a base having a peripheral surface, a heat contact surface and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;a plurality of heat pipes including a first portion seated in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface; anda plurality of fins mounted on a second portion of the heat pipes, each fin having a peripheral edge which does not extend beyond the peripheral surface of the base. 2. The apparatus as defined in claim 1 wherein the heat pipes are L-shaped, each heat pipe having a first portion imbedded in the base. 3. The apparatus as defined in claim 2 wherein each heat pipe includes a second elongated portion and each second portion extends from the base substantially parallel to each other second portion. 4. The apparatus as defined in claim 1 wherein each fin is spaced apart from each other fin, each fin being parallel to the base. 5. The apparatus as defined in claim 1 wherein each heat pipe is spaced apart from each other heat pipe. 6. The apparatus as defined in claim 5 wherein the fins extend perpendicular to the heat pipes. 7. The apparatus as defined in claim 1 wherein the heat pipes are fixedly attached to the base and the fins are fixedly attached to the heat pipes. 8. A chassis comprising:a heat generating component mounted in the chassis;a base having a peripheral surface, a heat contact surface mounted on the heat generating component and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;a plurality of heat pipes having a first portion seated in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface; anda plurality of fins mounted on a second portion of the heat pipes, each fin having a peripheral edge which does not extend beyond the peripheral surface of the base. 9. The chassis as defined in claim 8 wherein each heat pipe is spaced apart from each other heat pipe. 10. The chassis as defined in claim 9 wherein the fins extend perpendicular to the heat pipes. 11. The chassis as defined in claim 8 wherein the heat pipes are fixedly attached to the base and the fins are fixedly attached to the heat pipes. 12. The chassis as defined in claim 8 wherein the heat pipes are L-shaped and the first portion of each heat pipe is imbedded in the base. 13. The chassis as defined in claim 12 wherein each second portion extends from the base substantially parallel to each other second portion. 14. The chassis as defined in claim 8 wherein each fin is spaced apart from each other fin and parallel to the base. 15. An information handling system comprising:a chassis;a microprocessor mounted in the chassis;a storage coupled to the microprocessor;a base having a peripheral surface, a heat contact surface mounted on the microprocessor and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;a plurality of heat pipes having a first portion seated in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface; anda plurality of fins mounted on a second portion of the heat pipes, each fin having a peripheral edge which is substantially coextensive with the peripheral surface of the base. 16. The system as defined in claim 15 wherein the heat pipes are L-shaped, each first portion being imbedded in the base. 17. The system as defined in claim 15 wherein each second portion extends from the base substantially parallel to each other second portion. 18. The system as defined in claim 15 wherein each fin is equally spaced apart from each other fin, each fin being parallel to the base. 19. A method of cooling a component comprising:providing a ch assis;mounting a heat generating component in the chassis;mounting a base on the heat generating component;providing the base with a peripheral surface, a heat contact surface mounted on the heat generating component and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;mounting a first portion of a plurality of heat pipes in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface; andmounting a plurality of fins on a second portion of the heat pipes. 20. The method as defined in claim 19:wherein each fin has a peripheral edge which is substantially co-extensive with the peripheral surface of the base. 21. The method as defined in claim 20 further comprising:forming each heat pipe in an L shape. 22. The method as defined in claim 21 further comprising:extending each second portion substantially parallel to each other second portion.