초록 ▼

A lamp ( 10 ) includes an optics module ( 12 ) and an electronics module ( 14, 60, 70 ). The optics module ( 10 ) includes a plurality of LEDs ( 76 ) arranged on a printed circuit board ( 18 ) and having a plurality of input leads, and a heat sink ( 22 ) having a conduit ( 40 ) for the input leads.

A lamp ( 10 ) includes an optics module ( 12 ) and an electronics module ( 14, 60, 70 ). The optics module ( 10 ) includes a plurality of LEDs ( 76 ) arranged on a printed circuit board ( 18 ) and having a plurality of input leads, and a heat sink ( 22 ) having a conduit ( 40 ) for the input leads. The plurality of LEDs ( 16 ) thermally communicate with the heat sink ( 22 ). The electronics module ( 14, 60, 70 ) is adapted to power the plurality of LEDs ( 16 ) through the input leads. The electronics module ( 14, 60, 70 ) has a first end ( 52 ) adapted to rigidly connect with the heat sink ( 22 ), and a selected electrical connector ( 50, 62, 72 ) arranged on a second end for receiving electrical power. The electronics module ( 14, 60, 70 ) further houses circuitry ( 80 ) arranged therewithin for adapting the received electrical power ( 82 ) to drive the LEDs ( 16 ).

대표청구항 ▼

1. A lamp comprising:an optical module including (i) a plurality of LEDs including LEDs for emitting light of first, second, and third different colors, and (ii) a heat sink thermally coupled to the LEDs, the heat sink having an electrical conduit for transmitting conditioned electrical power to the

1. A lamp comprising:an optical module including (i) a plurality of LEDs including LEDs for emitting light of first, second, and third different colors, and (ii) a heat sink thermally coupled to the LEDs, the heat sink having an electrical conduit for transmitting conditioned electrical power to the LEDs; andan electronics module receiving input electrical power and a lighting control signal, the electronics module including an output couple rigidly attaching to the optical module for delivering conditioned electrical power to the electrical conduit, the electronics module further including electrical conditioning circuitry for selectively electrically coupling the input electrical power to the output coupler based on the lighting control signal to selectively power to the LEDs of the first second and third colors to produce light of a color selected by the lighting control signal. 2. The lamp as set forth in claim 1, further including:a circuit board in thermal contact with the heat sink and on which the plurality of LEDs are arranged, the circuit board including electrical traces for electrically interconnecting the LEDs. 3. The lamp as set forth in claim 1, wherein the electronics module includes one of an Edison-type base and a GU-type base receiving the input electrical power. 4. The lamp as set forth in claim 1, wherein the electrical conditioning circuitry includes one of:a DMX network protocol controller;a CAN network protocol controller; anda PDA network protocol controller. 5. The lamp as set forth in claim 1, wherein the optical module further includes:an optical system arranged to cooperate with the LEDs to produce a light beam having a selected beam spread. 6. The lamp as set forth in claim 5, wherein the optical system includes a plurality of lenses corresponding to the plurality of LEDs. 7. The lamp as set forth in claim 1, wherein the output coupler of the electronics module is adapted to thermally communicate with the heat sink of the optical module. 8. A light emitting apparatus comprising:a heat sink having a first side, a second side opposite the first side, and conduit connecting the first side and the second side;a plurality of light emitting diodes disposed at the first side of the heat sink and in thermal communication therewith to heat sink the light emitting diodes; andan electronic module disposed at the second side of the heat sink and in thermal communication therewith to heat sink the electronic module, the electronic module converting electrical input power into a conditioned electrical power, the light emitting diodes receiving the conditioned electrical power from the electronic module via the conduit. 9. The light emitting apparatus as set forth in claim 8, further including:a PC board in which the plurality of light emitting diodes are arranged, the pc board disposed at the first side of the heat sink and in thermal communication therewith. 10. The light emitting apparatus as set forth in claim 9, further including:thermal tape bonding the pc board to the first side. 11. The light emitting apparatus as set forth in claim 8, wherein the second side of the heat sink is adapted to detachably connect with any one of a plurality of electronic modules. 12. The light emitting apparatus as set forth in claim 8, wherein the heat sink includes a radiating surface disposed between the first and second sides radiating heat away from the heat sink. 13. A method for retro-fitting a lamp fixture configure to receive an MR- or PAR-type lamp in an electrical receptacle with an LED-based lamp, the method comprising:selecting an LED-based lamp conforming at least to a diameter of the MR- or PAR-type lamp;selecting a selected electronic module including a connector configured to mate with the electrical receptacle of the lamp fixture, the selected electronic module being selected from amongst a plurality of electronics modules having different connectors and identical output couplers; andmechanically joining th e selected LED-based lamp and the selected electronic module to form an LED-based retro-fit unit by mating the output coupler with the LED-based lamp, the mechanical joining effectuating electrical connection therebetween. 14. The retro-fitting method as set forth in claim 13, further including:installing the LED-based retro-fit unit in the lamp fixture, the installing including mating the connector of the selected electronic module with the electrical receptacle of the lamp fixture. 15. The retro-fitting method as set forth in claim 13, wherein the mechanical joining is a detachable joining. 16. A modular lamp system comprising:an optics module having:a plurality of LEDs arranged on a printed circuit board, anda heat sink having an electrical conduit for conveying electrical power through the heat sink, the plurality of LEDs thermally communicating with the heat sink; anda plurality of electronics modules, each module including: (i) an output coupler adapted to mate with the heat sink to convey power to the plurality of LEDs via the electrical conduit of the heat sink, and (ii) an electrical power connector for receiving electrical power, the electronics modules each having the same output coupler but different electrical power connectors, each electronics module housing circuitry converting the electrical power received at its electrical power connector into a common output power delivered to the output coupler to drive the LEDs. 17. The modular lamp system as set forth in claim 16, wherein the optics module further includes:a lens system comprising at least one lens arranged to receive light generated by the LEDs for modifying a characteristic of the light. 18. The modular lamp system as set forth in claim 17, wherein the lens system further includes:an adjustment for selectively adjusting a separation between the at least one lens and the plurality of LEDs. 19. The modular lamp system as set forth in claim 16, wherein the optics module further includes:a thermal tape disposed between the printed circuit board and the heat sink for providing thermal contact therebetween. 20. The modular lamp system as set forth in claim 16, wherein the heat sink thermally communicates with an installed one of the plurality of electronics modules to heat sink the installed electronics module. 21. The modular lamp system as set forth in claim 20, further including:a thermally conductive disk inserted between the heat sink and the installed one of the plurality of electronics modules, the thermally conductive disk enhancing thermal communication therebetween. 22. The modular lamp system as set forth in claim 16, wherein the output coupler of each of the plurality of electronics modules detachably mates with the heat sink, the output coupler being selected from a group consisting of: (i) a snap fit, (ii) a twist lock, (iii) a spring-loaded connection, (iv) a connection secured using screws.