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A low-cost, fan assisting cooling device is disclosed and includes a heat mass, a thermal core, a vapor chamber, and a phase change liquid sealed in the vapor chamber at a low pressure. Waste heat in the thermal core boils the phase change liquid and converts it into a vapor that rises to contact su

A low-cost, fan assisting cooling device is disclosed and includes a heat mass, a thermal core, a vapor chamber, and a phase change liquid sealed in the vapor chamber at a low pressure. Waste heat in the thermal core boils the phase change liquid and converts it into a vapor that rises to contact surfaces of the vapor chamber where it is cooled down and converted back into the phase change liquid. A plurality of vanes and fins are connected with the heat mass and an air flow over the vanes and fins dissipates heat from the heat mass. Consequently, the heat mass is convection cooled by the air flow and evaporatively cooled by the boiling of the phase change liquid.

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1. A cooling device for dissipating heat from a component, comprising:a heat mass including a base, a chamber bore extending inward of the base, a boss symmetrically positioned about an axis of the heat mass and including a land and a threaded bore extending through the boss to the chamber bore;a th

1. A cooling device for dissipating heat from a component, comprising:a heat mass including a base, a chamber bore extending inward of the base, a boss symmetrically positioned about an axis of the heat mass and including a land and a threaded bore extending through the boss to the chamber bore;a thermal core connected with the base and including a stepped face that extends into the chamber bore and a mounting surface adapted to thermally connect the thermal core and the heat mass with the component;a plug including a plurality of plug fins that are spaced apart to define a plug slot between adjacent plug fins, a step face, a threaded neck extending from the step face and adapted to be threaded into the threaded bore until the step face is contact with the land, and a plug cavity formed in the threaded neck;a vapor chamber defined by the plug cavity, the chamber bore, and the stepped face;a phase change liquid in contact with a portion of the stepped face and sealed in the vapor chamber at a low pressure;a plurality of vanes connected with the heat mass and spaced apart to define a primary slot therebetween that extends to the heat mass, the vanes have a surface area that increases in a radially outward direction from the axis, the vanes including at least one secondary slot extending through a portion of each vane to define a plurality of fins in each vane,the vanes including a top face, an aerodynamically profiled inner wall including a first portion extending from the boss and terminating at a second portion that extends to the top face, the inner walls of the vanes defining a chamber that surrounds the boss, an outer wall having a surface profile that widens from the base to the top face and includes therebetween a smooth curved portion, a draft portion, and a smooth radially outward portion; andwherein heat is dissipated from the component by heat in the thermal core converting the phase change liquid from a liquid state to a vapor state and by an air flow through the chamber, the primary slots, the secondary slots, and the plug slots. 2. The cooling device as set forth in claim 1, wherein the heat mass is made from a material selected from the group consisting of aluminum, an aluminum alloy, copper, a copper alloy, an electrolytic copper, gold, a gold alloy, silicon substrate, and a ceramic material. 3. The cooling device as set forth in claim 1, wherein the thermal core is made from a material selected from the group consisting of copper, a copper alloy, silver, a silver alloy, silicon, gold, a gold alloy, graphite, a carbon fiber material, and a carbon fiber reinforced material. 4. The cooling device as set forth in claim 1 and further comprising a thermal interface material in contact with the mounting surface. 5. The cooling device as set forth in claim 1 and further comprising at least one fan positioned adjacent to the top face and positioned over the chamber so that an air flow generated by the fan produces the air flow through the chamber. 6. The cooling device as set forth in claim 5 and further comprising a mounting ring adapted to abut against the smooth radially outward portion and including a plurality of mounting fixtures adapted to receive a fastener that connects the fan with the mounting ring such that the fan is fixedly connected with the top face. 7. The cooling device as set forth in claim 6, wherein at least a portion of the top face is a substantially planar portion and the fan is seated on the substantially planar portion when the fan is connected with the top face. 8. The cooling device as set forth in claim 1 and further comprising a sealant material in contact with the threaded bore and the threaded neck and operative to seal the phase change liquid in the vapor chamber. 9. The cooling device as set forth in claim 8, wherein the sealant material thermally isolates the plug from the heat mass. 10. The cooling device as set forth in claim 1 and further comprising a gasket positioned between the l and and the step face and operative to seal the phase change liquid in the vapor chamber. 11. The cooling device as set forth in claim 1, wherein the phase change liquid is a material selected from the group consisting of water, a fluorocarbon, carbon tetrachloride, a dielectric fluid, and ethylene. 12. The cooling device as set forth in claim 1, wherein the stepped face has a profile selected from the group consisting of an arcuate profile and a slopped profile. 13. The cooling device as set forth in claim 1, wherein the vanes are tangentially oriented to a predetermined diameter of a circle centered about the axis. 14. The cooling device as set forth in claim 13, wherein the predetermined diameter is from about 3.0 millimeters to about 12.0 millimeters. 15. The cooling device as set forth in claim 1, wherein the vanes are inclined at an angle with respect to the axis. 16. The cooling device as set forth in claim 15, wherein the angle at which the vanes are inclined is from about 5.0 degrees to about 25.0 degrees. 17. The cooling device as set forth in claim 15, wherein the angle at which the vanes are inclined comprises a first angle from about 10.0 degrees to about 25.0 degrees, the first angle measured along the smooth radially outward portion, and a second angle from about 5.0 degrees to about 18.0 degrees measured along the smooth curved portion. 18. The cooling device as set forth in claim 1, wherein the boss has a profile selected from the group consisting of an arcuate profile and a sloped profile. 19. The cooling device as set forth in claim 1, wherein the primary slot further includes a first arcuate profile along the heat mass and the first arcuate profile is a portion of an arc having a radius from about 38.0 millimeters to about 45.0 millimeters. 20. The cooling device as set forth in claim 1, wherein the secondary slot extends to the heat mass and the secondary slot further includes a second arcuate profile along the heat mass and the second arcuate profile is a portion of an arc having a radius from about 31.0 millimeters to about 38.0 millimeters. 21. The cooling device as set forth in claim 1, wherein the first portion of the inner wall is a sloped surface and the second portion of the inner wall is a concave arcuate surface. 22. The cooling device as set forth in claim 1 and further comprising:a shroudless fan including a space frame for supporting the fan and for positioning the fan adjacent to the top face and over the chamber so that an air flow generated by the fan produces the air flow through the chamber, the space frame including a plurality of arms that span the top face, the arms include fingers at an end thereof, and the fingers are adapted to clamp the space frame to the smooth radially outward portion of the outer wall. 23. The cooling device as set forth in claim 1, wherein the thermal core has a profile selected from the group consisting of an arcuate profile and a sloped profile. 24. The cooling device as set forth in claim 1 and further comprising:a plurality of projections connected with and extending outward of a selected one of the mounting surface of the thermal core or the base of the heat mass; anda thermal interface material in contact with the mounting surface and positioned between the projections. 25. The cooling device as set forth in claim 1, wherein the thermal core and the heat mass are fixedly connected to each other. 26. The cooling device as set forth in claim 1, wherein the heat mass, the base, and the vanes are homogeneously formed. 27. The cooling device as set forth in claim 1, wherein the plug is made from a material selected from the group consisting of aluminum, an aluminum alloy, copper, a copper alloy, an electrolytic copper, gold, a gold alloy, silicon, graphite, a carbon fiber material, a carbon fiber reinforced material, and a ceramic material. 28. A system for dissipating heat, comprising:a cooling device including:a heat mass including a base, a chamber bore ext ending inward of the base, a boss symmetrically positioned about an axis of the heat mass and including a land and a threaded bore extending through the boss to the chamber bore;a thermal core connected with the base and including a stepped face that extends into the chamber bore and a mounting surface adapted to thermally connect the thermal core and the heat mass with the component;a plug including a plurality of plug fins that are spaced apart to define a plug slot between adjacent plug fins, a step face, a threaded neck extending from the step face and adapted to be threaded into the threaded bore until the step face is contact with the land, and a plug cavity formed in the threaded neck;a vapor chamber defined by the plug cavity, the chamber bore, and the stepped face;a phase change liquid in contact with a portion of the stepped face and sealed in the vapor chamber at a low pressure;a plurality of vanes connected with the heat mass and spaced apart to define a primary slot therebetween that extends to the heat mass, the vanes have a surface area that increases in a radially outward direction from the axis, the vanes including at least one secondary slot extending through a portion of each vane to define a plurality of fins in each vane,the vanes including a top face, an aerodynamically profiled inner wall including a first portion extending from the boss and terminating at a second portion that extends to the top face, the inner walls of the vanes defining a chamber that surrounds the boss, an outer wall having a surface profile that widens from the base to the top face and includes therebetween a smooth curved portion, a draft portion, and a smooth radially outward portion; andwherein heat is dissipated from the component by heat in the thermal core converting the phase change liquid from a liquid state to a vapor state and by an air flow through the chamber, the primary slots, the secondary slots, and the plug slots;a fan for generating the air flow through the chamber, the fan connected with the top face;a component including a component face; anda base mount for urging the mounting surface and the component face into contact with each other so that heat generated by the component is thermally communicated into the cooling device. 29. The system as set forth in claim 28 wherein the component is carried by a support unit selected from the group consisting of a socket, a substrate, and a PC board, and the base mount is removably connected with the support unit. 30. The system as set forth in claim 28 wherein the mounting surface further comprises:a plurality of projections connected with and extending outward of a selected one of the mounting surface of the thermal core or the base of the heat mass; anda thermal interface material in contact with the mounting surface and positioned between the projections. 31. The system as set forth in claim 28, wherein the fan is a shroudless fan including a space frame for supporting the fan and for positioning the fan adjacent to the top face and over the chamber so that the air flow generated by the fan produces the air flow into the chamber,the space frame including a plurality of arms that span the top face, the arms include fingers at an end thereof,and the fingers are adapted to clamp the space frame to the smooth radially outward portion of the outer wall.