초록 ▼

A method and structure for a semiconductor structure that includes a substrate having at least one integrated circuit heat generating structure is disclosed. The invention has at least one integrated circuit cooling device on the substrate adjacent the heat generating structure. The cooling device i

A method and structure for a semiconductor structure that includes a substrate having at least one integrated circuit heat generating structure is disclosed. The invention has at least one integrated circuit cooling device on the substrate adjacent the heat generating structure. The cooling device is adapted to remove heat from the heat generating structure. The cooling device includes a cold region and a hot region. The cold region is positioned adjacent the heat generating structure. The cooling device has one of a silicon germanium super lattice structure. The cooling device also has a plurality of cooling devices that surround the heat generating structure. The cooling device includes a thermoelectric cooler.

대표청구항 ▼

1. A method of creating an integrated thermoelectric cooling structure, said method comprising:forming a strained silicon layer over a substrate;patterning said strained silicon layer to form a mesa island;forming a superlattice structure on said substrate adjacent said mesa island;alternately dopin

1. A method of creating an integrated thermoelectric cooling structure, said method comprising:forming a strained silicon layer over a substrate;patterning said strained silicon layer to form a mesa island;forming a superlattice structure on said substrate adjacent said mesa island;alternately doping N-type and P-type regions within said superlattice structure;removing undoped regions of said superlattice structure; andforming a patterned metal conductor to connect N-type and P-type doped regions of said super lattice structure. 2. The method as in claim 1, wherein said process of forming a strained silicon layer comprises epitaxially growing said strained silicon layer. 3. The method as in claim 1, wherein said superlattice structure comprises a silicon germanium superlattice structure. 4. The method as in claim 1, wherein said alternately doping process comprises a series of masking and doping processes that individually create said N-type and P-type regions within said superlattice structure. 5. The method as in claim 1, wherein said substrate comprises an undoped SiGe superlattice structure. 6. The method as in claim 1, further comprising simultaneously forming a heat generating device adjacent N-type and P-type doped regions of said super lattice structure.