Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B23K-031/02
출원번호
US-0346637
(2003-01-17)
발명자
/ 주소
Johnson, William A.
출원인 / 주소
Donnelly Corporation
대리인 / 주소
Van Dyke, Gardner, Linn & Burkhart, LLP
인용정보
피인용 횟수 :
7인용 특허 :
43
초록▼
An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant e
An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.
대표청구항▼
1. A method for applying an electrical connector to a conductive element disposed on a surface of a glass sheet of a window, said method comprising:providing a glass sheet having a conductive element disposed on a surface thereof;providing an infrared radiative heating device comprising an infrared
1. A method for applying an electrical connector to a conductive element disposed on a surface of a glass sheet of a window, said method comprising:providing a glass sheet having a conductive element disposed on a surface thereof;providing an infrared radiative heating device comprising an infrared lamp and a reflector configured to direct radiant energy generated by said lamp at a target region;positioning an electrical connector at said conductive element of said glass sheet;positioning said heating device relative to said glass sheet such that said target region corresponds generally with the location of a solder layer between said electrical connector and said conductive element of said glass sheet; andattaching said electrical connector to said conductive element via radiation heating of said solder layer with said infrared radiative heating device. 2. The method of claim 1, wherein attaching said electrical connector to said conductive element comprises attaching said electrical connector to said conductive element via radiation heating of a layer of solder applied to a surface of said electrical connector. 3. The method of claim 1, wherein providing an infrared radiative heating device comprises providing an infrared radiative heating device comprising an infrared lamp and a shaped reflector configured to direct radiant energy generated by said lamp at a target region. 4. The method of claim 3, wherein said shaped reflector comprises one of a parabolic-shaped reflector, an ellipsoid-shaped reflector and a nozzle-shaped reflector. 5. The method of claim 3, wherein said shaped reflector defines first and second focal points, said infrared lamp being positioned generally at said first focal point and said target region being generally at said second focal point. 6. The method of claim 3, wherein said shaped reflector comprises a truncated shaped reflector. 7. The method of claim 6, wherein said infrared lamp is positioned at an interior of said truncated shaped reflector and said target region is positioned at an exterior of said truncated shaped reflector. 8. The method of claim 3, wherein said shaped reflector comprises a metallic material having a polished interior surface. 9. The method of claim 1 including limiting directing of heat to said glass sheet during said radiation heating of said solder layer. 10. The method of claim 9 including providing a shield generally surrounding said connector at said glass sheet for limiting directing of heat to said glass sheet. 11. The method of claim 10, wherein said shield functions to temporarily hold said connector at said glass sheet during said radiation heating. 12. The method of claim 11, wherein said shield includes a pivotable shield portion which pivots to release said shield from said connector after said radiation heating of said solder layer. 13. The method of claim 1, wherein positioning an electrical connector comprises positioning an electrical connector and said solder layer at a first surface of said glass sheet, and wherein positioning said heating device comprises positioning said heating device adjacent to a second surface of said glass sheet, said second surface being generally opposite said first surface. 14. The method of claim 13, wherein said heating device is operable to radiate energy through said glass sheet to said focal region at said first surface of said glass sheet. 15. The method of claim 14, wherein said glass sheet substantially transmits said infrared radiation and said solder layer substantially absorbs said infrared radiation. 16. The method of claim 14, wherein said infrared lamp is operable to generate infrared radiation having a wavelength of less than approximately 1200 nm. 17. The method of claim 1, wherein said infrared lamp is operable to generate infrared radiation having a wavelength of less than approximately 1200 nm. 18. The method of claim 1, wherein providing a glass sheet comprises providing a glass sheet at a modular window a ssembly plant. 19. A method for manufacturing and assembling a window assembly comprising:providing a glass sheet;providing an infrared radiative heating device comprising an infrared lamp and a shaped reflector configured to direct radiant energy from said lamp at a target region;positioning a window element in a holder;positioning said holder and said window element generally at said glass sheet;positioning said heating device relative to said holder such that said target region corresponds generally with the location of a layer of solder at one of said window element and said glass sheet;heating said solder layer via radiation heating of said solder layer with said infrared radiative heating device; andsubstantially limiting directing of said heat to said glass sheet via said holder. 20. The method of claim 19 including applying a conductive element on a surface of said glass sheet, wherein positioning said holder and said window element generally at said glass sheet comprises positioning said holder and said window element generally at said conductive element, said solder layer being at one of said window element and said conductive element. 21. The method of claim 20, wherein positioning a window element in a holder comprises positioning an electrical connector in a holder. 22. The method of claim 19 including:fabricating a glass sheet at a glass sheet fabrication plant; andtransporting said glass sheet from said glass sheet fabrication plant to a modular window assembly plant remote from said glass sheet fabrication plant. 23. The method of claim 22, wherein providing an infrared radiative heating device comprises providing an infrared radiative heating device at said modular window assembly plant remote from said glass sheet fabrication plant. 24. The method of claim 23 including assembling at least one of a seal, a hinge and a frame to said glass sheet at said modular window assembly plant. 25. The method of claim 19 including at least one of deactivating said infrared radiative heating device and removing said infrared radiative heating device from said holder and said glass sheet after heating said solder layer. 26. The method of claim 25 including cooling said solder layer after heating said solder layer. 27. The method of claim 26 including removing said holder from said window element after cooling said solder layer. 28. The method of claim 27, wherein removing said holder comprises pivoting a portion of said holder relative to another portion of said holder to release said holder from said window element. 29. The method of claim 19, wherein said infrared lamp is positioned at an interior of said shaped reflector and said target region is positioned at an exterior of said shaped reflector. 30. The method of claim 19, wherein said shaped reflector comprises a metallic material having a polished interior surface. 31. The method of claim 19, wherein said shaped reflector comprises one of a parabolic-shaped reflector, an ellipsoid-shaped reflector and a nozzle-shaped reflector. 32. The method of claim 19, wherein said shaped reflector comprises a truncated shaped reflector having an open end. 33. The method of claim 32, wherein said lamp is positioned generally within said truncated shaped reflector and said target region is positioned generally outside of said truncated shaped reflector and generally at said open end.
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