초록 ▼

A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures are coupled to structures and other

A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures are coupled to structures and other substructures by fixture bridges in the pre-assembled state. The substructures of the device are dissociated by eliminating the fixture bridges. The plural laminae are registered and bonded to form the device either before or after the fixture bridges are eliminated. The fixture bridges can be eliminated in a variety of ways, including vaporization by electrical current, chemical dissolution, or thermochemical dissociation. One method to selectively bond the laminae together is by microprojection welding. Microprojection welding comprises forming laminae with projections that extend from at least one planar surface of the lamina. Bonding together of laminae at selected regions is accomplished by placing the laminae between electrodes and passing a current through the electrodes. The laminae are bonded together selectively at the sites of the projections. Another method for bonding lamina involve diffusion soldering at reduced bonding pressures and temperatures to minimize flow restriction within or to features.

대표청구항 ▼

1. A method for making a device or a component of a device, comprising:providing plural laminae made from a non-thin film metal or metal alloy and stacked to define internal laminae positioned between external laminae, the plural laminae coupled together collectively defining a monolithic device or

1. A method for making a device or a component of a device, comprising:providing plural laminae made from a non-thin film metal or metal alloy and stacked to define internal laminae positioned between external laminae, the plural laminae coupled together collectively defining a monolithic device or a component of a device, at least one of the internal lamina having at least one structure, at least one substructure, and at least one fixture bridge, the structure and the substructure defining a space therebetween, and further with the substructure being coupled to the structure by the fixture bridge across the space; anddissociating the substructure by applying an electrical current across the fixture bridge sufficient to eliminate the fixture bridge. 2. The method according to claim 1 where at least one lamina includes plural substructures and at least one substructure is coupled to at least one other substructure by a fixture bridge. 3. The method according to claim 1 whereby dissociating the substructure from the structure by eliminating the fixture bridge comprises:placing a first electrode on a first substructure to be dissociated;contacting a structure or substructure coupled to the first substructure with a second electrode; andapplying a current through the first and second electrodes. 4. The method according to claim 3 where at least one of the first and second electrodes comprises a graphite tip. 5. The method according to claim 1 further, comprising:registering the plural laminae; andbonding the plural laminae one to another to form a monolithic device prior to or subsequent to eliminating at least one fixture bridge. 6. The method according to claim 5 whereby the method of bonding the plural laminae one to another to form a monolithic device is diffusion bonding, diffusion soldering, thermal brazing, adhesive bonding, thermal adhesive bonding, curative adhesive bonding, electrostatic bonding, microprojection welding, resistance welding, or combinations of these methods. 7. The method according to claim 1 whereby making the device further comprises utilizing fabrication technologies selected from the group consisting of additive freeform fabrication, rapid prototyping, microlamination, metal microlamination, and micromechanical fabrication. 8. The method according to claim 1 whereby the manner of forming at least one lamina is selected from the group consisting of micromachining, laser photoablation, chemical micromachining, electrochemical micromachining, and through-mask electrochemical micromachining. 9. The method according to claim 1 whereby the manner of forming at least one lamina includes lamina preparation. 10. The method according to claim 9 whereby the method of lamina preparation is selected from the group consisting of chemical etching, acid etching, electropolishing, oxide-free coating, and combinations thereof. 11. The method according to claim 1 where at least one of the lamina is made from a material selected from the group consisting of metals, metal alloys, polymers, ceramics, composites, stainless steel, carbon steel or phosphor bronze, and mixtures thereof. 12. The method according to claim 1 where at least one of the lamina is made from stainless steel, carbon steel or phosphor bronze. 13. The method according to claim 1 where the device is selected from the group consisting of micromechanical systems, microelectromechanical systems, miniature energy and chemical systems, microthermal systems, microthermomechanical systems, cryocoolers, alpha-Stirling coolers, heat pumps, compressors, thermal compressors, refrigerators, heat engines, valves, nozzled valves, ink-jet print-head valves, fuel cells, fuel combustors, fuel processors, and systems comprising one or more of these devices. 14. The method according to claim 1 where the device includes at least one high-aspect-ratio microchannel having a height-to-width ratio of at least 20:1. 15. The method according to claim 1 where the device is micro-s cale. 16. The method according to claim 1 where the device is meso-scale. 17. A method for making a micro- or meso-scale device or a component of such a device comprising:providing three or more laminae made from a non-thin film metal or metal alloy that coupled together collectively define a device or a component of a device;registering the laminae to define at least one internal lamina, positioned between a first and a second lamina, the at least one internal lamina having a structure and at least one substructure coupled to the structure or another substructure by at least one fixture bridge;bonding the laminae one to another to form a monolithic device or a component of a device; andeliminating the fixture bridge prior or subsequent to bonding the laminae by applying an electrical current across the fixture bridge. 18. The method according to claim 17 where the structure and substructure were formed by laser micromachining photochemical micromachining, electrochemical micromachining, or combinations of these methods. 19. The method according to claim 18 where bonding comprises microprojection welding. 20. The method according to claim 18 where bonding comprises diffusion soldering. 21. The method according to claim 20 where diffusion soldering comprises using layers comprising copper, silver, tin, indium and combinations and mixtures thereof. 22. A method for making an array of devices or an array of components of devices, comprising:providing plural laminae made from a non-thin film metal or metal alloy where at least one of the plural lamina has an array of at least two assemblies, each assembly in the array comprising at least one structure, at least one substructure, and at least one fixture bridge, such that at least one of the structures and at least one of the substructures define a space therebetween, and at least one substructure is coupled to at least one structure by at least one fixture bridge across the space;registering the laminae to define at least one internal lamina, positioned between a first and a second lamina; anddissociating at least one substructure of an internal lamina from the structure to which it is coupled by applying an electrical current across the fixture bridge sufficient to eliminate the fixture bridge, thereby making an array of devices or an array of components of devices. 23. The method of claim 22 where at least one of the assemblies includes plural substructures and at least one substructure is coupled to at least one other substructure by at least one fixture bridge. 24. The method according to claim 22 where dissociating the substructures from structures by eliminating fixture bridges comprises:placing an electrode on each substructure to be dissociated;contacting the structure, coupled to the substructure with a second electrode; andapplying a current through the electrodes. 25. The method according to claim 22 further comprising:registering the plural laminae; andbonding the plural laminae one to another to form an array of monolithic devices. 26. The method according to claim 25 where the manner of bonding the plural laminae one to another to form an array of monolithic devices is selected from the group consisting of diffusion soldering, diffusion bonding, thermal brazing, adhesive bonding, thermal adhesive bonding, curative adhesive bonding, electrostatic bonding, microprojection welding, resistance welding, and combinations thereof. 27. The method according to claim 22 where dissociating a substructure from the structure to which it is coupled by eliminating the fixture bridge(s) is performed before the plural laminae are registered and bonded. 28. The method according to claim 22 where the manner of forming the plural laminae is selected from the group consisting of additive freeform fabrication, rapid prototyping, microlamination, metal microlamination, and micromechanical fabrication. 29. The method according to claim 22 where the manner of forming the array of structures and coupled substructures is selected from the group consisting of micromachining, laser photoablation, chemical micromachining, electrochemical micromachining, and through-mask electrochemical micromachining. 30. The method according to claim 22 where forming the array of structures and coupled substructures includes lamina preparation. 31. The method according to claim 30 where the manner of lamina preparation is selected from the group consisting of chemical etching, acid etching, electropolishing, oxide-free coating, and mixtures thereof. 32. The method according to claim 22 where at least one of the lamina is made from a material selected from the group consisting of metals, polymers, ceramics, composites, stainless steel, carbon steel, phosphor bronze, metal alloys, and mixtures thereof. 33. The method according to claim 22 where the device is selected from the group consisting of micromechanical systems, microelectromechanical systems, miniature energy and chemical systems, microthermal systems, microthermomechanical systems, cryocoolers, Stirling cycle cryocoolers, heat pumps, compressors, thermal compressors, refrigerators, heat engines, valves, nozzled valves, ink jet print head valves, fuel cells, fuel combustors, fuel processors, and systems comprising one or more of these devices. 34. The method according to claim 22 where the device includes at least one high-aspect-ratio microchannel with a ratio of height-to-width of at least 20:1. 35. The method according to claim 22 where the size of the device is microscale. 36. The method according to claim 22 where the size of the device is meso-scale. 37. A method for making a device or a component of a device, comprising:providing plural laminae that coupled together collectively define a monolithic device or a component of a device, at least one of the lamina having at least one structure, at least one substructure, and at least one fixture bridge, the structure and the substructure defining a space therebetween, and further with the substructure being coupled to the structure by the fixture bridge across the space;registering the plural laminae;filling the space between the structure and the substructure with a fixative prior to eliminating at least one fixture bridge;dissociating the substructure by eliminating the fixture bridge;eliminating the fixative; andbonding the plural laminae one to another to form a monolithic device or a component of a device prior to or subsequent to eliminating at least one fixture bridge. 38. The method according to claim 37 where the fixative is a wax. 39. The method according to claim 37 where eliminating the fixative comprises heating the fixative. 40. The method according to claim 37 where the plural laminae define a subsection of a device, and further comprising registering the subsection with at least one additional lamina subsequent to eliminating the fixative. 41. The method according to claim 40 further comprising registering the subsection with plural additional lamina subsequent to eliminating the fixative. 42. A method for making an array of devices or an array of components of devices, comprising:providing plural laminae where at least one of the plural lamina has an array of at least two assemblies, each assembly in the array comprising at least one structure, at least one substructure, and at least one fixture bridge, such that at least one of the structures and at least one of the substructures define a space therebetween, and at least one substructure is coupled to at least one structure by at least one fixture bridge across the space;filling the space between each structure and its coupled substructure with a fixative prior to eliminating the fixture bridge;dissociating at least one substructure from the structure to which it is coupled by eliminating the fixture bridge(s), thereby making an array of devices or an array of components of devices, where dissociating each substructure from the structure to which it is coup led by eliminating the fixture bridge(s) is performed before the plural laminae are registered and bonded; andeliminating the fixative. 43. The method according to claim 42 wherein the fixative is wax. 44. The method according to claim 42 whereby the fixative is eliminated by heating. 45. A method for making a device or a component of a device, comprising:providing plural laminae that coupled together collectively define a monolithic device or a component of a device, at least one of the lamina having at least one structure, at least one substructure, and at least one fixture bridge made of a non-refractory material, the structure and the substructure defining a space therebetween, and further with the substructure being coupled to the structure by the fixture bridge across the space; anddissociating the substructure by eliminating the fixture bridge. 46. The method according to claim 45 where the fixture bridge consists essentially of at least one metal or metal alloy. 47. The method according to claim 45 where at least one lamina includes plural substructures and at least one substructure is coupled to at least one other substructure by a fixture bridge. 48. The method according to claim 45 whereby dissociating the substructure by eliminating at least one fixture bridge comprises applying an electrical potential across the fixture bridge sufficient to eliminate the fixture bridge. 49. The method according to claim 45 whereby dissociating the substructure from the structure by eliminating the fixture bridge comprises:placing a first electrode on a first substructure to be dissociated;contacting a structure or substructure coupled to the first substructure with a second electrode; andapplying a current through the first and second electrodes. 50. The method according to claim 49 where at least one of the first and second electrodes comprises a graphite tip. 51. The method according to claim 45 further, comprising:registering the plural laminae; andbonding the plural laminae one to another to form a monolithic device prior to or subsequent to eliminating at least one fixture bridge. 52. The method according to claim 51 whereby the method of bonding the plural laminae one to another to form a monolithic device is diffusion bonding, diffusion soldering, thermal brazing, adhesive bonding, thermal adhesive bonding, curative adhesive bonding, electrostatic bonding, microprojection welding, resistance welding, or combinations of these methods. 53. The method according to claim 51 further comprising:filling the space between the structure and the substructure with a fixative prior to eliminating at least one fixture bridge; andeliminating the fixative. 54. The method according to claim 53 where the fixative is a wax. 55. The method according to claim 53 where eliminating the fixative comprises heating the fixative. 56. The method according to claim 45 where at least one of the lamina is made from a material selected from the group consisting of metals, metal alloys, polymers, composites, stainless steel, carbon steel or phosphor bronze, and mixtures thereof. 57. The method according to claim 45 where the device is selected from the group consisting of micromechanical systems, microelectromechanical systems, miniature energy and chemical systems, microthermal systems, microthermomechanical systems, cryocoolers, alpha-Stirling coolers, heat pumps, compressors, thermal compressors, refrigerators, heat engines, valves, nozzled valves, inkjet print-head valves, fuel cells, fuel combustors, fuel processors, and systems comprising one or more of these devices. 58. The method according to claim 45 where the device or a component of a device is meso-scale. 59. A method for making a micro- or meso-scale device or a component of such a device comprising:providing three or more laminae that coupled together collectively define a device or a component of a device;registering the laminae to define at least one internal lamina, positioned between a first and a second lamina, the at least one internal lamina having a structure and at least one substructure coupled to the structure or another substructure by at least one fixture bridge made of a non-refractory material;bonding the laminae one to another to form a monolithic device or a component of a device; andeliminating the fixture bridge prior or subsequent to bonding the laminae by applying an electrical potential across the fixture bridge. 60. The method according to claim 59 further comprising:filling the space between a structure and a substructure with a fixative prior to eliminating the fixture bridge;dissociating at least one substructure from the structure to which it is coupled by eliminating the fixture bridge; andeliminating the fixative.