초록 ▼

A high temperature anemometer includes a pair of substrates. One of the substrates has a plurality of electrodes on a facing surface, while the other of the substrates has a sensor cavity on a facing surface. A sensor is received in the sensor cavity, wherein the sensor has a plurality of bondpads,

A high temperature anemometer includes a pair of substrates. One of the substrates has a plurality of electrodes on a facing surface, while the other of the substrates has a sensor cavity on a facing surface. A sensor is received in the sensor cavity, wherein the sensor has a plurality of bondpads, and wherein the bond pads contact the plurality of electrodes when the facing surfaces are mated with one another. The anemometer further includes a plurality of plug-in pins, wherein the substrate with the cavity has a plurality of trenches with each one receiving a plurality of plug-in pins. The plurality of plug-in pins contact the plurality of electrodes when the substrates are mated with one another. The sensor cavity is at an end of one of the substrates such that the sensor partially extends from the substrate. The sensor and the substrates are preferably made of silicon carbide.

대표청구항 ▼

1. A method for assembling an anemometer, comprising:providing a cantilever beam having a plurality of bond pads on one side thereof:providing a first substrate and a second substrate, each said substrate being of the same material as said cantilever beam;etching said first substrate with a pluralit

1. A method for assembling an anemometer, comprising:providing a cantilever beam having a plurality of bond pads on one side thereof:providing a first substrate and a second substrate, each said substrate being of the same material as said cantilever beam;etching said first substrate with a plurality of trenches and a sensor cavity;passivating both of said substrates;disposing a plurality of electrodes on said second substrate;positioning said cantilever beam in said sensor cavity;positioning a plug-in pin in each of said trenches; andmating said first substrate with said second substrate so that said plug-in pins and said bond pads are in intimate contact with said plurality of electrodes. 2. The method according to claim 1, further comprising:providing a housing having a lengthwise package cavity therethrough and at least one bore that extends into said package cavity;positioning said mated substrates into said package cavity; andinserting a fastener into said bore to secure said mated substrates in said housing. 3. The method according to claim 2, further comprising:placing a shim along with said mated substrates in said package cavity, such that said shim is between said mated substrates and said fastener. 4. The method according to claim 3, wherein said cantilever beam extends outwardly from one end of said housing. 5. The method according to claim 4, further comprising:installing said housing into an engine wall such that only said cantilever beam extends beyond said engine wall. 6. The method according to claim 5, further comprising:connecting diagnostic equipment to said plurality of plug-in pins.