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A method is provided for fabricating a substrate for optics, electronics, or optoelectronics. This method includes the steps of transferring a seed layer to a support layer, depositing a working layer onto the seed layer to form a composite substrate and detaching the working layer and the seed laye

A method is provided for fabricating a substrate for optics, electronics, or optoelectronics. This method includes the steps of transferring a seed layer to a support layer, depositing a working layer onto the seed layer to form a composite substrate and detaching the working layer and the seed layer from the support to form a substrate. Advantageously, the support substrate comprises a material having a thermal expansion value of about 0.7 to 3 times the coefficient value of the working layer.

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1. A method for fabricating a substrate for optics, electronics, or opto-electronics, which method comprises:transferring a seed layer on to a support substrate;depositing a working layer on the seed layer to form a composite substrate; anddetaching the seed layer and the working layer from the comp

1. A method for fabricating a substrate for optics, electronics, or opto-electronics, which method comprises:transferring a seed layer on to a support substrate;depositing a working layer on the seed layer to form a composite substrate; anddetaching the seed layer and the working layer from the composite substrate to form a substrate;wherein the support substrate comprises a material having a thermal expansion value of about 0.7 to 3 times the coefficient value of the working layer. 2. The method of claim 1, wherein the seed layer is transferred onto the support layer by molecular adhesion in an adhesion interface. 3. The method of claim 1, wherein the working layer is deposited on the seed layer by chemical vapor deposition, high temperature chemical vapor deposition, hydride vapor phase epitaxy, epitaxy, metal organic chemical vapor deposition, or molecular beam epitaxy. 4. The method of claim 1, which further comprises detaching the seed layer and the working layer from the composite substrate by the application of stress at the adhesion interface, wherein the stress is selected from the group consisting of mechanical stress, thermal stress, electrostatic stress and laser irradiation stress, or any combination thereof. 5. The method of claim 1, wherein the working layer is gallium nitride. 6. The method of claim 1, wherein the seed layer comprises a material from the group consisting of sapphire, silicon carbide, zinc oxide, silicon, gallium nitride, neodymium gallate, and lithium gallate. 7. The method of claim 6, wherein the seed layer is Si having a thickness less than about 3000 Å. 8. The method of claim 1, wherein the support layer comprises a material from the group consisting of silicon carbide, aluminum nitride, silicon, and sapphire. 9. The method of claim 1, wherein the seed layer and the support layer have substantially the same chemical composition. 10. The method of claim 1, wherein the working layer is deposited onto the seed layer to a thickness of less than about 10 microns. 11. The method of claim 1, wherein the method further includes applying an intermediate layer between the seed layer and the support. 12. The method of claim 11, wherein the intermediate layer is a bonding layer or an insulating layer. 13. The method of claim 1, wherein the seed layer includes a crystal lattice parameter sufficient for the epitaxial growth of the working layer onto the seed layer such that the working layer has a dislocation concentration less than about 10 7 /cm 2 . 14. The method of claim 1, further comprising providing a source substrate including the seed layer and a weakened zone; and detaching the seed layer from the source substrate at the weakened zone. 15. The method of claim 14, wherein the weakened zone comprises implanted atomic species at a depth that corresponds to the thickness of the source substrate. 16. The method of claim 14, wherein the seed layer is detached from the source substrate by application of heat treatment, mechanical stress, chemical etching, or a combination thereof. 17. The method of claim 1, wherein the seed layer is prepared to receive the working layer, the preparation including polishing, annealing, smoothing, oxidation, and etching. 18. The method of claim 1, further comprising removing the support substrate such that it remains in a condition sufficient for recycling and reusing the support substrate. 19. A method for fabricating a substrate for optics, electronics, or opto-electronics, which method comprises:transferring a seed layer onto a support substrate;depositing a working layer on the seed layer to form a composite substrate; anddetaching the seed layer and the working layer from the composite substrate;wherein the seed layer includes a crystal lattice parameter sufficient for epitaxial growth of the working layer having a dislocation parameter of less than about 10 7 /cm 2 . 20. The method of claim 19, wherein the seed layer is monocrystalline silicon carbide, the support substrate is polycrystalline silicon carbide, and the working layer is gallium nitride. 21. The method of claim 19, further comprising a source substrate including the seed layer and a weakened zone; and further wherein the seed layer is detached from the source substrate at the weakened zone. 22. The method of claim 21, wherein the weakened zone comprises implanted atomic species at a depth that corresponds to the thickness of the source substrate. 23. The method of claim 19, further comprising removing the support substrate such that it remains in a condition sufficient for reuse. 24. The method of claim 19, further comprising applying an intermediate layer between the seed layer and the support. 25. The method of claim 24, wherein the intermediate layer is a bonding layer or an insulating layer.