초록 ▼

An enclosure such as a notebook computer chassis in which the thermo-siphon devices are embedded in the skin of the enclosure is disclosed. The thermo-siphon devices include heat pipes. The thermo-siphon devices are use to absorb the heat dissipated by a heat source and dissipate it at a remote loca

An enclosure such as a notebook computer chassis in which the thermo-siphon devices are embedded in the skin of the enclosure is disclosed. The thermo-siphon devices include heat pipes. The thermo-siphon devices are use to absorb the heat dissipated by a heat source and dissipate it at a remote location.

대표청구항 ▼

1. A device enclosure comprising:a chassis including a top wall and an opposing bottom wall; anda thermo-siphon device formed as an integral part of the top wall of the chassis, the thermo-siphon device including a vaporizing end coupled to a first metal plate, and a condensing end coupled to a seco

1. A device enclosure comprising:a chassis including a top wall and an opposing bottom wall; anda thermo-siphon device formed as an integral part of the top wall of the chassis, the thermo-siphon device including a vaporizing end coupled to a first metal plate, and a condensing end coupled to a second metal plate, the top wall partially encloses the thermo-siphon device. 2. The device enclosure of claim 1, wherein the device is an electronic device. 3. The device enclosure of claim 2, wherein the device enclosure is a computer chassis. 4. The device enclosure of claim 1, wherein the device is a non-electronic device. 5. The device enclosure of claim 1, wherein the top wall is fabricated from a metallic material. 6. The device enclosure of claim 1, wherein the thermo-siphon device is embedded in a cavity of the wall. 7. The device enclosure of claim 6, wherein the cavity is created during a fabrication process of the wall. 8. The device enclosure of claim 1, wherein a portion of the thermo-siphon device is exposed to an interior of the enclosure. 9. The device enclosure of claim 1, wherein a portion of the thermo-siphon device is exposed to a heat sink. 10. The device enclosure of claim 1, wherein the thermo-siphon device is secured to a wall cavity through the means selected from the group consisting of a support provided by cavity walls, a thermal epoxy, and an interference fit with the wall cavity. 11. A system comprising:a chassis including a top wall and an opposing wall; anda thermo-siphon device formed as an integral part of the top wall of the chassis, the thermo-siphon device including a vaporizing end coupled to a first metal plate, and a condensing end coupled to a second metal plate, the top wall partially encloses the thermo-siphon device. 12. The system of claim 11, wherein the chassis is a computer chassis. 13. A computer chassis comprising:a chassis including a top wall and an opposing wall; anda thermo-siphon device formed as an integral part of wall of the chassis, the thermo-siphon device including a vaporizing end coupled to a first metal plate, and a condensing end coupled to a second metal plate, the top wall partially encloses the thermo-siphon device. 14. The computer chassis of claim 13, wherein the computer chassis is a notebook computer base.