초록 ▼

A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a

A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for maintaining a controlled temperature environment inside of the component.

대표청구항 ▼

1. A method of thermally controlling a WDM multiplexer module, the method comprising the steps of:maintaining a first stage controlled temperature environment inside the module,maintaining a second stage controlled temperature environment in at least a portion of the inside of the module;locating at

1. A method of thermally controlling a WDM multiplexer module, the method comprising the steps of:maintaining a first stage controlled temperature environment inside the module,maintaining a second stage controlled temperature environment in at least a portion of the inside of the module;locating at least one heat generating electrical component in the first stage controlled temperature environment, andlocating at least one optical component in the second stage controlled temperature environment,wherein temperature variations in the second stage controlled temperature environment are smaller than temperature variations in the first stage controlled temperature environment. 2. A method as claimed in claim 1, wherein at least one optical component comprises at least one laser source, and the source temperature of the laser source is substantially governed by the second stage controlled temperature environment. 3. A method as claimed in claim 1 or wherein the method further comprises, during start-up or re-start of the module, the step of sequentially switching on the electrical components based on operating temperature specifications and heat generating characteristics of the electrical components to facilitate creation of the first stage controlled temperature environment. 4. A method as claimed in claim 1 or wherein the maintaining of the first and second stage controlled temperature environments comprises utilising at least one heat pipe in communication with a heat sink structure. 5. A method as claimed in claim 4, wherein the heat pipe has a working fluid characterised by a freezing temperature above −400° C., whereby a discontinuity in heat transfer to and from the heat sink structure is created for temperatures below the freezing temperature of the working fluid in the heat pipe for reducing heat loss from the inside of the module. 6. A method as claimed in claim 5, wherein the freezing temperature is about zero ° C. 7. A method of thermally controlling a WDM multiplexer module, the method comprising the steps of:maintaining a first stage controlled temperature environment inside the module, andmaintaining a second stage controlled temperature environment in at least a portion of the inside of the module,wherein temperature variations in the second stage controlled temperature environment are smaller than temperature variations in the first stage controlled temperature environment,and, during start-up or re-start of the module, sequentially switching on electrical components of the module based on operating temperature specifications and heat generating characteristics of the electrical components to facilitate creation of the first stage controlled temperature environment. 8. A method of thermally controlling a WDM multiplexer module, the method comprising the steps of:maintaining a first stage controlled temperature environment inside the module, andmaintaining a second stage controlled temperature environment in at least a portion of the inside of the module,wherein temperature variations in the second stage controlled temperature environment are smaller than temperature variations in the first stage controlled temperature environment,wherein the maintaining of the first and second stage controlled temperature environments comprises utilizing at least one heat pipe having a working fluid characterized by a freezing temperature above −40° C., whereby a discontinuity in heat transfer to and from a heat sink structure of the module is created for temperatures below the freezing temperature of the working fluid in the heat pipe for reducing heat loss from the inside of the module.