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Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H04M-007/00
출원번호 US-0304795 (2002-11-26)
발명자 / 주소
  • Laetsch, Erich K.
출원인 / 주소
  • Anacapa Technology, Inc.
대리인 / 주소
    Westman, Champlin & Kelly, P.A.
인용정보 피인용 횟수 : 5  인용 특허 : 56

초록

A design for passively cooled telecommunication repeater housings for use in wire transmission in the local loop outside plant provides mounting slots for repeaters and voltage protector assemblies disposed and arranged such that a repeater and its voltage protector assembly can be removed independe

대표청구항

1. A passively cooled repeater housing for use in a telecommunication network's wire transmission local loop outside plant to house a plurality of field replaceable, plug-in, standardized repeater modules that generate waste heat and at least one field replaceable, plug-in voltage protector assembly

이 특허에 인용된 특허 (56)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  2. Lndqvist Gsta B. (Johanneshov SEX), Apparatus for cooling telecommunications equipment in a rack.
  3. Gates Frank Vernon, Apparatus for heat removal from a PC card array.
  4. Mauclere Bernard (Maurepas FRX) Jamet Daniel (Nozay FRX), Box for transmission line repeaters.
  5. Azar Kaveh (Westwood MA), Circuit pack cooling using perforations.
  6. Hayes Hasler R.,CAX ; Daniels Michael H.,CAX ; Atkinson John C.,CAX, Circuit packs and circuit pack and shelf assemblies.
  7. Bulante Roderick A. ; Duncan Gary L. ; Conwell Troy A. ; Quan Dennis ; Stafford John P. ; Lee Sung H., Composite heat sink/support structure.
  8. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.
  9. Daikoku Takahiro (Ushiku JPX) Ashiwake Noriyuki (Tsuchiura JPX) Kawasaki Nobuo (Ibaraki JPX) Zushi Shizuo (Hadano JPX), Cooling apparatus of electronic devices.
  10. Parmerlee James K. (Indianapolis IN) Tague B. Dale (Indianapolis IN), Cooling arrangement for plug-in module assembly.
  11. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  12. Saito Yoshio,JPX, Electronic apparatus having heat dissipating arrangement.
  13. Kuroda Yoshikatsu,JPX, Electronic apparatus having printed circuit board module accommodated in case thereof.
  14. Bitller Jean-Pierre (Plaisir FRX) Faucher Pascal (Longjumeau FRX) Hang-Hu Monique (Sainte Genevieve des Bois FRX) Pelet Andr (Maurepas FRX), Electronic circuit housing.
  15. Schwehr Gregory D. (Milwaukee WI) Zibolski Richard E. (Menomonee Falls WI), Electronic circuit module with improved cooling.
  16. Ono Hideyo (Hyogo JPX) Yoshitake Kunitoshi (Hyogo JPX) Kakuta Nobuyuki (Hyogo JPX), Electronic device housing with temperature management functions.
  17. Hutchison, Randall D.; Schiffbauer, Robert, Electronic equipment enclosure.
  18. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  19. Beavers Roger L., Enclosure for high-density subscriber line modules.
  20. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  21. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  22. Jones Raymond D. (Cheam GB2), Excess voltage arrester.
  23. Gesklin Julio ; Kulp John H. ; Krempels Alan C., Heat sink.
  24. Sewell Mark W. (Fredericksburg VA), Heat sink device for electronics modules packaged in cylindrical casings.
  25. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  26. Feng Hsiu-Mei,TWX, Heat-radiating structure of power adapter.
  27. Goss Steven R. (Tucson AZ) Taggart Owen H. (Tucson AZ), High density electronics package having stacked circuit boards.
  28. Jakob Gert (Stuttgart DEX) Bentz Willy (Sachsenheim DEX) Hussmann Dieter (Steinheim DEX) Schiefer Peter (Abstatt DEX) Karr Dieter (Tiefenbronn DEX), Housing for an electronic circuit.
  29. Eggert Hans-Joachim (Karlsfed DT) Oberberger Otto (Gilching DT) Zenkert Heinrich (Munich DT), Housing for electrical communications and measuring devices.
  30. McCann Andrew F., Housing for electronic devices including internal fins for volumetric cooling.
  31. Bentz Willy (Sachsenheim DEX) Gansert Willi (Kornwestheim DEX), Housing for receiving electric control devices, in particular for motor vehicles.
  32. Pelet Andr (Maurepas FRX) Cachot Jacques (Saint Michel sur Orge FRX), Housing for submersible equipment.
  33. Bitller Jean-Pierre (Orsay FRX) Pelet Andr (Maurepas FRX) Wirth Guy (Paris FRX) Hang-Hu Monique (Saintry sur Seine FRX), Housing for underwater electronic circuits.
  34. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  35. Laetsch Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  36. Hughes Richard P.,CAX ; Zapach Trevor G.,CAX ; Lawless Patrick T.,CAX, Mounting structure for heat conductively supporting a planar electric device.
  37. Hoffman Bruce E. (Raleigh NC) Berkley S. Thomas (Raleigh NC), Multi-terminal arrestor holder and connector module.
  38. Zurek Michael W., Multiple integrated service unit for communication system.
  39. Davis Arthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  40. Davis Aurthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  41. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX, Packaging system for thermally controlling the temperature of electronic equipment.
  42. Benson ; Wayne J. ; Torburn ; Roy B. ; Tweed ; Donald G., Pluggable protector holder for surge arrestor gas tubes.
  43. Espinoza, H. Cesar, Rack assembly for plug-in modules.
  44. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  45. George E. Paul (Saratoga CA) Lincoln Robert Nelson (Cupertino CA), Repeater housing assembly.
  46. Petrangelo Amedio D. (Webster NY), Reusable seal with thermal expansion compensation.
  47. Naedel Richard G. (Rockville MD) Bogdan Francis J. (Baltimore MD) Richardson Michael (Annapolis MD) Rosenberger Keith (Baltimore MD), Severe environment enclosure with thermal heat sink and EMI protection.
  48. Takahashi Yoshihiro (Kawasaki JPX) Okuyama Katsuo (Kawasaki JPX) Matsukuma Yutaka (Hatano JPX), Shelf unit for electronic communication devices.
  49. Bellino Richard Anthony ; Bowers Thomas Earl ; Harrison William Thomas ; Harvey William Joseph ; Maass Paul Edwin ; Miller Joel Everett ; Miran Reynaldo Olinares, System for providing air flow control and EMC shielding of front panels of computers and similar electronic equipment.
  50. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  51. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  52. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.
  53. Van Gaal Adrianus P. (Kanata CAX) Lommen Joseph J. (Nepean CAX) Osborne Brian T. (Kanata CAX) Coleman Michael J. (Woodlawn CAX) Contardo Remo (Ottawa CAX) Kielstra Peter J. (Kanata CAX), Telecommunications equipment.
  54. Roy Christopher E. (Plymouth MA), Telecommunications switch chassis having housing with front and rear compartments divided by interior partition and remo.
  55. Chu Richard C. (Poughkeepsie NY), Thermal conduction module.
  56. Austin Thomas A. ; Meeker Matthew K. ; Greer Stephen S. ; Green Dwayne C., Weatherproof design for remote transceiver.

이 특허를 인용한 특허 (5)

  1. Ayres, III, John W.; Kruse, Grant J.; McCleary, Jacob D., Cable seal apparatus and techniques for outside plant telecommunications housings.
  2. McCleary, Jacob D., Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment.
  3. Yang, Tai-Her, Heat dissipater having heat conductive rib with interval forming as flow guide hole and applied in electric luminous body.
  4. Ayres, III, John Wise; Kruse, Grant Joseph; McCleary, Jacob Daniel, Modular heat sinks for housings for electronic equipment.
  5. Ayres, III, John Wise; Kruse, Grant Joseph, Modular housing system for outside plant telecommunications equipment.
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