In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field i
In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.
대표청구항▼
1. A plate bonding method for producing a bonded plate having an adhesive film sandwiched between first and second plates, the bonding method comprising: an adhesive supplying step of supplying adhesive on at least one of the first and second plates; an overlapping step of overlapping the first and
1. A plate bonding method for producing a bonded plate having an adhesive film sandwiched between first and second plates, the bonding method comprising: an adhesive supplying step of supplying adhesive on at least one of the first and second plates; an overlapping step of overlapping the first and second plates by bringing the first and second plates closer to each other with the adhesive in between to produce the bonded plate; and an electric field producing step of producing an electric field in an interspace between the first and second plates during a period in the overlapping step. 2. A plate bonding method according to claim 1 wherein the bonding method further comprises a spreading step of spreading the adhesive between the first and second plate after the overlapping step. 3. A plate bonding method according to claim 2 wherein the spreading step includes one of an operation for leaving the first and second plates one on the other with the adhesive sandwiched between the first and second plates, an operation of compressing the first and second plates with the adhesive sandwiched therebetween, and an operation of spinning the first and second plates with the adhesive sandwiched therebetween. 4. A plate bonding method according to claim 1 wherein the adhesive supplying step comprises a first operation of forming a dotted adhesive layer on one of the first and second plates, the dotted adhesive layer including dot regions of the adhesive which are separate from one another. 5. A plate bonding method according to claim 4 wherein the dot regions formed, by the first operation of the adhesive supplying step are arranged in an imaginary circle on the second plate, and the adhesive supplying step further comprises a second operation of forming an annular adhesive layer on the first plate. 6. A plate bonding method according to claim 1 wherein the adhesive supplying step comprises an operation of forming an annular adhesive layer on one of the first and second plates. 7. A plate bonding method according to claim 1 wherein, in the electric field producing step, the electric field is produced locally in a pattern conforming to a pattern of the adhesive formed on one of the first and second plates. 8. A plate bonding method according to claim 1 wherein the adhesive supplying step comprises an operation of forming an annular adhesive layer on the first plate which is a first substrate disc and forming a dotted adhesive layer on the second plate which is a second substrate disc, the electric field producing step comprises a first sub-step of applying a voltage between a first electrode for the first substrate disc and a second electrode for the second substrate disc, a second sub-step of reducing the voltage between the first and second electrode to a value lower than a predetermined level, and a third sub-step of removing the first and second electrodes, respectively, from the first and second substrate discs after the second sub-step. 9. A plate bonding method according to claim 1 wherein the electric field producing step includes an operation of putting first and second conductors, respectively, in contact with confronting surfaces of the first and second plates to apply a voltage between the first and second conductors during a predetermined period in the operation of bringing the first and second plates closer together in a confronted state in which the confronting surfaces of the first and second plates confront each other. 10. A plate bonding method according to claim 1 wherein the first plate is a first substrate disc having a reflective film, the second plate is a second substrate disc having a reflective film, the bonded plate is an optical disc, and the electric field producing step includes an operation of directly applying a voltage between the reflective films of the first and second substrate discs when contact is established between the reflective films through the adhesive. 11. A plate bonding method according to c laim 10 wherein the adhesive supplying step comprises an operation of forming a dotted adhesive layer on one of the first and second substrate discs, the dotted adhesive layer including dot regions of the adhesive which are separate from one another, and the application of the voltage between the reflective films of the first and second substrate discs in the electric field producing step is started when none of the dot regions are connected between the reflective films, and ended after all the dot regions of the dotted adhesive layer are connected between the reflective films. 12. A plate bonding method according to claim 1 wherein the electric field producing step comprises an operation of applying an alternating voltage between the first and second plates. 13. A plate bonding method according to claim 1 wherein the electric field producing step comprises an operation of applying a dc voltage between the first and second plates. 14. A disc bonding method for producing a bonded optical disc having an adhesive film sandwiched between first and second discs, the bonding method comprising:an adhesive supplying step of supplying adhesive on at least one of the first and second discs;an overlapping step of overlapping the first and second discs by bringing the first and second discs closer to each other with the adhesive in between, to produce the bonded optical disc; andan electric field producing step of producing an electric field in an interspace between the first and second discs, during a period in the overlapping step, to deform the adhesive into a tapered form with a force of the electric field to reduce an initial contact area, and thereby to prevent voids from being formed between the first and second discs.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (12)
Shofner Gordon G. (Louisville KY) Perry William N. (Sonora CA), Dielectric-heated, continuous layup laminated veneer lumber press.
Mori Yoshiaki,JPX ; Aoki Yasutsugu,JPX ; Miyakawa Takuya,JPX, Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent.
Gerigk Reinhard,DEX ; Sichmann Eggo,DEX ; Muecke Michael,DEX, Method for preventing bubbles or small bubbles when connecting substrate parts of optical data carriers by means of an adhesive.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.