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Hot-melt adhesive composition comprising acidic polymer and basic polymer blends 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08L-033/02
  • C08L-039/00
출원번호 US-0809712 (2001-03-15)
발명자 / 주소
  • Stark, Peter A.
  • Sherman, Audrey A.
  • Everaerts, Albert I.
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Leon Andrew J.
인용정보 피인용 횟수 : 23  인용 특허 : 38

초록

A hot-melt adhesive composition comprises a blend of at least one acidic polymer and at least one basic polymer. At least one of the polymers is a hot-melt adhesive. Thermally reversible crosslinks are formed between each of the two polymers. These crosslinks impart cohesive strength to the applied

대표청구항

1. A hot-melt pressure sensitive adhesive composition, comprising a blend of:an acidic copolymer derived from a first group of monomers comprising at least one acidic monomer; anda basic copolymer derived from a second group of monomers comprising at least one basic monomer,wherein at least one of t

이 특허에 인용된 특허 (38)

  1. Husman, James R.; Kellen, James N.; McCluney, Rebecca E.; Tumey, Michael L., Acrylate copolymer pressure-sensitive adhesive composition and sheet materials coated therewith.
  2. Enanoza Rudyard M. (Woodbury MN), Acrylate hot melt adhesive containing zinc carboxylate.
  3. Kotnour Thomas A. (Cottage Grove MN) Barber Ronald L. (Oakdale MN) Krueger Walter L. (St. Paul MN), Acrylate pressure-sensitive adhesives containing insolubles.
  4. Schlademan, James A., Acrylic hot melt pressure sensitive adhesive coated sheet material.
  5. Mancinelli Paul A. (Frazer PA), Acrylic hot melt pressure sensitive adhesive compositions.
  6. Mancinelli Paul A. (Frazer PA), Acrylic hot melt pressure sensitive adhesive compositions.
  7. Itagaki Makoto (Fujisawa JPX) Kawasaki Eiichi (Yokohama JPX) Shinkoda Kazuya (Kanagawa JPX) Suewaka Kousuke (Kamakura JPX), Actinic-radiation-curing hot-melt pressure-sensitive composition.
  8. Thakkar Bimal V. ; Everaerts Albert I., Articles incorporating pressure-sensitive adhesives having improved adhesion to plasticized polyvinyl chloride.
  9. Ellis Mark F. (Maplewood MN), Bulk radical polymerization using a batch reactor.
  10. Kotnour Thomas A. (Cottage Grove MN) Barber Ronald L. (Oakdale MN) Krueger Walter L. (St. Paul MN), Continuous free radial polymerization in a wiped-surface reactor.
  11. Sorriero Louis Joseph ; Fitzgerald John J., Copolymer blend for toner receiver.
  12. Johnson Samuel A. ; Rothenbuhler Dan E., Dimming control system and method for a fluorescent lamp.
  13. Bordoloi Binoy K. (Newhall CA) Plamthottan Sebastian S. (Pasadena CA) Ozari Yehuda (Arcadia CA) Ham Robert V. (Arcadia CA), Energy-curable acrylic pressure-sensitive adhesives.
  14. Everaerts Albert I. ; Araki Yoshinori,JPX ; Hata Michiru,JPX, Heat-activatable adhesive composition.
  15. Lopez Eugene Francis (Sunnyvale CA) Glover ; Jr. Leon Conrad (Los Altos CA) Lyons Bernard John (Atherton CA), Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide.
  16. Amici Robert M. (Doylestown PA) Bortnick Newman M. (Oreland PA) Graham Roger K. (Moorestown NJ) LaFleur Edward E. (Warminster PA) Work William J. (Huntingdon Valley PA), Hot melt adhesives.
  17. Hasegawa Kenji (Isehara JPX) Higuma Masahiko (Sagamihara JPX) Sakaki Mamoru (Sagamihara JPX) Arai Ryuichi (Sagamihara JPX) Akiya Takashi (Yokohama JPX) Morohoshi Naoya (Numazu JPX), Image forming method.
  18. Su Shiaonung (Buena Park CA) Ozari Yehuda (Greenwich CT) Vargas Richard R. (Southgate CA) Lum ; Jr. Henry (Whittier CA), Low viscosity acrylic hot melt adhesives.
  19. Sorriero Louis Joseph ; Fitzgerald John J., Method of transferring toner to receiver with copolymer blend.
  20. Guerin John D. (Drexel Hill PA) Hutton Thomas W. (Doylestown PA) Miller John J. (Warminster PA) Zdanowski Richard E. (Ft. Washington PA), Method of utilizing polyacrylic hot-melt adhesives.
  21. Dfago Raymond (Riehen CHX) Stterlin Wolfgang (Lrrach-Haagen DEX), Mixtures of a polyacrylic acid and a copolymer of acrylic acid and acrylamide as thickeners in printing pastes for dyein.
  22. Amici Robert M. (Doylestown PA) LaFleur Edward E. (Warminster PA) Work William J. (Huntington Valley PA), Poly(vinyl alcohol) blends.
  23. Guerin John D. (Drexel Hill PA) Hutton Thomas W. (Doylestown PA) Miller John J. (Warminster PA) Zdanowski Richard E. (Fort Washington PA), Polyacrylic hot melt adhesives.
  24. Amici Robert M. (Doylestown PA) LaFleur Edward E. (Warminster PA) Work William J. (Huntington Valley PA), Polymer blends.
  25. Amici Robert Mark (Doylestown PA) LaFleur Edward Ewart (Warminster PA) Work William James (Huntington Valley PA), Polymer blends.
  26. Bartman Benjamin (Maple Glen PA), Pressure sensitive hot melt adhesive.
  27. Bartman Benjamin (Maple Glen PA), Pressure sensitive hot melt adhesives.
  28. Skoultchi Martin M. (Somerset NJ), Pressure sensitive, hot melt adhesives.
  29. Sulewski John M. (Westfield MA), Pressure-sensitive adhesive composition containing styrene-maleic copolymers.
  30. Kellen James N. (Oakdale MN) Taylor Charles W. (Lake Elmo MN), Pressure-sensitive adhesive crosslinked by copolymerizable aromatic ketone monomers.
  31. Everaerts Albert I. (Oakdale MN) Takeda Satoshi (Sagamihara JPX) Stark Peter A. (Cottage Grove MN), Pressure-sensitive adhesives having improved adhesion to acid-rain resistant automotive paints.
  32. Chandran Rama (South Bound Brook NJ) Ramharack Roopram (Montgomery NJ) Davis Irwin J. (Cranbury NJ) Leighton John C. (Flanders NJ), Radiation curable hot melt pressure sensitive adhesives.
  33. Everaerts Albert I. (Oakdale MN) Malmer Jeffrey D. (North St. Paul MN), Removable, low melt viscosity acrylic pressure sensitive adhesives.
  34. Charbonneau Robert R. (Lake Elmo MN) Groff Gaylord L. (North St. Paul MN), Storable, crosslinkable pressure-sensitive adhesive tape.
  35. Groff Gaylord L. (St. Paul MN), Storable, crosslinkable pressure-sensitive adhesive tape.
  36. Young Chung I. (Roseville MN) Enanoza Rudyard M. (Woodbury MN), Suspension polymerization.
  37. Markle Richard A. (Columbus OH) Elhard Joel D. (Hilliard OH) Bigg Donald M. (Columbus OH) Sowell Sylvester (Columbus OH) Brusky Phyllis L. (Columbus OH) Cremeans George E. (Groveport OH), Thermally-reversible isocyanate-based polymers.
  38. Guo Shao-Hua (West Chester PA) Grey Roger A. (West Chester PA), Thermoplastic resins based on vinyl aromatic/vinyl phosphonic acid copolymers and amine-terminated polymers.

이 특허를 인용한 특허 (23)

  1. Czaplicki,Michael J.; Hable,Christopher; Carlson,David, Activatable material for sealing, baffling or reinforcing and method of forming same.
  2. Song, Guiqin; Hu, Nan Xing; McAneney, T. Brian; Sisler, Gordon, Adhesion promoter.
  3. Song, Guiqin; Hu, Nan-Xing; McAneney, T. Brian; Sisler, Gordon, Adhesion promoter.
  4. Song, Guiqin; Hu, Nan-Xing; McAneney, T. Brian; Sisler, Gordon, Adhesion promoter.
  5. Steelman, Ronald S.; Daniels, Michael P.; Yarusso, David J.; Hamer, Craig E., Adhesive composition.
  6. Werner, Dietmar, Cavity filling.
  7. Roush, Mark; Williams, DeWayne, Composite panel trailer sidewall with additional logistics slots.
  8. Roush, Mark A.; Wallace, Keith, Container sidewall connector.
  9. Kassa,Abraham; Harthcock,Matthew; Apfel,Jeffrey, Expandable material.
  10. Suwa, Toshihiro; Kinoshita, Yasuhiro; Everaerts, Albert I.; Dire, Abdujabar K., Heat activated optically clear adhesive for bonding display panels.
  11. Kim, Tae Hyun; Lim, Sang Hyun; Chu, Ho Dong; Lee, Kuk Joo, Highly elastic physically cross-linked binder induced by reversible acid-base interaction for high performance silicon anode.
  12. Holmberg, Thomas A., Lay flat book sheets.
  13. Satrijo, Andrew; Lehmann, Megan P.; Crandall, Michael D.; Hamer, Craig E.; Waid, Robert D., Method of making a hot melt pressure-sensitive adhesive.
  14. Arango, Juan, Multi-purpose adhesives and methods of making and using thereof.
  15. Sherman, Audrey A., Optical adhesive for liquid crystal display.
  16. Sherman, Audrey A.; Branigan, Margot A.; Rajamani, Vijay; Augustine, Thomas E.; Daniels, Michael P., Optically clear hot melt processable high refractive index adhesives.
  17. Carlson, David; Madaus, Brandon; Harthcock, Matthew; Barton, Kearney; Taylor, Charles L.; Walker, Jason, Panel structure.
  18. Chmielewski, Craig; Madaus, Brandon, Structural composite laminates.
  19. Sherman, Audrey A.; Winkler, Wendi J., Temporarily repositionable pressure sensitive adhesive blends.
  20. Czaplicki,Michael J.; Kosal,David J.; Hicks,Kevin, Two component (epoxy/amine) structural foam-in-place material.
  21. Sherman, Audrey A.; Winkler, Wendi J.; Tapio, Scott M.; Reuter, Robert J.; DiZio, James P., Urea-based pressure sensitive adhesives.
  22. Sherman, Audrey A.; Winkler, Wendi J.; Tapio, Scott M.; Reuter, Robert J.; DiZio, James P., Urea-based pressure-sensitive adhesives.
  23. Sherman, Audrey A.; Tapio, Scott M.; DiZio, James P., Urethane-based pressure sensitive adhesives.
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