초록

A stencil comprises an electret film, wherein the film has at least one perforation having a perimeter that defines an area, and wherein the area is greater than or equal to about one square centimeter. Methods of marking a substrate using stencils of the present invention are also disclosed.

대표청구항 ▼

1. A method of marking a substrate comprising:providing an electret stencil comprising an electret film having a first major surface, a second major surface opposed to the first major surface, and at least one perforation extending through the film and connecting the first and second major surfaces;

1. A method of marking a substrate comprising:providing an electret stencil comprising an electret film having a first major surface, a second major surface opposed to the first major surface, and at least one perforation extending through the film and connecting the first and second major surfaces;providing a substrate having a surface;electrostatically and removably adhering the stencil to the surface of the substrate;applying a medium to the surface of the substrate through the at least one perforation of the stencil; andremoving the stencil from the surface of the substrate. 2. The method of claim 1, further comprising rubbing the stencil with at least one of a film or a cloth. 3. The method of claim 1, wherein the stencil is in the form of a sheet. 4. The method of claim 1, wherein the electret film comprises a poly(ethylene-co-methacrylic acid) ionomer. 5. The method of claim 1, wherein the electret film comprises a zinc poly(ethylene-co-methacrylic acid) ionomer. 6. The method of claim 1, wherein the medium comprises wax. 7. The method of claim 1, wherein the applying comprises rubbing. 8. The method of claim 1, wherein the applying comprises painting. 9. The method of claim 8, wherein the painting comprises spraying. 10. The method of claim 1, wherein the medium is selected from the group consisting of pigment, chalk, paint, ink, a crayon, and a transfer sheet. 11. The method of claim 1, wherein the medium is a protective varnish. 12. The method of claim 1, wherein the medium is an etchant. 13. The method of claim 1, wherein the medium is a pressure-sensitive adhesive. 14. The method of claim 13, further comprising dusting the adhesive with a particulate solid material.