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Block copolymer melt-processable compositions, methods of their preparation, and articles therefrom 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-020/10
  • C08L-031/02
출원번호 US-0295810 (2002-11-15)
발명자 / 주소
  • Everaerts, Albert I.
  • Ma, JingJing
  • Khandpur, Ashish K.
  • D'Haese, Francois C.
  • Xia, Jianhui
  • Nguyen, Lang N.
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Fulton Lisa P.
인용정보 피인용 횟수 : 29  인용 특허 : 9

초록

Described are melt-processable block copolymers and compositions, embodiments of which may be useful in applications such as pressure sensitive adhesive (PSA) or heat-activatable adhesive, comprising polymeric end block and polymeric B block, wherein end block comprises copolymer and the B block com

대표청구항

1. A method of preparing a poly(meth)acrylate block copolymer, having meltflow temperature in the range from 50° C. to 250° C., the method comprising:reacting at least one low glass transition temperature polymeric block and at least one high glass transition temperature copolymeric end bl

이 특허에 인용된 특허 (9)

  1. Matyjaszewski Krzysztof ; Wang Jin-Shan, (Co)polymers and a novel polymerization process based on atom (or group) transfer radical polymerization.
  2. Lewis Sheldon N. (Willow Grove PA) Haggard Richard A. (Fort Washington PA), Composition comprising condensation cross-linkable novel methacrylate polymers.
  3. Frechet, Jean M. J.; Hajduk, Damian; Khoshdel, Ezat; Liu, Mingjun; Nielsen, Ralph B.; Reid, Euan Stuart; Rutherford, Keith Leslie, Cosmetic and personal care compositions.
  4. Bayard Philippe (Stavelot BEX) Fayt Roger (Neuville en Condroz BEX) Teyssie Philippe (Neuville en Condroz BEX) Varshney Sunil K. (Verdun CAX) Vuillemin Bruno (Pau FRX) Heim Philippe (Pau FRX), Initiation system for the anionic polymerisation of (meth)acrylic monomers.
  5. Bayard Philippe (Stavelot BEX) Fayt Roger (Neuville-en-Condroz BEX) Teyssie Philippe (Neuville-en-Condroz BEX) Varshney Sunil K. (Verdun CAX) Vuillemin Bruno (Pau FRX) Heim Philippe (Pau FRX), Initiation system for the anionic polymerization of (meth)acrylic monomers.
  6. Xie, Li; Ercillo, Jesse C.; Sasaki, Yukihiko; Min, Kyung W.; Ko, Chan U., Multilayer composite PSA constructions.
  7. Gnanou Yves (Talence FRX), Process for manufacturing multisequence star or network polycondensates by di- or multi-aldehyde coupling, and polyconde.
  8. Matyjaszewski Krzysztof ; Coca Simion ; Gaynor Scott G. ; Greszta Dorota ; Patten Timothy E. ; Wang Jin-Shan ; Xia Jianhui, Processes based on atom (or group) transfer radical polymerization and novel (co) polymers having useful structures and.
  9. Everaerts Albert I. (Oakdale MN) Malmer Jeffrey D. (North St. Paul MN), Removeable, low melt viscosity acrylic pressure sensitive adhesives.

이 특허를 인용한 특허 (29)

  1. Everaerts, Albert I.; Lu, Ying-Yuh; Nguyen, Lang N.; Xia, Jianhui, (Meth)acrylate block copolymer pressure sensitive adhesives.
  2. Everaerts,Albert I.; Lu,Ying Yuh; Nguyen,Lang N.; Xia,Jianhui, (Meth)acrylate block copolymer pressure sensitive adhesives.
  3. Heimbach, Kyle R.; Bartholomew, Eric L.; Lester, Christopher L.; Bottorf, William L., Acrylic block copolymers.
  4. Wuerch, Daniel W.; Vanderzanden, John W.; Melancon, Kurt C.; Bharti, Vivek, Acrylic block copolymers for aerosols and aerosol adhesives.
  5. Wuerch, Daniel W.; Vanderzanden, John W.; Melancon, Kurt C.; Bharti, Vivek, Acrylic block copolymers for aerosols and aerosol adhesives.
  6. Janoski, Jonathan E.; Schultz, Anthony F.; Lyon, Keith R.; Steelman, Ronald S.; Lewandowski, Kevin M.; Lipscomb, Corinne E.; Hobbs, Terry R.; Weikel, Arlin L.; Seth, Jayshree; Fansler, Duane D.; Abe, Hidetoshi, Acrylic polyvinyl acetal films and composition.
  7. Kian, Kourosh; Lee, Sou Phong; Hseih, Dong-Tsai; Edwards, David N.; Lenkl, Johannes; Bharadwaj, Rishikesh K.; Mallya, Prakash; Li, Kai, Activatable adhesive, labels, and related methods.
  8. Kian, Kourosh; Lee, Souphong; Hseih, Dong-Tsai; Edwards, David N.; Lenkl, Johannes; Bharadwaj, Rishikesh K.; Mallya, Prakash; Li, Kai, Activatable adhesive, labels, and related methods.
  9. Kian, Kourosh; Lee, Souphong; Hseih, Dong-Tsai; Lenkl, Johannes; Li, Kai, Activatable adhesive, labels, and related methods.
  10. Kian, Kourosh; Lee, Souphong; Hseih, Dong-Tsai; Licon, Mark A.; Edwards, David N.; Lenkl, Johannes; Bharadwaj, Rishikesh K.; Mallya, Prakash; Li, Kai, Activatable adhesive, labels, and related methods.
  11. Kian, Kourosh; Lee, Souphong; Hseih, Dong-Tsai; Licon, Mark A.; Lenkl, Johannes; Li, Kai, Activatable adhesive, labels, and related methods.
  12. Czaplicki,Michael J.; Hable,Christopher; Carlson,David, Activatable material for sealing, baffling or reinforcing and method of forming same.
  13. Joseph, Eugene G.; Bharti, Vivek; Ma, Jingjing; Tumey, Michael L., Adhesive compositions with multiple tackifiers.
  14. Everaerts,Albert I.; Ma,JingJing; D'Haese,Francois C., Block copolymer hot-melt processable adhesives, methods of their preparation, and articles therefrom.
  15. Palasz, Peter D.; Xenidou, Maria; van Wijk, Kerstin; Krause, Simon; Hilf, Stefan, Block-copolymer containing crosslinkable photoinitator groups.
  16. Werner, Dietmar, Cavity filling.
  17. Matsumoto, Akikazu; Sato, Eriko; Morino, Akinori; Tanaka, Koujirou, Easily dismantlable adhesive agent composition and easily dismantlable adhesive tape.
  18. Matsumoto, Akikazu; Sato, Eriko; Morino, Akinori; Tanaka, Koujirou, Easily dismantlable adhesive agent composition and easily dismantlable adhesive tape.
  19. Matsumoto, Akikazu; Sato, Eriko; Morino, Akinori; Tanaka, Koujirou, Easily dismantlable adhesive composition and easily dismantlable adhesive tape.
  20. Kassa,Abraham; Harthcock,Matthew; Apfel,Jeffrey, Expandable material.
  21. Suwa, Toshihiro; Kinoshita, Yasuhiro; Everaerts, Albert I.; Dire, Abdujabar K., Heat activated optically clear adhesive for bonding display panels.
  22. Phelan, John Christopher, Method for preparing silicone hydrogels.
  23. Phelan, John Christopher, Method for preparing silicone hydrogels.
  24. Katare, Rajesh K.; Peterson, Eric M.; Schmidt, Sierra V., Methods for sealing the edges of multi-layer articles.
  25. Takebe, Tomoaki; Ota, Tsuyoshi; Obata, Yutaka; Higuchi, Hiroyuki, Optical semiconductor sealing material.
  26. Carlson, David; Madaus, Brandon; Harthcock, Matthew; Barton, Kearney; Taylor, Charles L.; Walker, Jason, Panel structure.
  27. Luthra, Ajay K.; Sandhu, Shivpal S., Polymeric network system for medical devices and methods of use.
  28. Chmielewski, Craig; Madaus, Brandon, Structural composite laminates.
  29. Czaplicki,Michael J.; Kosal,David J.; Hicks,Kevin, Two component (epoxy/amine) structural foam-in-place material.
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