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A pin fin heat sink for use in transferring heat away from a heat generating source is described which is manufactured by fusion or stud welding of fins to a base forming a continuous thermally conductive path for heat rejection. The method permits use of a broader range of thermally conductive mate

A pin fin heat sink for use in transferring heat away from a heat generating source is described which is manufactured by fusion or stud welding of fins to a base forming a continuous thermally conductive path for heat rejection. The method permits use of a broader range of thermally conductive materials, fin geometry and fin spacing than exists in current art. Having greater flexibility in fin design enables more efficient heat sinks with greater surface area and lower thermal resistance for any given volume. Relatively long thin pins are joined autogenously to a heat sink base with closely spaced adjacent surfaces by a capacitor discharge stud welding process without the need to apply significant force to the mating parts.

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1. A pin fin heat sink comprising a base with a plurality of pins extending from the base, each pin being joined to the base by an autogenous stud weld comprising a continuous weld layer formed from material contributed by the pin and material contributed by the base and extending over a complete cr

1. A pin fin heat sink comprising a base with a plurality of pins extending from the base, each pin being joined to the base by an autogenous stud weld comprising a continuous weld layer formed from material contributed by the pin and material contributed by the base and extending over a complete cross section of the pin to join each pin to the base, the pin being welded to the base by joining molten material from an end of each pin and from the portion of the base adjacent the end of the pin after which the molten material solidifies to form the continuous weld layer, the pin fin heat sink comprising means for cooling an electronic component. 2. The pin fin heat sink of claim 1 wherein the base has a continuous upper surface to which multiple pins are joined. 3. The pin fin heat sink of claim 2 wherein the continuous upper surface is flat. 4. The pin fin heat sink of claim 2 wherein the continuous upper surface is curved. 5. The pin fin heat sink of claim 1 where adjacent pins are spaced apart by a distance no greater than a major cross sectional dimension of at least one of the pins. 6. The pin fin heat sink of claim 1 wherein at least one pin includes a threaded surface extending along the exterior of the pin to increase exposed surface area of the pin for more efficient heat transfer. 7. The pin fin heat sink of claim 1 wherein pins are located in multiple rows with the pins in one row having a height greater than pins in an adjacent row so as to expose taller pins to air flowing through the heat sink to improve heat transfer by eliminating choke flow. 8. The pin fin heat sink of claim 1 wherein the pins diverge from pin ends adjacent the base to pin ends spaced from the base to increase the volume of air flowing past the pins. 9. The pin fin heat sink of claim 8 wherein the pins are welded to a curved surface forming a portion of a spherical surface. 10. The pin fin heat sink of claim 1 wherein the pins are spherical. 11. The pin fin heat sink of claim 1 wherein 256 pins are welded to one surface of a base having an area of 2500 square mm. so that the base comprises means for mounting the pin fin heat sink on an integrated circuit component. 12. The pin fin heat sink of claim 1 wherein the pins and the base are fabricated from different metals. 13. The pin fin heat sink of claim 1 wherein pins in one row are transversely staggered relative to pins in an adjacent row. 14. The pin fin heat sink of claim 1 wherein the base includes a surface engagable by a mounting means to mount the pin fin heat sink on an electronic component.