초록 ▼

The invention relates to a vapor barrier for use in the thermal insulation of buildings which can be used, in particular, for thermal insulation procedures in new buildings or in the renovation of old buildings. The vapor barrier in accordance with the invention is thereby capable of achieving water

The invention relates to a vapor barrier for use in the thermal insulation of buildings which can be used, in particular, for thermal insulation procedures in new buildings or in the renovation of old buildings. The vapor barrier in accordance with the invention is thereby capable of achieving water vapor exchange under different ambient conditions. This is achieved by using a material which has a water vapor diffusion resistance which is dependent on the ambient humidity and which also has adequate tensile strength and tear resistance.

대표청구항 ▼

1. In a method of constructing a new building, the improvement comprising applying a film to a structure of said building, wherein the film has a water vapor diffusion resistance (s d -value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to

1. In a method of constructing a new building, the improvement comprising applying a film to a structure of said building, wherein the film has a water vapor diffusion resistance (s d -value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness. 2. The method according to claim 1, which further comprises a carrier material attached to the film. 3. The method according to claim 2, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film. 4. The method according to claim 2, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth. 5. The method according to claim 2, wherein the carrier material is a fiber-reinforced cellulose material. 6. The method according to claim 1, further comprising at least two layers of a carrier material, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film. 7. The method according to claim 1, wherein the film comprises polyamide. 8. The method according to claim 7, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3. 9. The method according to claim 8, wherein the polyamide is polyamide 6. 10. The method according to claim 1, wherein the film has a thickness of 10 μm to 2 mm. 11. The method according to claim 1, wherein the film has a thickness of 20 μm to 100 μm. 12. The method according to claim 1, wherein the film comprises a pattern. 13. The method according to claim 1, wherein the film comprises a printed color pattern. 14. The method according to claim 1, wherein the film is applied to a wall of said new building. 15. The method according to claim 1, wherein the film is applied to a roof of said new building. 16. The method according to claim 1, wherein the film is applied to a roof and a wall of said building. 17. In a method of renovating a building, the improvement comprising applying a film to a structure of said building, wherein the film has a water vapor diffusion resistance (s d -value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness. 18. The method according to claim 17, which further comprises a carrier material attached to the film. 19. The method according to claim 18, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film. 20. The method according to claim 18, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation balls, fiber insulation slabs, foam insulation slabs, wall paper, and cloth. 21. The method according to claim 18, wherein the carrier material is a fiber-reinforced cellulose material. 22. The method according to claim 17, further comprising at least two layers of a carrier material, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resi stance which is less than the water vapor diffusion resistance of the film. 23. The method according to claim 17, wherein the film comprises polyamide. 24. The method according to claim 23, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3. 25. The method according to claim 24, wherein the polyamide is polyamide 6. 26. The method according to claim 17, wherein the film component has a thickness of 10 μm to 2 mm. 27. The method according to claim 17, wherein the film component has a thickness of 20 μm to 100 μm. 28. The method according to claim 17, wherein the film comprises a pattern. 29. The method according to claim 17, wherein the film comprises a printed color pattern. 30. The method according to claim 17, wherein the film is applied to a wall of said new building. 31. The method according to claim 17, wherein the film is applied to a roof of said new building. 32. The method according to claim 17, wherein the film is applied to a roof and a wall of said building. 33. A method for providing a vapor barrier to a building, comprising installing a film on at least a part of the building, wherein the film has a water vapor diffusion resistance (s d -value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness. 34. The method of claim 33, wherein the film is attached to a carrier material. 35. The method of claim 34, wherein the carrier material is a thermal insulation. 36. The method of claim 34, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film. 37. The method of claim 34, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth. 38. The method of claim 37, wherein the carrier material is gypsum board. 39. The method of claim 37, wherein the carrier material is a fiber-reinforced cellulose material. 40. The method of claim 33, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film. 41. The method of claim 40, wherein at least one layer of carrier material is a thermal insulation. 42. The method of claim 40, wherein at least one layer of the carrier material is gypsum board. 43. The method of claim 33, wherein the film comprises polyamide. 44. The method of claim 43, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3. 45. The method of claim 44, wherein the polyamide is polyamide 6. 46. The method of claim 33, wherein the film has a thickness of 10 μm to 2 mm. 47. The method of claim 33, wherein the film has a thickness of 20 μm to 100 μm. 48. The method of claim 33, wherein the film is attached to an inner wall surface of the building. 49. The method of claim 33, wherein the installing the film comprises spraying or painting the film onto the building. 50. The method of claim 33, wherein the film is a formed film. 51. The method of claim 50, wherein the film comprises polyamide. 52. The method of claim 51, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3. 53. The method of claim 52, wherein the polyamide is polyamide 6. 54. The method of claim 50, wherein the thickness of the formed film is 10 μm to 2 mm. 55. The method of claim 50, wherein the thickness of the form ed film is 20 μm to 100 μm. 56. The method of claim 20, wherein the formed film is attached to a carrier material. 57. The method of claim 56, wherein the carrier material is a thermal insulation. 58. The method of claim 56, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth. 59. The method of claim 58, wherein the carrier material is gypsum board. 60. The method of claim 59, wherein the carrier material is a fiber-reinforced cellulose material. 61. The method of claim 50, wherein the formed film is sandwiched between a carrier material and the thermal insulation, the carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film. 62. The method of claim 61, wherein the carrier material is a thermal insulation. 63. The method of claim 61, wherein at least one layer of carrier material is gypsum board. 64. The method of claim 50, wherein the formed film comprises a pattern. 65. The method of claim 50, wherein the formed film comprises a printed color pattern. 66. The method of claim 33, wherein the film is installed onto a wall structure of the building. 67. The method of claim 33, wherein the film is installed onto a roof structure of the building. 68. The method of claim 67, wherein the film is installed such that it covers at least two rafters of the roof structure. 69. The method of claim 33, wherein the film is installed onto a wall structure and a roof structure of the building. 70. The method of claim 50, wherein the formed film is installed onto a wall structure of the building. 71. The method of claim 50 wherein the formed film is installed onto a roof structure of the building. 72. The method of claim 71, wherein the formed film is installed such that it covers at least two rafters of the roof structure. 73. The method of claim 50, the formed film is installed onto a wall structure and a roof structure of the building.