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A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ce

A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

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1. A package having an integral window for packaging at least one microelectronic device, comprising:a first electrically insulating plate comprising a multilayered material having a first surface, an opposing second surface, and a first aperture disposed through said first plate;an electrically con

1. A package having an integral window for packaging at least one microelectronic device, comprising:a first electrically insulating plate comprising a multilayered material having a first surface, an opposing second surface, and a first aperture disposed through said first plate;an electrically conductive metallized trace disposed on the second surface of said first plate;a window disposed across the first aperture and bonded to a lip recessed in said first plate, for providing optical access to a microelectronic device disposed within said assembly; anda second electrically insulating plate having a third surface, an opposing fourth surface, and a second aperture disposed through said second plate; wherein the first plate is attached to the second plate by joining the second surface to the third surface; andwherein the second aperture is larger than the first aperture. 2. The package of claim 1, wherein the window is mounted flush with the first surface of the first plate. 3. The package of claim 1, wherein said window comprises an optically transparent material selected from the group consisting of glass, sapphire, fused silica, plastic, and polymer. 4. The package of claim 1, further comprising a surface treatment to improve wettability and adhesion of mating surfaces. 5. The package of claim 1, wherein said window comprises an anti-reflection coating. 6. The package of claim 1, wherein said window comprises means for filtering selected wavelengths of light. 7. The package of claim 1, wherein the second plate comprises the same multilayered material as the first plate. 8. The package of claim 1, wherein said multilayered material comprises a high-temperature cofired ceramic multilayered material fired at a temperature in the range of 1300° C. to 1800° C. 9. The package of claim 1, wherein said multilayered material comprises a low-temperature cofired ceramic multilayered material fired at a temperature in the range of 600° C. to 1000° C. 10. The package of claim 1, wherein said multilayered material comprises a laminated multilayered printed wiring board composition. 11. The package of claim 1, wherein said window further comprises a lens for optically transforming the light that passes through the window. 12. The package of claim 11, wherein said lens is attached to said window. 13. The package of claim 11, wherein said lens is integrally formed with said window. 14. The package of claim 11, further comprising an array of binary optic lenslets made integral with said window. 15. The package of claim 1, further comprising an electrically-switched optical modulator attached to said package, for modulating light passing through an aperture. 16. The package of claim 15, wherein said electrically-switched optical modulator comprises a lithium niobate window. 17. The package of claim 1, further comprising electrically conductive vias disposed within said electrically insulating plates, for conducting electrical signals in a direction generally perpendicular to the plane of said plates. 18. The package of claim 1, further comprising a microelectronic device mounted within said package. 19. The package of claim 18, wherein said microelectronic device is a device selected from the group consisting of a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, and a IMEMS device. 20. The package of claim 18, wherein said microelectronic device is flip-chip mounted to the second surface. 21. The package of claim 18, wherein said microelectronic device comprises a light-sensitive side. 22. The package of claim 21, wherein said light-sensitive side is mounted facing said window. 23. The package of claim 18, further comprising a cover lid bonded to the package, for covering and sealing said package. 24. The package of claim 23, wherein said cover lid comprises a window for providing optical access through the cover lid to the microelectronic device. 25. A microelectronic package for h ousing a microelectronic device, comprising:a first electrically insulating plate comprising a first surface, an opposing second surface, and a first aperture disposed through the first plate;an electrically conductive metallized trace disposed on the second surface of the first plate;an integral window disposed across the first aperture and directly bonded to a lip recessed in the first plate without using a separate adhesion layer disposed in-between the integral window and the first plate; anda second electrically insulating plate comprising a third surface, an opposing fourth surface, and a second aperture disposed through the second plate;wherein the second surface of the first plate is attached to the third surface of the second plate; andwherein the second aperture is larger than the first aperture. 26. The microelectronic package of claim 25, wherein the first insulating plate comprises one or more multilayered co-fired ceramic materials selected from the group consisting of LTCC and HTCC. 27. The microelectronic package of claim 26, wherein the second insulating plate comprises one or more multilayered co-fired ceramic materials selected from the group consisting of LTCC and HTCC. 28. The package of claim 25, wherein the integral window is mounted flush with the first surface of the first plate.