초록 ▼

A system and methodology for conveying generally planar substrates such as printed circuit board, flat panel display and interconnect device substrates, in a levitated state, to and from a scanning or imaging location, including an air flow conveyor having a substrate flattening functionality, and a

A system and methodology for conveying generally planar substrates such as printed circuit board, flat panel display and interconnect device substrates, in a levitated state, to and from a scanning or imaging location, including an air flow conveyor having a substrate flattening functionality, and a scanning or imaging device, and scanning and imaging systems and methodologies employing such article conveying systems and methodologies.

대표청구항 ▼

1. A method for manufacturing an electrical circuit comprising:forming a portion of an electrical circuit pattern on a substrate, said substrate selected from the group consisting of printed circuit board, flat panel display and interconnect device substrates;conveying said substrate with an air flo

1. A method for manufacturing an electrical circuit comprising:forming a portion of an electrical circuit pattern on a substrate, said substrate selected from the group consisting of printed circuit board, flat panel display and interconnect device substrates;conveying said substrate with an air flow conveyor to at least an imaging location;acquiring an image of said pattern while said substrate is flattened with an air flow substrate flattener; andanalyzing said image to detect defects in said portion of an electrical circuit pattern. 2. The method according to claim 1 and wherein said conveying comprises conveying with an air flow levitator. 3. The method according to claim 2 and wherein said acquiring an image comprises conveying said substrate while at least partially flattened with an cushion. 4. The method according to claim 2 and wherein said acquiring an image comprises conveying said substrate while at least partially flattened by suction. 5. The method according to claim 1 and wherein said conveying also comprises conveying said substrate away from said imaging location. 6. The method according to claim 1 and wherein said conveying includes displacing said substrate in a levitated state at least towards said imaging location. 7. The method according to claim 1 and wherein said conveying includes displacing said substrate in a levitated state away from said imaging location. 8. The method according to claim 1 and wherein said acquiring an image comprises operating an optical inspection sensor. 9. The method according to claim 8 and wherein said optical inspection sensor comprises at least one staring array camera. 10. The method according to claim 8 and wherein said optical inspection sensor comprises a scanning camera. 11. The method according to claim 1 and wherein said analyzing comprises sensing a desired physical attribute of said substrate. 12. The method according to claim 1 and wherein said analyzing comprises transmitting said image to an image processing computer. 13. The method according to claim 1 and wherein said analyzing comprises acquiring at least one additional image of an area of said pattern suspected of having a defect. 14. An imaging system for use with generally planar substrates comprising:an air flow conveyor operative to convey planar substrates at least to an imaging location, said air flow conveyor having an air flow substrate flattening functionality at least at said imaging location; andan imager located at said imaging location for imaging said planar substrate when flattened by said air flow substrate flattening functionality. 15. An imaging system according to claim 14 and wherein said imager is an image acquirer. 16. An imaging system according to claim 14 and wherein said imager is an image creator. 17. An imaging system according to claim 14 and wherein said air flow conveyor comprises an air flow levitator. 18. An imaging system according to claim 14 and wherein said air flow conveyor comprises an air flow hold down. 19. An imaging system according to claim 14 and wherein said air flow substrate flattening functionality comprises an air flow levitator. 20. An imaging system according to claim 14 and wherein said air flow substrate flattening functionality comprises an air flow hold down. 21. An imaging system according to claim 14 and wherein said air flow conveyor is also operative to convey said planar substrate away from said imaging location. 22. An imaging system according to claim 14 and wherein said air flow conveyor includes a displacer for displacing said planar substrate at least towards said imaging location. 23. An imaging system according to claim 14 and wherein said air flow conveyor includes a displacer for displacing said planar substrates away from said imaging location. 24. An imaging system according to claim 14 and wherein said planar substrates comprise an electrical circuit substrate selected from the group consisting of: printed circuit board substrates, fla t panel display substrates an device substrates. 25. A method for imaging generally planar substrates comprising:conveying said planar substrates with an air flow conveyor to at least an imaging location;flattening said planar substrates with an a air flow substrate flattener at least at said imaging location; andimaging said planar substrates with an imager located at said imaging location, when flattened by said air flow substrate flattener. 26. The method according to claim 25 and wherein said imaging comprises acquiring an image. 27. The method according to claim 25 A and wherein said imaging comprises creating an image. 28. The method according to claim 25 and wherein said air flow conveyor comprises an air flow levitator. 29. The method according to claim 25 and wherein said air flow conveyor comprises an air flow hold down. 30. The method according to claim 25 and wherein said air flow substrate flattener functionality comprises an air flow levitator. 31. The method according to claim 25 and wherein said air flow substrate flattener comprises an air flow hold down. 32. The method according to claim 25 and wherein said conveying includes conveying said planar substrates away from said imaging location. 33. The method according to claim 25 and wherein said conveying includes displacing said planar substrates in a levitated state at least towards said imaging location. 34. The method according to claim 25 and wherein said conveying includes a displacing said planar substrates in a levitated state away from said imaging location. 35. The method according to claim 25 and wherein said planar substrates comprise an electrical circuit substrate selected from the group consisting of: printed circuit board substrates, flat panel display substrates and interconnect device substrates.