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Method for forming a first one time, voltage programmable logic element in a semiconductor substrate of first conductivity type, forming a first layer beneath a surface of the substrate, the first layer having a second conductivity type. A trench is formed through the surface and passing through the

Method for forming a first one time, voltage programmable logic element in a semiconductor substrate of first conductivity type, forming a first layer beneath a surface of the substrate, the first layer having a second conductivity type. A trench is formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench.

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1. A method of forming a one time, voltage programmable logic element in a semiconductor substrate of a first conductivity type comprising:forming a first diffusion layer beneath the surface of the substrate, the first diffusion layer having a second conductivity type;forming a trench through the su

1. A method of forming a one time, voltage programmable logic element in a semiconductor substrate of a first conductivity type comprising:forming a first diffusion layer beneath the surface of the substrate, the first diffusion layer having a second conductivity type;forming a trench through the surface and passing through the first diffusion layer, the trench having an interior surface;lining the interior surface of the trench with a first layer of dielectric material at a first thickness;depositing a second layer of dielectrical material at a second thickness over the first diffusion layer, such that the second thickness is greater than the first thickness and the second layer is recessed below the top surface of the trench;forming a second diffusion layer in the annular space of the trench on the surface of the substrate;filling the lined trench with a conductive material that abuts the second diffusion layer;connecting the top surface of the trench to the semiconductor substrate to form an ohmic contact region;wherein the logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first diffusion layer results in a programming current to flow through the first diffusion layer and across the first layer of dielectric material below the surface of the substrate; andforming a surface contact structure within the substrate that is coupled to the conductive material filling the trench so as to provide an electrical contact at the top and into the interior surface of the trench, but not to extend to the first layer of dielectric material. 2. The method of claim 1 further comprising:forming a metal contact coupled to both the surface contact structure and the conductive material. 3. A method of forming a one time, voltage programmable logic element in a semiconductor substrate of first conductivity comprising:forming a first layer beneath the surface of the substrate, the first layer having a second conductivity type;forming a trench through the surface and passing through first layer, the trench having an interior surface;forming a second layer beneath the surface of the substrate, coupled to the first layer and surrounding the trench, the second layer having the second conductivity type;lining the interior surface of the trench with a dielectric material; andfilling the lined trench with a conductive material;wherein the logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region. 4. A method of forming a one time, voltage programmable logic element in a semiconductor substrate of first conductivity type comprising:forming a first layer in a surface of the substrate, the first layer having a second conductivity type;forming a trench through the surface and passing through the first layer, the trench having an interior surface;lining the interior surface of the trench with a first dielectric material;filling the lined trench with a second dielectric material;forming a dielectric layer over a portion of the first layer so that the dielectric layer contacts the first dielectric material lining the trench at a merge location; andforming an electrode extending over a portion of both the dielectric layer and the filled trench;wherein the logic element is configured so that a predetermined voltage or higher applied between the electrode and the first layer causes a breakdown near the merge location. 5. The method of claim 4 further comprising:forming a third diffusion region of the second conductivity type within the first layer so as to connect the first and second diffusion regions. 6. The method of claim 4 wherein forming a trench through the surface and passing through the first layer comprises forming a stacked trench isolation trench. 7. The method of claim 4 further comprising:forming a first diffusion region of the second conductivity type within the first layer on a first side of the electrode; andforming a second diffusion region of the second conductivity type within the first layer on a second side of the electrode.