초록 ▼

An imaging apparatus ( 10 ) having a multiple channel image exposure device ( 12 ). Improved thermal compensation is achieved by means of mounting an array of light emitting elements ( 30 ) on a printed circuit board ( 28 ) having at least one thermal via ( 26 ) for each light emitting element to th

An imaging apparatus ( 10 ) having a multiple channel image exposure device ( 12 ). Improved thermal compensation is achieved by means of mounting an array of light emitting elements ( 30 ) on a printed circuit board ( 28 ) having at least one thermal via ( 26 ) for each light emitting element to thermally control the temperature of the light emitting element. Selected microcapsules ( 38 ) within a photosensitive media ( 44 ) are exposed with the multiple channel image exposure device to harden the desired microcapsules. Pressure applied to the exposed photosensitive media ruptures the unexposed microcapsule ( 40 ), releasing the image-forming material ( 48 ) encapsulated within to form an image on the photosensitive media.

대표청구항 ▼

1. An imaging apparatus for exposing a photosensitive material comprising:a lenslet array;an array of light emitting elements in registration with said lenslet array;a printed circuit board having an array of thermal via wherein each of said thermal via is in contact with each of said light emitting

1. An imaging apparatus for exposing a photosensitive material comprising:a lenslet array;an array of light emitting elements in registration with said lenslet array;a printed circuit board having an array of thermal via wherein each of said thermal via is in contact with each of said light emitting elements;a thermal load plate;a thermal electric cooler connected to said thermal load plate;a heat sink connected to said thermal electric cooler; andwherein said thermal load plate is bonded to said printed circuit board with a thermally conductive electrically isolating epoxy. 2. An apparatus as in claim 1 wherein each of said light emitting elements is soldered to said circuit board. 3. An apparatus as in claim 1 wherein each of said light emitting elements is adhesively bonded to said circuit board. 4. An apparatus as in claim 1 wherein said lenslet array is a molded lenslet array. 5. An apparatus as in claim 4 wherein said molded lenslet array is comprised of polyolefin. 6. An apparatus as in claim 1 wherein said light emitting elements are light emitting diodes (LED). 7. An apparatus as in claim 1 wherein said light emitting elements are laser diodes. 8. An imaging apparatus as in claim 1 wherein said photosensitive media comprises a plurality of microcapsules with an image-forming material encapsulated within said microcapsules. 9. An imaging apparatus as in claim 1 wherein each of said light emitting elements are attached to mounting pads on said printed circuit board. 10. An imaging apparatus comprising:a molded lenslet array;an array of light emitting elements in registration with said molded lenslet array;a printed circuit board having an array of thermal via wherein each of said thermal via is in contact with each of said light emitting elements;wherein said light emitting elements are arranged on a first surface of said printed circuit board;wherein each of said light emitting elements is attached to at least one thermal via;wherein each of said thermal via connects said first surface of said printed circuit board with a second surface of said printed circuit board;a thermally conductive electrically isolating epoxy covering said second surface of said printed circuit board and connecting said printed circuit board with a thermal load plate;a thermal electric cooler connected to said thermal load plate; anda heat sink connected to said thermal electric cooler. 11. An imaging apparatus as in claim 10 wherein a thermal spreading pad comprises said thermal via. 12. An imaging apparatus as in claim 10 wherein said light emitting elements are mounted on a pad attached to said printed circuit. 13. A method of stabilizing temperature in an imaging apparatus comprising:providing a lenslet array;providing an array of light emitting elements in registration with said lenslet array;providing a printed circuit board having an array of thermal via wherein each of said light emitting elements is in contact with at least one of said thermal via; andwherein each of said thermal via conducts heat away from or transmits heat to each of said light emitting elements through said printed circuit board. 14. A method as in claim 13 comprising:maintaining a constant temperature at each of said light emitting elements.