초록 ▼

A method and apparatus for isolating a seismic sensor module from high-g shock loads such as those encountered during handling, deployment and retrieval of the module. The sensor module includes one or more MEMS accelerometers in an electronics package. The electronics package is housed within a mod

A method and apparatus for isolating a seismic sensor module from high-g shock loads such as those encountered during handling, deployment and retrieval of the module. The sensor module includes one or more MEMS accelerometers in an electronics package. The electronics package is housed within a module case. And one or more isolators are disposed between the electronics package and the module case to provide shock isolation.

대표청구항 ▼

1. An apparatus for sensing seismic waves in the earth, the apparatus comprising:(a) a housing;(b) one or more seismic sensors disposed in the housing; and(c) at least one isolator coupled to the one or more seismic sensors for isolating the one or more seismic sensors from high-g shock induced in t

1. An apparatus for sensing seismic waves in the earth, the apparatus comprising:(a) a housing;(b) one or more seismic sensors disposed in the housing; and(c) at least one isolator coupled to the one or more seismic sensors for isolating the one or more seismic sensors from high-g shock induced in the housing, the high-g shock being a shock of one g or more, wherein the at least one isolator further comprises a first layer of silicone rubber and a second layer of polyurethane foam. 2. The apparatus of claim 1, wherein the at least one isolator is disposed to provide isolation from the induced vibrations in at least one predetermined direction. 3. The apparatus of claim 2, wherein the at least one predetermined direction further comprises directions along three translational axes and three angular axes. 4. The apparatus of claim 1, further comprising an electronics package disposed in the housing and wherein the at least one sensor form at least a portion of the electronics package. 5. The apparatus of claim 1, further comprising a block as an inertial mass operatively associated with the one or more sensors. 6. The apparatus of claim 1, wherein the one or more sensors are accelerometers. 7. The apparatus of claim 6, wherein the one or more accelerometer sensors are three accelerometers disposed to provide three orthogonal axes of sensitivity. 8. The apparatus of claim 6, wherein the one or more accelerometers are MEMS accelerometers. 9. The apparatus of claim 1, further comprising a cap coupled to the housing, the cap having a feedthrough for providing conductor access to the one or more seismic sensors. 10. The apparatus of claim 9, wherein the cap and housing are coupled to form a sealed sensor module. 11. The apparatus of claim 10, wherein the sealed sensor module is hermetically sealed. 12. A seismic sensor module tolerant to high-g shock inputs, the high-g shock inputs being inputs of one g or more, the seismic sensor module comprising:(a) a module case;(b) a sensor assembly housed by the module case, wherein the sensor assembly includes an inertial mass and at least one seismic sensor coupled to the inertial mass: and(c) at least one isolator coupled to the sensor assembly and the module case, wherein the at least one isolator further comprises a first layer of silicone rubber and a second layer of polyurethane foam. 13. The seismic sensor module of claim 12, wherein the module case is adapted to provide a compressive force on the at least one isolator. 14. The seismic sensor module of claim 12, wherein the at least one seismic sensor is a MEMS accelerometer. 15. The sensor module of claim 14, wherein the at least one MEMS accelerometer further comprises three MEMS accelerometers disposed to provide three orthogonal axes of sensitivity. 16. The seismic sensor module of claim 12, wherein the at least one isolator is disposed to provide isolation from the induced vibrations in at least one predetermined direction. 17. The sensor module of claim 16, wherein the at least one predetermined direction further comprises directions along three translational axes and three angular axes. 18. The seismic sensor module of claim 12 further comprisinga cap coupled to the module case, the cap having a feedthrough for providing conductor to the one or more seismic sensors. 19. The sensor module of claim 18, wherein the cap and module case are sealed. 20. The sensor module of claim 19, wherein the sealed sensor module is hermetically sealed. 21. A sensor module tolerant to high-g shock inputs, the high-g shock inputs being inputs of one g or more, the sensor module comprising:(a) a module case;(b) a sensor assembly within the module case, the sensor assembly having an inertial mass coupled to the module case and to one or more seismic sensors coupled to the inertial mass; and(c) an isolation layer coupled to the module case and to the sensor assembly, wherein the sensor assembly does not move relative to the module case when an input for ce of less than a predetermined level is applied to the module case, wherein the at least one isolator further comprises a layer of silicone rubber and a layer of polyurethane foam. 22. The sensor module of claim 21, wherein the predetermined level is 1 g. 23. The sensor module of claim 21, wherein the at least one isolator is disposed to provide isolation from the induced vibrations in at least one predetermined direction. 24. The sensor module of claim 23, wherein the at least one predetermined direction further comprises directions along three translational axes and three angular axes. 25. The sensor module of claim 21, wherein the one or more sensors are accelerometers. 26. The sensor module of claim 21, wherein the one or more sensors are three accelerometers disposed to provide three orthogonal axes of sensitivity. 27. The sensor module of claim 21, wherein the one or more sensors are MEMS accelerometers. 28. The sensor module of claim 21, further comprising a cap coupled to the module case, the cap having a feedthrough for providing conductor access to the one or more seismic sensors. 29. The sensor module of claim 28, wherein the cap and module case are sealed. 30. The sensor module of claim 29, wherein the sealed sensor module is hermetically sealed. 31. A method of isolating one or more seismic sensor in a seismic sensor module from high-g shock loads while maintaining sensitivity to seismic waves the high-g shock loads being shock loads of one g or more, the method comprising:(a) providing a housing for the seismic sensor assembly;(b) installing one or more seismic sensors in the housing;(c) providing at least one isolator between the one or more sensors and the housing, wherein providing the at least one isolator further comprises providing a layer of silicone rubber and a layer of polyurethane foam. 32. The method of claim 31 further comprising coupling an inertial mass to the one or more seismic sensors. 33. The method of claim 31, wherein the at least one isolator is disposed to provide isolation from the induced vibrations in at least one predetermined direction. 34. The method of claim 33, wherein the at least one predetermined direction further comprises directions along three translational axes and three angular axes. 35. The method of claim 31 further comprising reducing noise during operation of the sensor module using an inertial mass coupled to the one or more sensors. 36. The method of claim 31, wherein the one or more sensors are accelerometers. 37. The method of claim 31, wherein the one or more sensors are three accelerometers disposed to provide three orthogonal axes of sensitivity. 38. The method of claim 31, wherein the one or more sensors are MEMS accelerometers. 39. The method of claim 31, wherein the sensor assembly further comprises a cap coupled to the housing, the cap having a feedthrough for providing conductor access to the one or more seismic sensors, the method further comprising sealing the cap and housing to form a sealed sensor module. 40. The method of claim 39, wherein the sealed sensor module is hermetically sealed.