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Elastomeric electrical connector

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
  • H05K-001/00
출원번호 US-0275754 (2001-05-11)
국제출원번호 PCT/US01/15239 (2001-05-11)
국제공개번호 WO01/89038 (2001-11-22)
발명자 / 주소
  • Zaderej, Victor J.
출원인 / 주소
  • Molex Incorporated
대리인 / 주소
    Zeitler Robert J.
인용정보 피인용 횟수 : 59  인용 특허 : 8

초록

An electrical connector is used to connect first and second electrical elements together. A body of the connector is fanned from an elastomer with a top surface and a bottom surface. Elastomeric bumps extend from the top and bottom surfaces and holes extend through the pairs of bumps and body. The b

대표청구항

1. A connector for electrically connecting electrical contacts on a first element to electrical contacts on a second element comprising:an elastomeric body having a first surface and a second surface;an elastomeric bump extending from said first surface;an elastomeric bump extending from said second

이 특허에 인용된 특허 (8)

  1. Reylek Robert S. (Shoreview MN) Berg James G. (North St. Paul MN), Anisotropically conductive polymeric matrix.
  2. Arnio Barbara E. (Middletown CT) Burdick Lynn E. (Hampton CT) Owens Mark J. (Vernon CT) St. Lawrence Mike (Thompson CT) Simpson Scott S. (Woodstock CT), Array connector.
  3. Clark ; Stephen Larry, Circuit board eyelet.
  4. Nolan Steven ; Bartilson Bradley W. ; Kunkel Ronald, Demateable, compliant, area array interconnect.
  5. Irlbeck Robert D. (Greensboro NC) Bates Warren A. (Winston-Salem NC), Laminated surface mount interconnection system.
  6. Fritz Todd W. (Kalamazoo MI) Lanting Mark L. (Portage MI) Davis Alan R. (Plainwell MI) Edelen Stephen A. (Battle Creek MI) Patterson Jack D. (Kalamazoo MI), Method and apparatus of mounting a package housing and ground strap.
  7. Benarr, Garry M.; Burns, Terry A.; Walker, William J., Pinless connector interposer and method for making the same.
  8. Afshari Bahram (Menlo Park CA) Matta Farid (Mountain View CA) Hanlon Lawrence (Menlo Park CA), Shearing stress interconnection apparatus and method.

이 특허를 인용한 특허 (59)

  1. Park,Edward Hosung; Walker,Francis Joseph, Bimodal compounds having an elastomeric moiety.
  2. Park, Edward Hosung, Branched chain fluoropolymers.
  3. Park,Edward Hosung, Branched chain fluoropolymers.
  4. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin assembly and card system.
  5. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin assembly and card system.
  6. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin assembly, card system and methods thereof.
  7. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Compliant contact pin test assembly and methods thereof.
  8. Brown,Dirk D.; Williams,John D.; Radza,Eric M., Connector for making electrical contact at semiconductor scales.
  9. Dittmann,Larry E., Connector having staggered contact architecture for enhanced working range.
  10. Dittmann, Larry E., Contact and method for making same.
  11. Brown,Dirk D.; Williams,John D., Contact grid array formed on a printed circuit board.
  12. Williams,John David, Contact grid array system.
  13. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Contact pin assembly and contactor card.
  14. Dittmann,Larry E., Deep drawn electrical contacts and method for making.
  15. Hougham,Gareth Geoffrey; Beaman,Brian Samuel; Feger,Claudius, Electrical connecting device and method of forming same.
  16. Light, David Noel; Kalakkad, Dinesh Sundararajan; Nguyen, Peter Tho, Electrical connector and method of making it.
  17. Dittmann, Larry E., Electrical connector having a flexible sheet and one or more conductive connectors.
  18. Light, David Noel; Wang, Hung-Ming; Baker, David Rodney; Nguyen, Peter Tho; Pao, Dexter Shih-Wei, Electrical connector with electrical contacts protected by a layer of compressible material and method of making it.
  19. Park,Edward Hosung; Berdichevsky,Alexander, Electron beam curing in a composite having a flow resistant adhesive layer.
  20. Park,Edward Hosung; Walker,Francis Joseph; Berdichevsky,Alexander, Electron beam curing of fabricated polymeric structures.
  21. Park, Edward Hosung; Walker, Francis Joseph, Electron beam inter-curing of plastic and elastomer blends.
  22. Singh,Kuljeet; Wells,Kevin E.; Delino,Julius, Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts.
  23. Singh,Kuljeet; Wells,Kevin E.; Delino,Julius, Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts.
  24. Park, Edward Hosung, Electrostatically dissipative fluoropolymers.
  25. Park,Edward Hosung, Electrostatically dissipative fluoropolymers.
  26. Sterrett, Terry L.; Natekar, Devendra, Etched interposer for integrated circuit devices.
  27. Chuang,Ping; Chen,Li Sen; Hsu,Chien Yu, Flexible land grid array connector.
  28. Nickerson, Robert M.; Spreitzer, Ronald L.; Conner, John C.; Taggart, Brian, Integrated circuit device mounting with folded substrate and interposer.
  29. Dittmann,Larry E., Interposer with compliant pins.
  30. Dittmann,Larry E., Interposer with compliant pins.
  31. Van Gompel, Waltherus Emericus Johannes; Friederichs, Winand Hendrik Anna Maria, LED module and luminaire comprising said module.
  32. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Land grid array interposer producing method.
  33. Radza, Eric M.; Williams, John D., Method and system for batch forming spring elements in three dimensions.
  34. Brown, Dirk Dewar; Williams, John David; Long, William B.; Chen, Tingbao, Method and system for batch manufacturing of spring elements.
  35. Dittmann,Larry E., Method for fabricating a connector.
  36. Williams, John D., Method for fabricating a contact grid array.
  37. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of forming a land grid array (LGA) interposer.
  38. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Method of making contact pin card system.
  39. Williams, John D., Method of making electrical connector on a flexible carrier.
  40. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array (LGA) interposer structure.
  41. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array (LGA) interposer structure.
  42. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer.
  43. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array interposer.
  44. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array interposer.
  45. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array interposer structure.
  46. Hougham, Gareth G.; Beaman, Brian S.; Colgan, Evan G.; Coteus, Paul W.; Oggioni, Stefano S.; Vargas, Enrique, Method of producing a land grid array interposer utilizing metal-on-elastomer.
  47. Kirby,Kyle K.; Farnworth,Warren M.; Wark,James M.; Hiatt,William M.; Hembree,David R.; Wood,Alan G., Methods of forming a contact pin assembly.
  48. Huang, Cheng-Lin; Chang, Jung-Hua; Gau, Jy-Jie; Lin, Jing-Cheng, Non-vertical through-via in package.
  49. Ichikawa,Kinya, Patch substrate for external connection.
  50. Grubb,Kenneth; Wutz,Philip, Pin to thin plate joint and method for making the joint.
  51. Park, Edward H., Robust magnetizable elastomeric thermoplastic blends.
  52. Hamilton, Robert; Wojtaszek, Mark, Selective deposition of metal on plastic substrates.
  53. Williams, John David; Radza, Eric Michael, Spring connector for making electrical contact at semiconductor scales.
  54. Brown, Dirk D.; Williams, John D.; Long, William B., Structure and process for a contact grid array formed in a circuitized substrate.
  55. Ichikawa,Kinya, Substrate connector for integrated circuit devices.
  56. Park,Edward Hosung, Surface bonding in halogenated polymeric components.
  57. Dittmann, Larry E.; Williams, John David; Long, William B., System and method for connecting flat flex cable with an integrated circuit, such as a camera module.
  58. Dittmann, Larry E.; Williams, John D.; Long, William B., System for connecting a camera module, or like device, using flat flex cables.
  59. Strader, Jason L; Hill, Richard F, Thermal interface material assemblies, and related methods.
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