초록 ▼

A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane.

A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

대표청구항 ▼

1. A method for generating a stream of liquid metal droplets for deposition on at least a portion of a stationary substrate comprising:producing a continuous stream of liquid metal droplets;counting a number of the liquid metal droplets in the continuous stream;selectively directing the stream of li

1. A method for generating a stream of liquid metal droplets for deposition on at least a portion of a stationary substrate comprising:producing a continuous stream of liquid metal droplets;counting a number of the liquid metal droplets in the continuous stream;selectively directing the stream of liquid metal droplets in one dimension of a first dimension, a second dimension, and a combination of a first dimension and a second dimension using a raster scanning process comprising:electrically charging the liquid metal droplets;deflecting at least a portion of the electrically charged liquid metal droplets in the one dimension of a first dimension, a second dimension, and a combination of a first dimension and a second dimension, by passing each droplet of the portion of electrically charged liquid metal droplets through an electric field, each of at least two different droplets of the portion of electrically charged liquid metal droplets passing through the electric field, the field having different magnitudes, different directions, or both during the passing of the at least two different droplets, the at least two different droplets having different deflections during and after the passing;catching at least some of the liquid metal droplets for preventing the at least some of said the liquid metal droplets from contacting the stationary substrate; andrecycling at least some of the liquid metal droplets from location of the catching of at least some of the liquid metal droplets. 2. The method according to claim 1, wherein producing a continuous stream of liquid metal droplets further comprises:heating a metal to a liquid state;controlling a temperature of the metal in the liquid state to maintain the metal in the liquid state. 3. The method according to claim 1, wherein producing a continuous stream of liquid metal droplets further comprises:providing a source of a liquid metal;inducing a pressure on the source of liquid metal; andvibrating the liquid metal to cause the liquid metal droplets to be formed as the pressure is induced on the source of liquid metal. 4. The method according to claim 3, wherein inducing a pressure comprises operating a piezoelectric crystal driven at a frequency to produce a desired pressure on the liquid metal. 5. The method according to claim 3, wherein vibrating comprises operating a piezoelectric crystal driven at a selected frequency producing a vibration frequency to form micron size droplets. 6. The method according to claim 1, wherein producing a continuous stream of the liquid metal droplets further comprises forming the liquid metal droplets in a consistent micron size range. 7. The method according to claim 1, wherein catching at least some of the liquid metal droplets comprises catching at least some of the liquid metal droplets when the stream of liquid metal droplets is positioned between an endpoint of a first line formed by at least some of the continuous stream of liquid metal droplets and a start point of a second line formed by at least some of the continuous stream of liquid metal droplets. 8. The method according to claim 1, wherein the catching at least some of the liquid metal droplets further comprises:catching the deflected stream of liquid droplets prior to being deposited on a selected surface. 9. The method according to claim 1, wherein selectively directing the stream of liquid metal droplets comprises programmably controlling a direction of the stream of liquid metal droplets. 10. A method for applying a stream of liquid metal droplets to portions of a stationary substrate comprising:producing a continuous stream of liquid metal droplets;counting the number of the liquid metal droplets in the continuous stream of liquid metal droplets; andselectively directing the stream of liquid metal droplets in one of a first dimension, a second dimension and a first dimension and a second dimension using a raster scanning process comprising:electrically charging the liquid metal dro plets;deflecting at least a portion of the electrically charged liquid metal droplets in the one of a first dimension, a second dimension, and a first dimension and a second dimension for deposition on portions of the substrate, by passing each droplet of the portion of electrically charged liquid metal droplets through an electric field, each of at least two different droplets of the portion of electrically charged liquid metal droplets passing through the electric field, the field having different magnitudes, different directions, or both during the passing of the at least two different droplets, the at least two different droplets having different deflections during and after the passing;catching at least some of the liquid metal droplets for use as a continuous stream of liquid metal droplets for deposition on portions of the substrate; andrecycling at least some of the liquid metal droplets from the location of the catching of at least some of the liquid metal droplets. 11. The method according to claim 10, wherein producing a continuous stream of liquid metal droplets further comprises:heating a metal to a liquid state;controlling a temperature of the metal in the liquid state to maintain metal in the liquid state. 12. The method according to claim 10, wherein producing a continuous stream of liquid metal droplets further comprises:providing a source of a liquid metal;inducing a pressure on the source of liquid metal; andvibrating the liquid metal to cause the liquid metal droplets to be formed as the pressure is induced on the source of liquid metal. 13. The method according to claim 12, wherein inducing a pressure on source of liquid metal includes operating a piezoelectric crystal driven at a frequency for producing a desired pressure on the liquid metal. 14. The method according to claim 12, wherein vibrating the liquid metal comprises operating a piezoelectric crystal driven at a selected frequency producing a vibration frequency for forming micron size droplets. 15. The method according to claim 10, wherein producing a stream of liquid metal droplets further comprises forming the liquid metal droplets in a consistent micron size range. 16. The method according to claim 10, wherein catching at least some of the liquid metal droplets comprises catching at least some of the liquid metal droplets when the stream of liquid metal droplets is positioned between an endpoint of a first line formed by at least some of the continuous stream of liquid metal droplets and a start point of a second line formed by at least some of the continuous stream of liquid metal droplets. 17. The method according to claim 10, wherein catching at least some of the liquid metal droplets further comprises: catching the deflected stream of liquid droplets prior to being deposited on a selected surface. 18. The method according to claim 10, wherein directing comprises programmably controlling a direction of the stream of liquid metal droplets.