초록 ▼

A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip presses a thermal stud against the back of an electrical device package. Th

A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip presses a thermal stud against the back of an electrical device package. The present invention is especially useful for attaching a spatial light modulator to a printed circuit board since it provides a simple, reliable heat sink without blocking the light path to and from the device.

대표청구항 ▼

1. A method of attaching a heat sink to an electronic device, the method comprising:providing an anchor surface having a first side and a second side;positioning an electronic device on said first side;placing a heat sink against said electronic device, said heat sink extending to said second side o

1. A method of attaching a heat sink to an electronic device, the method comprising:providing an anchor surface having a first side and a second side;positioning an electronic device on said first side;placing a heat sink against said electronic device, said heat sink extending to said second side of said anchor surface; andretaining said heat sink against said electronic device using a spring clip attached to said anchor surface. 2. The method of claim 1, said step of placing a heat sink comprising placing a heat sink comprised of a thermal stud and a heat sink against said electronic device. 3. The method of claim 1, said step of placing a heat sink comprising placing a heat sink selected from the group consisting of a thermal stud and a finned heat sink against said electronic device. 4. The method of claim 1, said step of retaining comprising attaching said spring clip to said first side of said anchor surface. 5. A method of attaching a heat sink to an electronic device, the method comprising:providing an anchor surface having a first side and a second side:positioning an electronic device on said first side:placing a heat sink against said electronic device, said heat sink extending to said second side of said anchor surface; andretaining said heat sink against said electronic device using a spring clip attached to a socket on said first side of said anchor surface. 6. The method of claim 5, said step of retaining comprising screwing said spring clip to said socket. 7. The method of claim 5, said step of retaining comprising hooking said spring clip to said socket. 8. The method of claim 1, said step of retaining comprising hooking said spring clip to said first side of said anchor surface. 9. The method of claim 1, said step of retaining comprising screwing said spring clip to said anchor surface. 10. The method of claim 1, said step of retaining comprising hooking said spring clip to said anchor surface. 11. The method of claim 1, said step of retaining comprising hooking said spring clip to hooks attached to said anchor surface. 12. An electronic assembly comprising:an anchor surface having a first side and a second side;an electronic device on said first side;a heat sink in thermal communication with said electronic device, said heat sink extending to said second side of said anchor surface; anda spring clip attached to said anchor surface and holding said heat sink against said electronic device. 13. The assembly of claim 12, said heat sink comprising thermal stud and a heat sink. 14. The assembly of claim 12, said heat sink selected from the group consisting of a thermal stud and a finned heat sink. 15. The assembly of claim 12, said spring clip attached to said first side of said anchor surface. 16. An electronic assembly comprising:an anchor surface having a first side and a second side;an electronic device on said first side;a heat sink in thermal communication with said electronic device, said heat sink extending to said second side of said anchor surface;a socket on said first side of said anchor surface; anda spring clip attached to said socket and holding said heat sink against said electronic device. 17. The assembly of claim 16, said spring clip screwed to said socket. 18. The assembly of claim 16, said spring clip hooked to said socket. 19. The assembly of claim 12, said spring clip hooked to said first side of said anchor surface. 20. The assembly of claim 12, said spring clip screwed to said anchor surface. 21. The assembly of claim 12, said spring clip hooked to said anchor surface. 22. The assembly of claim 12, further comprising a hook on said first side of said anchor surface, said spring clip hooked to said hook. 23. An electronic assembly comprising:an anchor surface having a first side and a second side;an electronic device on said first side;means for heat sinking said electronic device in thermal communication with said electronic device and extending to said second side of said anchor surface ; andmeans for holding said means for heat sinking against said electronic device, said means for holding attached to said anchor surface. 24. An electronic assembly comprising:an anchor surface having a first side and a second side;an electronic device on said first side;a socket on said first side;means for heat sinking said electronic device in thermal communication with said electronic device and extending to said second side of said anchor surface; andmeans for holding said means for heat sinking against said electronic device, said means for holding attached to said socket. 25. The method of claim 1, said step of placing a heat sink against said electronic device comprising placing a heat sink against said electronic device using an interface material selected from the group consisting of thermal grease and thermal tape. 26. The method of claim 5, said step of placing a heat sink against said electronic device comprising placing a heat sink against said electronic device using an interface material selected from the group consisting of thermal grease and thermal tape. 27. The method of claim 5, said step of placing a heat sink comprising placing a heat sink comprised of a thermal stud and a heat sink against said electronic device. 28. The method of claim 5, said step of placing a heat sink comprising placing a heat sink selected from the group consisting of a thermal stud and a finned heat sink against said electronic device. 29. The method of claim 5, said step of placing a heat sink against said electronic device comprising placing a heat sink against said electronic device using an interface material selected from the group consisting of thermal grease and thermal tape. 30. The assembly of claim 16, said heat sink comprising thermal stud and a heat sink. 31. The assembly of claim 16, said heat sink selected from the group consisting of a thermal stud and a finned heat sink.