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Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

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1. An electronic assembly comprising:a first object created and separated from a host substrate, said first object having a first electrical circuitry therein;a carrier substrate, said first object deposited in said carrier substrate, said carrier substrate further comprising a first carrier connect

1. An electronic assembly comprising:a first object created and separated from a host substrate, said first object having a first electrical circuitry therein;a carrier substrate, said first object deposited in said carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal connectors, said first object further being recessed below a surface of said carrier substrate; anda receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal connectors, said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad providing an electrical connection between said first electrical circuitry and said second electrical circuitry, wherein the receiving substrate and the carrier substrate are not the same substrate. 2. An electronic assembly as in claim 1 further comprising an insulation layer, said insulation layer insulating said first electronic circuitry and said second electronic circuitry. 3. An electronic assembly as in claim 2 wherein said second electrical circuitry is an antenna. 4. An electronic assembly as in claim 3 wherein said carrier substrate is a flexible strap and wherein said first object comprises a radio frequency circuitry for use in a radio frequency identification tag. 5. An electronic assembly as in claim 1 wherein said carrier substrate is flexible. 6. An electronic assembly as in claim 1 wherein said first object is an integrated circuitry. 7. An electronic assembly as in claim 1 further comprising at least one second object, said second object being recessed within said carrier substrate and being interconnected to said first to said first object using said metal connectors. 8. An electronic assembly as in claim 7 further comprising at least one third object, said third object being coupled to said receiving substrate and being interconnected to said second electrical circuitry using said metal connectors. 9. An electronic assembly as in claim 1 wherein said second electrical circuitry is a printed circuit board. 10. An electronic assembly as in claim 1 wherein said electronic assembly is a multi-feature-size structure in which said carrier substrate is at least five times larger in feature size than said first object and wherein said carrier substrate is at least five times smaller in feature size than said receiving substrate. 11. An electronic assembly as in claim 5 wherein said electronic assembly is a multi-feature-size structure in which said carrier substrate is at least five times larger in feature size than said first object and wherein said carrier substrate is at least five times smaller in feature size than said receiving substrate. 12. An electronic assembly as in claim 11 wherein said carrier substrate couples to said first object through a fluidic self-assembly process. 13. An electronic assembly as in claim 1 wherein said carrier substrate couples to said first object through a fluidic self-assembly process. 14. An electronic assembly as in claim 1 wherein said first carrier connection pad and said second carrier connection pad are the only carrier connection pads on said carrier substrate. 15. An electronic assembly as in claim 12 wherein a conductive adhesive material is used to couple said first carrier connection pad to said first receiving connection pad and said second carrier connection pad to said second receiving connection pad. 16. An electronic assembly comprising:a first object created and separated from a host substrate, said first object having a first electrical circuitry therein;a carrier substrate, said first object deposited in said carrier s ubstrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that forms a first interconnection with said first object using metal conductors;a receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that forms a second interconnection with said second electrical circuitry using said metal conductors, said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad providing an electrical connection between said first electrical circuitry and said second electrical circuitry; andsaid first electrical circuitry, said first interconnection, and said second interconnection are essentially coplanar, wherein the receiving substrate and the carrier substrate are not the same substrate. 17. An electronic assembly as in claim 16 wherein each of said first electrical circuitry, said first interconnection, and said second interconnection forms a plane and each of said plane is separated from one another by less than ten micrometers. 18. An electronic assembly as in claim 17 wherein said carrier substrate is flexible. 19. A method of making an electronic assembly comprising:creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;depositing said first object in a carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal conductors, said first object further being recessed below a surface of said carrier substrate; andintegrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar and including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad, wherein said carrier substrate and said receiving substrate are not the same substrate. 20. A method of making an electronic assembly as in claim 19 further comprising coating an insulation layer over said metal conductors, said insulation layer to insulate said first electronic circuitry and said second electronic circuitry. 21. A method of making an electronic assembly as in claim 20 further comprising configuring said second electrical circuitry to be an antenna. 22. A method of making an electronic assembly as in claim 21 further comprising configuring said carrier substrate to be a flexible strap wherein said first object comprises a radio frequency circuitry for use in a radio frequency identification tag. 23. A method of making an electronic assembly as in claim 19 further comprising configuring said first object to be an integrated circuitry. 24. A method of making an electronic assembly as in claim 19 further comprising configuring said second electrical circuitry to be a printed circuit board. 25. A method of making an electronic assembly as in claim 19 further comprising making said electronic assembly a multi-feature-size structure wherein said carrier substrate is at least five times larger in feature size than said first object and said carrier substrate is at least five times smaller in feature size than said receiving substrate. 26. A method of making an electronic assembly as in claim 19 wherein said coupling of said carrier substrate to said first functional object is accomplished through a fluidic self-assembly process. 27. A method of making an electronic assembly comprising:creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;depositing said first object to a carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal conductors;integrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar and including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad;crossing said carrier substrate over at least one of said metal conductors on said receiving substrate; andconfiguring said carrier substrate to be at least five times larger in feature size than said first object and at least five times smaller in feature size than said receiving substrate. 28. A method of making an electronic assembly comprising:creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;depositing said first object to a carrier substrate said carrier further comprising a first carrier connection pad and a second carrier connection pad that forms a first interconnection with said first object using metal conductors;integrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that forms a second interconnection with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad; andconfiguring said first object, said carrier substrate, said receiving substrate, said first interconnection, said second interconnection, and said electrical interconnection to be essentially coplanar. 29. An electronic assembly comprising:a first object created and separated from a host, said first object having a first electrical circuitry therein;a carrier substrate, said first object deposited in said carrier substrate through a fluidic self-assembly process, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal connectors, said first object further being recessed below a surface of said carrier substrate; anda receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal connectors, said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad providing an electrical connection between said first electrical circuitry and said second electrical circuitry. 30. An electronic assembly as in claim 29 wherein said carrier substrate is flexible. 31. A method of making an electronic assembly comprising:creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;using a fluidic self-assembly process to deposit sai d first object in a carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal conductors, said first object further being recessed below a surface of said carrier substrate; andintegrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar and including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad.