초록 ▼

The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom

The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

대표청구항 ▼

1. A mold for use in packaging integrated circuits, comprising:an upper mold portion and a lower mold portion adapted to receive an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging subs

1. A mold for use in packaging integrated circuits, comprising:an upper mold portion and a lower mold portion adapted to receive an integrated circuit die mounted on an upper surface of a packaging substrate, the upper and lower mold portions contacting upper and lower surfaces of the packaging substrate, respectively, during mold clamping; anda deformable material on at least a portion of a surface of the lower mold portion contacting at least a portion of the bottom surface of the packaging substrate during mold clamping, wherein the deformable material has a variable upper surface contacting the bottom of the packaging substrate during mold clamping. 2. The mold according to claim 1, wherein the packaging substrate has thickness variations. 3. The mold according to claim 1, wherein an adhesive between the integrated circuit die and the packaging substrate is non-planar. 4. The mold according to claim 1, wherein the upper mold portion includes a cavity receiving the integrated circuit die, the upper mold portion contacting the upper surface of the packaging substrate around a periphery of the cavity during mold clamping. 5. The mold according to claim 4, wherein the upper mold portion includes a projection having a surface contacting an active area of the integrated circuit die during mold clamping. 6. A mold for use in packaging integrated circuits, comprising:a hardened steel lower mold portion;a hardened steel upper mold portion having a cavity for receiving an integrated circuit die therein, wherein the upper and lower mold portions are adapted to contact opposing surfaces of a packaging substrate on which the integrated circuit die is mounted during mold clamping; anda deformable material on at least a portion of a surface of the lower mold portion contacting at least a portion of the bottom surface of the packaging substrate during mold clamping, wherein the deformable material has a variable upper surface contacting the bottom of the packaging substrate during mold clamping. 7. The mold according to claim 6, wherein the packaging substrate has thickness variations. 8. The mold according to claim 6 wherein an adhesive between the integrated circuit die and the packaging substrate is non-planar. 9. The mold according to claim 6, wherein the upper mold portion includes a cavity receiving the integrated circuit die, the upper mold portion contacting the upper surface of the packaging substrate around a periphery of the cavity during mold clamping. 10. The mold according to claim 9, wherein the upper mold portion includes a projection having a surface contacting an active area of the integrated circuit die during mold clamping. 11. The mold according to claim 1, wherein:the lower mold portion comprises steel; andthe deformable material comprises rubber. 12. The mold according to claim 1, wherein the packaging substrate comprises a plastic sheet. 13. The mold according to claim 6, wherein the deformable material comprises rubber. 14. The mold according to claim 6, wherein the packaging substrate comprises a plastic sheet. 15. A mold, comprising:a first mold portion; anda second mold portion comprising a base and a deformable material on at least a portion of the base;the first and second mold portions adapted to receive an integrated circuit die mounted on a substrate; andthe deformable material having a variable surface that contacts at least a portion of the substrate during mold clamping. 16. The mold of claim 15, wherein:the base comprises steel; andthe deformable material comprises rubber. 17. The mold of claim 15, wherein at least one of:the substrate has a variable thickness; andan adhesive between the integrated circuit die and the substrate is non-planar. 18. The mold of claim 15, wherein the first mold portion includes a cavity capable of receiving the integrated circuit die, the first mold portion contacting a surface of the substrate around a periphery of the cavity during mold clamping. 19. The mold of claim 1 5, wherein the first mold portion includes a projection having a surface contacting an active area of the integrated circuit die during mold clamping. 20. The mold of claim 15, wherein the substrate comprises a plastic