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A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one ele

A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.

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1. A connector assembly to be coupled to an implantable medical device, comprising:a core portion formed of a first thermoplastic material shaped to receive a connector member for receiving a lead;a first circuit element positioned adjacent to the core element and having a first portion extending wi

1. A connector assembly to be coupled to an implantable medical device, comprising:a core portion formed of a first thermoplastic material shaped to receive a connector member for receiving a lead;a first circuit element positioned adjacent to the core element and having a first portion extending within the core portion and a second portion extending outward from the core portion; andan overmold portion formed of a second thermoplastic material to extend over and adhere to at least part of the core portion and the second portion of the first circuit element through injection molding of the second thermoplastic material. 2. The connector assembly of claim 1, wherein the first and the second thermoplastic materials are each selected from the group consisting of polyurethane and polysulfone. 3. The connector assembly of claim 1, wherein the core portion is formed using an injection mold process. 4. The connector assembly of claim 1, wherein the core portion is formed using a machining process. 5. The connector assembly of claim 1, wherein the surface of the core portion includes predetermined ridge members to enhance bonding of the core portion to the overmold portion. 6. The connector assembly of claim 1, wherein the surface of the core portion includes predetermined groove members to position at least a portion of the at least one circuit element in a predetermined location on the surface of the core portion. 7. The connector assembly of claim 1, wherein the core portion is further shaped to receive a set-screw member. 8. The connector assembly of claim 7, wherein the first circuit element is coupled to at least one of the connector member and the set-screw member. 9. The connector assembly of claim 1, wherein the at least one circuit element includes multiple conductive traces. 10. The connector assembly of claim 9, wherein the multiple conductive traces are electrically isolated. 11. The circuit assembly of claim 1, wherein the mass of the core portion is less than fifty percent of the mass of the overmold portion. 12. The circuit assembly of claim 1, wherein the mass of the core portion is less than thirty percent of the mass of the overmold portion. 13. The connector assembly of claim 1, further comprising:a mold assembly having a bottom portion and a top portion forming an aperture having an interior surface shaped to receive the core portion and the first circuit element; anda pin member insertable within the connector member, the pin member positioning the core portion within the aperture to be spaced from the interior surface of the mold assembly and preventing injection of the second thermoplastic material within the connector member. 14. A process for making a connector assembly for use in an implantable medical device, comprising:forming a core element of a first thermoplastic material;positioning at least one circuit element adjacent to the core element and having a first portion extending within the core element and a second portion extending outward from the core element; andforming an overmold structure of a second thermoplastic material to extend over and adhere at least a portion of the core element and at least a portion of the at least one circuit element, the forming of the overmold structure including heating and injecting the second thermoplastic material to form the connector assembly to be electrically and mechanically coupled to the implantable medical device. 15. The process of claim 14, wherein the core element is formed using an injection mold process. 16. The process of claim 14, wherein the core element is formed using a machining process. 17. The process of claim 14, wherein forming a core element includes forming ridges on the surface of the core element. 18. The process of claim 17, wherein positioning at least one circuit element includes aligning the circuit element on the surface of the core element using at least one of the ridges as a guide. 19. The process of claim 14, wherein forming an overmold structure further comprises:positioning the core element and the at least one circuit element in a mold; andinjecting thermoplastic material into the mold. 20. The process of claim 19, wherein forming an overmold structure further comprises heating the core element prior to performing the injecting method. 21. The process of claim 17, wherein forming an overmold structure further comprises melting at least one of the ridges on the surface of the core element. 22. The process of claim 14, wherein forming an overmold structure further comprises encapsulating the core element within the overmold structure. 23. The process of claim 14, wherein forming a core element includes forming the core element to have a mass that is less than half of the mass of the overmold structure. 24. The process of claim 14, wherein forming a core element includes forming the core element to have a mass that is less than thirty percent of the mass of the overmold structure. 25. The process of claim 14, and further including the step of positioning at least one connector member adjacent to the core element prior to forming an overmold structure. 26. The process of claim 25, wherein forming a core element includes forming the core element to have a receptacle to receive the at least one connector member. 27. The process of claim 26, wherein positioning at least one circuit element includes electrically coupling the at least one connector member to the at least one circuit element. 28. The process of claim 27, wherein positioning at least one circuit element includes performing the electrical coupling by soldering or welding the at least one connector member to the at least one circuit element. 29. The process of claim 14, wherein the at least one circuit element includes multiple conductive traces, and further further comprising removing a selected portion of the multiple conductive traces. 30. The process of claim 19, wherein the mold includes at least one coupling member to couple to the core element, and wherein forming an overmold structure includes coupling the at least one coupling member to the core element prior to injecting thermoplastic material into the mold. 31. The process of claim 19, wherein the mold includes at least one coupling member to couple to the circuit element, and wherein forming an overmold structure includes coupling the at least one coupling member to the circuit element. 32. The process of claim 31, wherein coupling the at least one coupling member to the circuit element includes suspending the core element within a cavity of the mold. 33. A process for making a circuit assembly for use in an implantable medical device, comprising:forming a core element of thermoplastic material;positioning at least one circuit element adjacent to the core element; andforming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming an overmold structure includes positioning the core element and the at least one circuit element in a mold, injecting thermoplastic material into the mold, and heating the core element prior to performing the injecting method. 34. A process for making a circuit assembly for use in an implantable medical device, comprising:forming a core element of thermoplastic material;positioning at least one circuit element adjacent to the core element; andforming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming a core element includes forming ridges on the surface of the core element, and forming an overmold structure includes melting at least one of the ridges on the surface of the core element. 35. A process for making a circuit assembly for use in an implantable medical device, comprising:forming a core element of thermoplastic material;positioning at least one circuit element adjacent to the core element; andformi ng an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming an overmold structure includes positioning the core element and the at least one circuit element in a mold and injecting thermoplastic material into the mold, the mold including at least one coupling member to couple to the core element, and wherein forming an overmold structure includes coupling the at least one coupling member to the core element prior to performing the injecting method. 36. A process for making a circuit assembly for use in an implantable medical device, comprising:forming a core element of thermoplastic material;positioning at least one circuit element adjacent to the core element; andforming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming an overmold structure includes positioning the core element and the at least one circuit element in a mold and injecting thermoplastic material into the mold, the mold including at least one coupling member to couple to the at least one circuit element, and wherein forming an overmold structure includes coupling the at least one coupling member to the circuit element.