초록 ▼

A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member

A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the first board's top and bottom components to the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.

대표청구항 ▼

1. Cooling apparatus for stacked components, comprising:a first circuit board;first and second heat-generating components on first and second sides, respectively, of the first circuit board;a second circuit board;a thermally-conductive frame between the first and second circuit boards, the frame com

1. Cooling apparatus for stacked components, comprising:a first circuit board;first and second heat-generating components on first and second sides, respectively, of the first circuit board;a second circuit board;a thermally-conductive frame between the first and second circuit boards, the frame comprising a cross member;a heat distribution member adjacent the second circuit board on a side opposite the frame; anda thermally-conductive strap comprising first and second legs;wherein the cross-member is thermally coupled to the first component, the first leg is thermally coupled to the second component, and the second leg is thermally coupled to an end of the frame and to an end of the heat distribution member. 2. Cooling apparatus according to claim 1, further comprising:a heat sink thermally coupled to a side of the heat distribution member opposite the second circuit board. 3. Cooling apparatus according to claim 1, wherein:the strap is electrically-conductive; andthe first leg comprises:a substantially planar surface extending over a top side of the second component; anda wall extending between at least a portion of the substantially planar surface and an electrically-conductive trace on the first circuit board. 4. Cooling apparatus according to claim 3, wherein:the wall comprises three sections extending at least partially along three sides of a rectangular area that includes the second component. 5. Cooling apparatus according to claim 4, wherein:a transverse dimension of the second leg extends at least partially along the fourth side of the rectangular area. 6. Cooling apparatus according to claim 1, wherein:the first and second legs of the strap are joined at an elastic elbow. 7. Cooling apparatus according to claim 6, wherein:the strap comprises a unitary piece of metal; andthe elastic elbow comprises a portion of the unitary piece having a thickness less than that of either the first or the second legs. 8. Cooling apparatus according to claim 1, further comprising:a compliant thermally-conductive material interposed between the second leg and the end of the frame. 9. Cooling apparatus according to claim 1, further comprising:a compliant thermally-conductive material interposed between the second leg and the end of the heat distribution member. 10. Cooling apparatus according to claim 1, further comprising:a thermally-conductive material interposed between the first leg and the second component. 11. Cooling apparatus according to claim 1, further comprising:a thermally-conductive material interposed between the cross-member and the first component. 12. Cooling apparatus according to claim 1, wherein:the strap comprises copper.