초록 ▼

A mass flow sensor is described. To improve the membrane stability of the known mass flow sensor, in particular the reoxide layer which is present in the known mass flow sensor is replaced by a thicker PECVD silicon oxide layer. The thickness of the silicon oxide layer deposited on the platinum laye

A mass flow sensor is described. To improve the membrane stability of the known mass flow sensor, in particular the reoxide layer which is present in the known mass flow sensor is replaced by a thicker PECVD silicon oxide layer. The thickness of the silicon oxide layer deposited on the platinum layer is increased, and the known mass flow sensor is also provided with a cover layer of PECVD silicon nitride forming a moisture barrier.

대표청구항 ▼

1. A mass flow sensor, comprising:a frame formed at least in part by silicon;a membrane held by the frame;a metal layer including a first structure and a second structure and being arranged above the frame;a heating element formed by the first structure in the metal layer;at least one temperature me

1. A mass flow sensor, comprising:a frame formed at least in part by silicon;a membrane held by the frame;a metal layer including a first structure and a second structure and being arranged above the frame;a heating element formed by the first structure in the metal layer;at least one temperature measurement element formed by the second structure in the metal layer; anda moisture barrier arranged above the metal layer and formed at least in part by a nitride layer,wherein the moisture barrier is formed at least in part by a top sandwich system including at least one first silicon oxide layer and at least one first silicon nitride layer. 2. The mass flow sensor according to claim 1, wherein:the nitride layer is a silicon nitride layer. 3. The mass flow sensor according to claim 2, wherein:the nitride layer is formed by an operation selected from the group consisting of a PECVD operation, a LPCVD operation, and a CVD operation. 4. The mass flow sensor according to claim 1, wherein:the moisture barrier forms a top layer of the mass flow sensor. 5. The mass flow sensor according to claim 4, wherein:the moisture barrier is formed at least in part by a bottom sandwich system,the bottom sandwich system is arranged beneath the metal layer and includes at least one second silicon oxide layer and at least one second silicon nitride layer. 6. The mass flow sensor according to claim 5, wherein:at least one of the top sandwich system and the bottom sandwich system includes at least one silicon carbide layer. 7. The mass flow sensor according to claim 1, further comprising:a silicon oxide layer arranged directly beneath the metal layer. 8. The mass flow sensor according to claim 1, further comprising:a further nitride layer arranged between the frame and the metal layer. 9. The mass flow sensor according to claim 8, further comprising:a silicon oxide layer formed by a thermal oxidation and arranged between the further nitride layer. 10. The mass flow sensor according to claim 9, wherein:the further nitride layer includes a silicon nitride layer. 11. The mass flow sensor according to claim 9, further comprising:an oxide layer arranged in a recess area beneath the further nitride layer. 12. The mass flow sensor according to claim 9, further comprising:an oxide layer arranged in the membrane and below the metal layer; anda recess arranged beneath the further nitride layer;wherein the recess does not contain the oxide layer. 13. A mass flow sensor, comprising:a frame formed at least in part by silicon;a membrane held by the frame;a metal layer arranged above the frame;a heating element formed by a first stricture in the metal layer; andat least one temperature measurement element formed by a second structure in the metal layer, wherein at least one of:a top sandwich system including at least one first silicon oxide layer between at least two first silicon nitride layers is formed above the metal layer; anda bottom sandwich system including at least one second silicon oxide layer between at least two second silicon nitride layers is provided below the metal layer. 14. The mass flow sensor as recited in claim 13, wherein at least one of the top and bottom sandwich system includes:a silicon oxide layer;a silicon nitride layer on top of the silicon oxide layer;another silicon oxide layer on top of the silicon nitride layer;another silicon nitride layer on top of the other silicon oxide layer; anda further silicon oxide layer on top of the other silicon nitride layer. 15. The mass flow sensor as recited in claim 13, wherein:the bottom sandwich system in an area of the frame includes a silicon oxide layer as the bottom layer; andthe silicon oxide layer is removed in a recess area. 16. The mass flow sensor as recited in claim 13, wherein at least one layer is formed by one of a PECVD operation, an LPCVD operation, and another CVD operation. 17. The mass flow sensor as recited in claim 13, wherein at least one of the top and bottom sandwich systems in cludes a silicon carbide layer.