Active cooling system for CPU and semiconductors also enabling thermal acceleration
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
출원번호
US-0275979
(2001-05-22)
우선권정보
IL-136275 (2000-05-22)
국제출원번호
PCT/IL01/00462
(2001-05-22)
국제공개번호
WO01/90866
(2001-11-29)
발명자
/ 주소
Meir, Ronen
출원인 / 주소
Active Cool Ltd.
대리인 / 주소
Dennison, Schultz, Dougherty & MacDonald
인용정보
피인용 횟수 :
22인용 특허 :
11
초록▼
An active cooling system for the CPU of a computer having computer slots and motherboard, the cooling system including a card arranged to sit in a computer slot coupled to the motherboard and powered directly from mains via the computer slot, the card including a hot air outlet passage from inside t
An active cooling system for the CPU of a computer having computer slots and motherboard, the cooling system including a card arranged to sit in a computer slot coupled to the motherboard and powered directly from mains via the computer slot, the card including a hot air outlet passage from inside the computer to outside the computer; a cooling-CPU unit including a thermoelectric component (TEC) couplable to mains for power supply, a cold side heat sink coupled to the TEC and in thermally conductive contact with a part of the CPU, a hot side heat sink coupled to the TEC, and a fan distanced from the hot side heat sink for pulling heated air from the hot side heat sink.
대표청구항▼
1. An active cooling system for the CPU of a computer having computer slots and a motherboard, the cooling system comprising:a card arranged to sit in a computer slot coupled to the motherboard and powered directly from mains via said computer slot, the card including a hot air outlet passage from i
1. An active cooling system for the CPU of a computer having computer slots and a motherboard, the cooling system comprising:a card arranged to sit in a computer slot coupled to the motherboard and powered directly from mains via said computer slot, the card including a hot air outlet passage from inside the computer to outside the computer;a cooling-CPU unit including:a thermoelectric component (TEC) couplable to mains for power supply;a cold side heat sink coupled to said TEC and in thermally conductive contact with a part of the CPU;a hot side heat sink coupled to said TEC; anda fan distanced from said hot side heat sink for pulling heated air from said hot side heat sink. 2. The active cooling system of claim 1, further comprising a flexible hose coupled between said fan and said hot air outlet passage. 3. The active cooling system of claim 1, wherein said card includes a high power power supply, independent of an internal computer power supply. 4. The active cooling system of claim 3, wherein said card further includes batteries to provide back-up power in case of a power failure, to prevent thermal shock and water condensation. 5. The active cooling system of claim 1, further comprising a microprocessor in said cooling-CPU unit arranged to control temperature of the CPU by controlling operation of said TEC. 6. The active cooling system of claim 5, wherein said cooling-CPU unit further includes a temperature sensor for providing an output indication of CPU temperature to said microprocessor. 7. The active cooling system of any of the preceding claims, further comprising an alarm operative when said card and cooling-CPU unit are not receiving mains power but the computer is switched on. 8. The active cooling system of claim 2, further comprising a metal bracket for mounting said card in the slot, said bracket including a connector for providing mains power to said card SMPS AC/DC inverter that provides power to the active cooling system. 9. The active cooling system of claim 8, wherein said mains power is provided to a low-profile switch mode power supply occupying one computer slot. 10. The active cooling system of claim 9, wherein said low- profile switch mode power supply includes a planar transformer. 11. The active cooling system of claim 10, wherein power components of said switch mode power supply extend into said hot air outlet passage to provide cooling of said power components. 12. The active cooling system of any of the preceding claims, further comprising a visual display of CPU temperature. 13. The active cooling system of any of the preceding claims, further comprising a blue LED for providing an indication of operation of the system. 14. The active cooling system of any of the preceding claims, further comprising an extender on said cold side heat sink providing larger distance between the CPU and said hot side heat sink. 15. The active cooling system of any of the preceding claims, wherein the card is built into a custom PC power supply. 16. The active cooling system of claim 8, wherein said card works with an external DC source instead of an internal SMPS, by replacing the AC connector by a DC connector, and supplying DC voltage from an external power supply (linear or smps).
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이 특허에 인용된 특허 (11)
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