Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B24B-007/07
출원번호
US-0322428
(2002-12-19)
우선권정보
DE-0047180 (2002-10-02)
발명자
/ 주소
Ensinger, Wilfried
출원인 / 주소
Ensinger Kunststofftechnologie GBR
대리인 / 주소
Leydig, Voit & Mayer, Ltd.
인용정보
피인용 횟수 :
9인용 특허 :
16
초록▼
A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring being of integral design made of a plastic material, wherein the retaining ring forms on a first front side thereof a bearing surface for supporting the retaining ring
A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring being of integral design made of a plastic material, wherein the retaining ring forms on a first front side thereof a bearing surface for supporting the retaining ring on a polishing surface of the polishing apparatus, and includes on the side thereof lying opposite the first front side thereof in axial direction fitting elements for fitting the retaining ring on the polishing apparatus.
대표청구항▼
1. A retaining ring for a chemical mechanical polishing apparatus for semiconductor wafers, comprising:a retaining ring of integral design made of a plastic material, the retaining ring comprising a metal ring embedded in the plastic material and arranged concentrically in the retaining ring, wherei
1. A retaining ring for a chemical mechanical polishing apparatus for semiconductor wafers, comprising:a retaining ring of integral design made of a plastic material, the retaining ring comprising a metal ring embedded in the plastic material and arranged concentrically in the retaining ring, wherein the retaining ring forms on a first front side thereof a bearing surface for supporting the retaining ring on a polishing surface of the polishing apparatus, and includes on the side thereof lying opposite the first front side thereof in axial direction fitting elements for fitting the retaining ring on the polishing apparatus. 2. The retaining ring according to claim 1, wherein the retaining ring comprises at least two layers. 3. The retaining ring according to claim 2, wherein the plastic material comprises at least one of a thermoplastic material, a thermosetting plastic material, and an elastomer. 4. The retaining ring according to claim 2, wherein the plastic material is a reinforced plastic material. 5. The retaining ring according to claim 4, wherein the plastic material is a fiber-reinforced plastic material. 6. The retaining ring according to claim 5, wherein the plastic material has a lower content of reinforcement substances adjacent to its first front side than on its side including the fitting elements. 7. The retaining ring according to claim 1, wherein the plastic material comprises at least one of a thermoplastic material, a thermosetting plastic material, and an elastomer. 8. The retaining ring according to claim 7, wherein the plastic material is a reinforced plastic material. 9. The retaining ring according to claim 8, wherein the plastic material is a fiber-reinforced plastic material. 10. The retaining ring according to claim 1, wherein the plastic material is a reinforced plastic material. 11. The retaining ring according to claim 10, wherein the plastic material is a fiber-reinforced plastic material. 12. The retaining ring according to claim 10, wherein the plastic material has a lower content of reinforcement substances adjacent to its first front side than on its side including the fitting elements. 13. The retaining ring according to claim 1, wherein abrasion-reducing additives are admixed with the plastic material. 14. The retaining ring according to claim 1, wherein the fitting elements are held on the metal ring. 15. The retaining ring according to claim 1, wherein the metal ring is completely encased by the plastic material. 16. The retaining ring according to claim 1, wherein the metal ring is a sheet metal ring. 17. The retaining ring according to claim 16, wherein the sheet metal ring is a perforated sheet metal ring. 18. The retaining ring according to claim 17, wherein the sheet metal ring has the shape of an annular disk. 19. The retaining ring according to claim 16, wherein the sheet metal ring has a substantially cylindrical shape. 20. The retaining ring according to claim 1, wherein wear-reducing additives are admixed with the plastic material. 21. The retaining ring according to claim 1, wherein abrasion-reducing and wear-reducing additives are admixed with the plastic material. 22. The retaining ring according to claim 1, wherein the metal ring is uncovered by the plastic material on the side of the retaining ring lying opposite the first front side.
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이 특허에 인용된 특허 (16)
Fruitman Clinton, Apparatus for holding workpieces during lapping, honing, and polishing.
Hung Chih Chen ; Steven M. Zuniga ; Bret W. Adams ; Manoocher Birang ; Kean Chew, Determining when to replace a retaining ring used in substrate polishing operations.
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