초록 ▼

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stabl

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

대표청구항 ▼

1. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the maleimide-containing compound comprises maleimide functional groups separated by a polyvalent radical and wherein said maleimid

1. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the maleimide-containing compound comprises maleimide functional groups separated by a polyvalent radical and wherein said maleimide-containing compound is a liquid. 2. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the maleimide-containing compound is selected from the group of maleimides prepared by reaction of maleic anhydride with dimer amides, wherein said amides are prepared from aminopropyl-terminated polydimethyl siloxanes, polyoxypropylene amines, polytetramethyleneoxide-di-p-aminobenzoates, and combinations thereof. 3. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the maleimide-containing compound is selected from the group consisting of stearyl maleimide, oleyl maleimide, behenyl maleimide, 1,20-bismaleimido-10,11-dioctyl-eicosane and combinations thereof. 4. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the vinyl ether component has a chemical structure comprising 0.1 —CR═CHR] q   (II)wherein q is 1, 2 or 3, each R is independently hydrogen or lower alkyl, each Q is independently —O—, —O—C(O)—, —C(O)— or —C(O)—O—, and Y is saturated straight or branched chain alkyl, alkylene or alkylene oxide, optionally containing saturated cyclic moieties as substituents on said alkyl, alkylene or alkylene oxide chain or as part of the backbone of the alkyl, alkylene or alkylene oxide chain, wherein said alkyl, alkylene or alkylene oxide species have at least 6 carbon atoms. 5. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the vinyl ether component is selected from the group consisting of stearyl vinyl ether, behenyl vinyl ether, eicosyl vinyl ether, isoeicosyl vinyl ether, isotetracosy vinyl ether, poly (tetrahydrofuran) divinyl ether, tetraethylene glycol divinyl ether, tris-2,4,6-(1-vinyloxybutane-4-oxy-1,3,5-triazine, bis-1,3-(1-vinyloxybutane-4-) oxycarbonyl-benzene, divinyl ethers (prepared by palladium-catalyzed transvinylation of a vinyl ether with a di-alcohol having a higher molecular weight than said vinyl ether), and combinations thereof. 6. A method for adhesively attaching a chip die to a circuit board, comprising:(a) applying to said chip die a die attach composition comprising a maleimide-containing compound; a (meth)acrylate component; a vinyl ether component; and a free radical cure initiator,(b) adjoining said chip die with said circuit board to form an assembly wherein said chip die and said circuit board are separated by the composition applied in step (a),(c) subjecting said assembly formed in step (b) to conditions suitable to cure composition,wherein conditions suitable to cure said composition include a temperature of less than 200° C. for about 0.25 up to 2 minutes. 7. A method for adhesively attaching a chip die to a circuit board, comprising:(a) applying to said chip die a die attach composition comprising a maleimide-containing compound; a (meth)acrylate component; a vinyl ether component; and a free radical cure initiator,(b) adjoining said chip die with said circuit board to form an assembly wherein said chip die and said circuit board are separated by the composition applied in step (a),(c) subjecting said assembly formed in step (b) to conditions suitable to cure composition,wherein the die attach composition comprises a liquid maleimide-containing compound comprising a spacer between maleimide functional groups, said spacer comprising a branched chain alkylene. 8. A method for adhesively attaching a chip die to a circuit board, comprising:(a) applying to said circuit board a die attach composition comprising a maleimide-containing compound; a (meth)acrylate component; a vinyl ether component; and a free radical cure initiator,(b) adjoining said circuit board to said chip die to form an assembly wherein said chip die and said circuit board are separated by the composition applied in step (a), and(c) subjecting said assembly formed in step (b) to conditions suitable to cure said composition,wherein conditions suitable to cure said composition include a temperature of less than 200° C. for about 0.25 up to 2 minutes. 9. A method for adhesively attaching a chip die to a circuit board, comprising:(a) applying to said circuit board a die attach composition comprising a maleimide-containing compound; a (meth)acrylate component; a vinyl ether component; and a free radical cure initiator,(b) adjoining said circuit board to said chip die to form an assembly wherein said chip die and said circuit board are separated by the composition applied in step (a), and(c) subjecting said assembly formed in step (b) to conditions suitable to cure said composition,wherein the die attach composition comprises a liquid maleimide-containing compound comprising a branched chain alkylene between maleimide functional groups. 10. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the maleimide functional cups of the maleimide-containing compound are separated by a polyvalent radical and wherein said maleimide-containing compound is a liquid. 11. A composition comprising:(a) a maleimide-containing compound;(b) a (meth)acrylate component;(c) a vinyl ether component; and(d) a free radical cure initiator,wherein the composition is substantially free of inert diluent. 12. The composition of any one of claims 1 - 3 , wherein the vinyl ether component has a chemical structure comprising 0,1 —CR═CHR] q   (II)wherein q is 1, 2 or 3, each R is independently hydrogen or lower alkyl, each Q is independently —O—, —O—C(O)—, —C(O)— or —C(O)—O—, and Y is saturated straight or branched chain alkyl, alkylene or alkylene oxide, optionally containing saturated cyclic moieties as substituents on said alkyl, alkylene or alkylene oxide chain or as part of the backbone of the alkyl, alkylene or alkylene oxide chain, wherein said alkyl, alkylene or alkylene oxide species have at least 6 carbon atoms. 13. The composition of any one of claims 1 - 3 , wherein the vinyl ether component is selected from the group consisting of stearyl vinyl ether, behenyl vinyl ether, eicosyl vinyl ether, isoeicosyl vinyl ether, isotetracosyl vinyl ether, poly(tetra-hydrofuran)divinyl ether, tetraethylene glycol divinyl ether, tris-2,4,6-(1-vinyloxybutane-4-oxy-1,3,5-triazine, bis-1,3-(1-vinyloxybutane-4) oxycarbonyl-benzene, divinyl ethers (prepared by palladium-catalyzed transvinylation of a vinyl ether with a di-alcohol having a higher molecular weight than said vinyl ether), and combinations thereof. 14. The method of claim 6, wherein the die attach composition comprises a liquid maleimide-containing compound comprising a spacer between maleimide functional groups, said spacer comprising a branched chain alkylene. 15. The composition of any one of claims 1 - 3 , wherein the maleimide functional cups of the maleimide-containing compound are separated by a polyvalent radical and wherein said maleimide-containing compound a liquid. 16. The composition of any one of claims 1 - 3 , wherein said composition is substantially free of inert diluent. 17. The composition of claim 15, wherein the vinyl ether component has a chemical structure com prising 0,1 —CR═CHR] q   (II)wherein q is 1, 2 or 3, each R is independently hydrogen or lower alkyl, each Q is independently —O—, —O—C(O)—, —C(O)— or —C(O)—O—, and Y is saturated straight or branched chain alkyl, alkylene or alkylene oxide, optionally containing saturated cyclic moieties as substituents on said alkyl, alkylene or alkylene oxide chain or as part of the backbone of the alkyl, alkylene or alkylene oxide chain, wherein said alkyl, alkylene or alkylene oxide species have at least 6 carbon atoms. 18. The composition of claim 16, wherein the vinyl ether component has a chemical structure comprising 0,1 —CR═CHR] q   (II)wherein q is 1, 2 or 3, each R is independently hydrogen or lower alkyl, each Q is independently —O—, —O—C(O)—, —C(O)— or —C(O)—O—, and Y is saturated straight or branched chain alkyl, alkylene or alkylene oxide, optionally containing saturated cyclic moieties as substituents on said alkyl, alkylene or alkylene oxide chain or as part of the backbone of the alkyl, alkylene or alkylene oxide chain, wherein said alkyl, alkylene or alkylene oxide species have at least 6 carbon atoms. 19. The composition of claim 15, wherein the vinyl ether component is selected from the group consisting of stearyl vinyl ether, behenyl vinyl ether, eicosyl vinyl ether, isoeicosyl vinyl ether, isotetracosyl vinyl ether, poly(tetra-hydrofuran)divinyl ether, tetraethylene glycol divinyl ether, tris-2,4,6-(1-vinyloxybutane-4-oxy-1,3,5-triazine, bis-1,3-(1-vinyloxybutane-4-) oxycarbonyl-benzene, divinyl ethers (prepared by palladium-catalyzed transvinylation of a vinyl ether with a di-alcohol having a higher molecular weight than said vinyl ether), and combinations thereof. 20. The composition of claim 16, wherein the vinyl ether component is selected from the group consisting of stearyl vinyl ether, behenyl vinyl ether, eicosyl vinyl ether, isoeicosyl vinyl ether, isotetracosyl vinyl ether, poly(tetra-hydrofuran)divinyl ether, tetraethylene glycol divinyl ether, tris-2,4,6-(1-vinyloxybutane-4-oxy-1,3,5-triazine, bis-1,3-(1-vinyloxybutane-4-) oxycarbonyl-benzene, divinyl ethers (prepared by palladium-catalyzed transvinylation of a vinyl ether with a di-alcohol having a higher molecular weight than said vinyl ether), and combinations thereof.