초록 ▼

A method and apparatus for coating a substrate with a deposition material in a vacuum wherein a material source having a substantially longitudinal deposition emission component is used to create a substantially longitudinal material deposition emission plume which coats the surface of the substrate

A method and apparatus for coating a substrate with a deposition material in a vacuum wherein a material source having a substantially longitudinal deposition emission component is used to create a substantially longitudinal material deposition emission plume which coats the surface of the substrate without increasing the throw distance between the substrate and the material source.

대표청구항 ▼

1. A material source for use in vacuum deposition of a deposition material onto a surface of a substrate, said material source comprising:a body having a base and extending along a substantially longitudinal axis, said body defining an interior cavity and having at least one substantially longitudin

1. A material source for use in vacuum deposition of a deposition material onto a surface of a substrate, said material source comprising:a body having a base and extending along a substantially longitudinal axis, said body defining an interior cavity and having at least one substantially longitudinal exit aperture fluidly connected to said interior cavity;a heating element positioned in and spaced from an interior wall of said body, said heating element extending in an axis substantially parallel to said longitudinal axis of said body and having at least one substantially longitudinal exit aperture;a deposition material positioned within said heating element and having at least one of low temperature evaporation characteristics and sublimation characteristics; anda temperature sensing probe in at least one of direct contact and indirect contact with said deposition material and configured to measure the temperature of said deposition material;wherein said heating element comprises an electrically resistive circuit conformal upon an outer surface of the heating element and at least one electrical connection powering said electrical circuit;wherein said body of said material source and said body of said heating element are rotatable with respect to each other, such that said exit aperture of said body of said material source is misalignable with said exit aperture of said heating element. 2. The material source of claim 1, wherein said temperature probe directly contacts said deposition material and measures the temperature of said deposition material. 3. The material source of claim 1, wherein said temperature probe indirectly measures the temperature of said deposition material by contact with one of said heater element, said body of said material source, and a crucible having a body substantially surrounding said deposition material. 4. The material source of claim 1, further comprising a crucible having a body substantially surrounding said deposition material and having at least one exit aperture. 5. The material source of claim 4, wherein said exit aperture of said crucible comprises a plurality of exit apertures variable in size and configured, in conjunction with said exit aperture of said heating element and with said exit aperture of said body of said material source, to create a desired emission flux profile. 6. The material source of claim 4, wherein said exit aperture of said crucible comprises a plurality of exit apertures variable in spacing and configured, in conjunction with said exit aperture of said heating element and with said exit aperture of said body of said material source, to create a desired emission flux profile. 7. The material source of claim 1, further comprising a process control apparatus in communication with at least one of said body of said material source and said body of said heating element. 8. The material source of claim 1, wherein said deposition material is an organic-based chemical compound. 9. The material source of claim 1, wherein said deposition material exhibits at least one of an evaporation and a sublimation threshold between about 100° C. and about 600° C. 10. The material source of claim 1, further comprising at least one removably attachable end cap positioned on the axial end of said body of said material source for providing access for said deposition material. 11. The material source of claim 1, wherein said heating element includes a higher concentration of heating capacity adjacent an upper portion of said heating element, thereby providing a vertical temperature gradient in the heating element. 12. A system for vacuum deposition of material onto the surface of a substrate, said system comprising:an evacuated vacuum chamber;a material source, including:(i) a body extending along a substantially longitudinal axis and defining an interior cavity and having a base, said body having at least one substantially longitudinal exit aperture fluidly connected to said i nterior cavity;(ii) a heating element positioned in and spaced from an interior wall of said body, said heating element extending in an axis substantially parallel to said longitudinal axis of said body and having at least one substantially longitudinal exit aperture, said heating element comprising an electrical circuit conformal upon an outer surface of said heating element, said circuit comprising alternating layers of an electrically insulating dielectric material and an electrically conductive metallic material;(iii) a deposition material positioned within said heating element and having at least one of low temperature evaporation characteristics and sublimation characteristics; and(iv) a temperature sensing probe in at least one of direct contact and indirect contact with said deposition material and configured to measure the temperature of said deposition material;a power supply electrically connected to said metallic material of said heating element; andan intelligent controller for modulating said electrical power supply to achieve a desired vapor emission rate, said modulation based upon feedback from at least one of said temperature sensing probe and an emission monitor;wherein said deposition material is heated by said heating element, said deposition material emitted through said exit aperture of said heating element and through said exit aperture of said body and onto said substrate, thereby forming a coating. 13. The system of claim 12, wherein said intelligent controller is in communication with and receives feedback from said temperature sensing probe. 14. The system of claim 12, wherein said temperature sensing probe is a thermocouple. 15. The system of claim 14, wherein said thermocouple is a Type “K” thermocouple. 16. The system of claim 12, wherein said temperature sensing probe is a resistive temperature detector. 17. The system of claim 12, wherein said modulation is based upon feedback from an emission monitor, wherein the emission monitor is configured to measure the rate of vaporized material flux. 18. The system of claim 17, wherein the intelligent controller is in communication with and receives feedback from said emission monitor. 19. The system of claim 17, wherein said emission monitor is a quartz crystal microbalance. 20. The system of claim 12, wherein said substrate includes a width measured parallel to the longitudinal axis of said body, wherein a throw distance, measured between one side of said substrate and said exit aperture, remains constant as said width of said substrate increases. 21. The system of claim 12, wherein said substrate includes a width measured parallel to the longitudinal axis of said body, wherein a substantial longitudinal component of said body of said material source is equal to said width of said substrate. 22. The system of claim 12, further comprising a substrate transport mechanism configured to move said substrate through a vapor flux at a constant velocity. 23. The system of claim 12, further comprising at least one removably attachable end cap positioned adjacent the axial end of said body of said material source. 24. The system of claim 12, wherein said heating element is configured with a concentration of heating capacity adjacent said longitudinal exit aperture to create a vertical temperature gradient through at least one of said heater element and said deposition material. 25. The system of claim 12, wherein said deposition material is an organic-based chemical compound. 26. The system of claim 12, wherein said dielectric material is at least one of alumina, glass and ceramic. 27. The system of claim 12, wherein said metallic material is at least one of molybdenum, nickel, nickel-chrome, titanium, tungsten and iron-chromium-aluminum. 28. The system of claim 12, wherein said electrical circuit of said heating element is embedded within said heating element. 29. The system of claim 12, wherein said deposition material exhibits at least one of a n evaporation and a sublimation threshold between about 100° C. and about 600° C. 30. The system of claim 12, further comprising a crucible having a body substantially surrounding said deposition material and having at least one exit aperture. 31. The system of claim 30, wherein said exit aperture of said crucible comprises a plurality of exit apertures variable in size and configured, in conjunction with said exit aperture of said heating element and with said exit aperture of said body of said material source, to create a desired emission flux profile. 32. The system of claim 30, wherein said exit aperture of said crucible comprises a plurality of exit apertures variable in spacing and configured, in conjunction with said exit aperture of said heating element and with said exit aperture of said body of said material source, to create a desired emission flux profile. 33. A method of coating a substrate using a material source and a vacuum chamber comprising the steps of:(a) positioning said material source in said vacuum chamber, said material source having a body with a base and extending along a longitudinal axis, said body having a substantial longitudinal emission component, defining an interior cavity, having an exit aperture fluidly connected to said interior cavity, and having an upper end positioned adjacent to said exit aperture;(b) positioning a substrate in said vacuum chamber opposite said material source exit aperture;(c) loading a deposition material in said interior cavity of said body of said material source via a removably attachable access port positioned on an axial end of said material source;(d) evacuating said vacuum chamber to create a vacuum;(e) heating said deposition material in said internal cavity of said body along the longitudinal axis of said body, such that the temperature of the deposition material is sufficient to volatilize and degas contaminants and is below at least one of an evaporation and a sublimation threshold of the deposition material;(f) heating, via a powered heat source, and volatilizing said deposition material;(g) emitting vaporized deposition material at an emission rate and from the exit aperture of said body;(h) controlling the emission rate by controlling the power supplied to said heat source;(i) moving said substrate through said vaporized deposition material at a velocity proportional to said emission rate, thereby providing a desired coating thickness;wherein the deposition material is heated by a heating element comprising an electrically resistive circuit conformal upon an outer surface of said heating element. 34. The method of claim 33, further comprising the step of unloading said deposition material from said interior cavity of said body. 35. The method of claim 33, further comprising the step of repeating steps (b)-(i) with at least one of said deposition material and a subsequent deposition material. 36. The method of claim 33, wherein said substrate is moving through said vaporized deposition material at a constant velocity.