초록 ▼

A crystal package that contains two or more crystals that resonate at differing frequencies. The crystal package has a substrate with a top surface, a bottom surface, and side surfaces. A cavity is located in the top surface. A pair of steps are located in the cavity. A crystal is mounted to one of

A crystal package that contains two or more crystals that resonate at differing frequencies. The crystal package has a substrate with a top surface, a bottom surface, and side surfaces. A cavity is located in the top surface. A pair of steps are located in the cavity. A crystal is mounted to one of the steps and extends over the cavity. Another crystal is mounted to the other step and extends over the first crystal. The steps are at different heights above the bottom surface. Electronic circuitry may also be mounted within the crystal package.

대표청구항 ▼

1. A crystal package comprising:a) an insulative substrate having a top surface, a bottom surface, and side surfaces;b) a cavity located in the top surface;c) a first step located in the cavity;d) a second step located in the cavity;e) a first crystal mounted to the first step and extending over the

1. A crystal package comprising:a) an insulative substrate having a top surface, a bottom surface, and side surfaces;b) a cavity located in the top surface;c) a first step located in the cavity;d) a second step located in the cavity;e) a first crystal mounted to the first step and extending over the cavity, the first crystal operating at a first frequency; andf) a second crystal mounted to the second step and extending over the first crystal, the second crystal operating at a second frequency. 2. The crystal package according to claim 1, wherein the first crystal consumes less power during operation than the second crystal. 3. The crystal package according to claim 1, wherein at least one contact pad is located on each step, each crystal having an electrode electrically connected to the contact pad. 4. The crystal package according to claim 3, wherein a metal bump connects the electrode to the contact pad. 5. The crystal package according to claim 3, wherein a conductive adhesive connects the electrode to the contact pad. 6. The crystal package according to claim 3, wherein a conductive adhesive connects the electrode to the contact pad. 7. The crystal package according to claim 3, wherein a conductive via extends through the substrate between the contact pad and the bottom surface. 8. The crystal package according to claim 6, wherein a termination pad is located on the bottom surface and is electrically connected to the via. 9. The crystal package according to claim 8, wherein a cover seals the cavity. 10. The crystal package according to claim 1, wherein an electronic circuit is mounted in the cavity and electrically connected to the first and second crystals. 11. The crystal package according to claim 1, wherein the substrate has a second cavity in the bottom surface, an electronic circuit mounted in the second cavity and electrically connected to the first and second crystals. 12. A crystal package comprising:a) a substrate having a cavity therein, the cavity defining inner side walls and having a bottom surface;b) a first and second step located in the cavity, the first and second step located on opposing side walls, the first and second steps being at differing heights above the bottom surface;c) a first crystal mounted to the first step and extending over the cavity toward the second step; andd) a second crystal mounted to the second step and extending over the first crystal toward the first step. 13. The crystal package according to claim 12, wherein the first crystal resonates at a first frequency and the second crystal resonates at a second frequency. 14. The crystal package according to claim 13, wherein the first crystal consumes less power during operation than the second crystal. 15. The crystal package according to claim 12, wherein at least one contact pad is located on each step, each crystal having an electrode electrically connected to the contact pad. 16. The crystal package according to claim 15, wherein a metal bump connects the electrode to the contact pad. 17. The crystal package according to claim 15, wherein a conductive adhesive connects the electrode to the contact pad. 18. The crystal package according to claim 15, wherein a conductive via extends through the substrate between the contact pad and the bottom surface. 19. The crystal package according to claim 18, wherein a termination pad is located on the bottom surface and is electrically connected to the via. 20. The crystal package according to claim 12, wherein a cover seals the cavity. 21. The crystal package according to claim 12 wherein an electronic circuit is mounted in the cavity and electrically connected to the first and second crystals. 22. The crystal package according to claim 12, wherein the substrate has a second cavity in the bottom surface, an electronic circuit mounted in the second cavity and electrically connected to the first and second crystals.