초록 ▼

An electronic controller module including a heat-resistant material to substantially surround and physically protect the controller, at least one electrically-conductive member to provide input or output of at least one electrical signal through the material to the controller, and a heat-resistant l

An electronic controller module including a heat-resistant material to substantially surround and physically protect the controller, at least one electrically-conductive member to provide input or output of at least one electrical signal through the material to the controller, and a heat-resistant lid including a heat sink configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the electronic controller, wherein the material and the lid are operatively associated to completely surround the controller. These modules are particularly suitable for use in automotive applications.

대표청구항 ▼

1. An electronic controller module comprising:an electronic controller that generates at least about 15 W of heat;an enclosure that includes a lid and is made of at least one heat-resistant material configured and dimensioned to surround and physically protect the controller;at least one electricall

1. An electronic controller module comprising:an electronic controller that generates at least about 15 W of heat;an enclosure that includes a lid and is made of at least one heat-resistant material configured and dimensioned to surround and physically protect the controller;at least one electrically-conductive member to provide input or output of at least one electrical signal through the enclosure to the controller; anda heat sink operatively associated with the controller to receive heat therefrom, the heat sink being configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the controller and enclosure, wherein the lid is made of heat-resistant material and the heat sink comprises a heat fin assembly mounted upon the lid that extends away therefrom. 2. The module of claim 1, wherein the lid acts as the heat sink and comprises one or more of aluminum, copper, or thermally conductive plastic. 3. The module of claim 1, wherein a portion of the heat sink extends through the lid to a position adjacent the controller. 4. The module of claim 1, wherein the heat sink comprises aluminum, copper, a thermally conductive plastic, or a combination thereof. 5. The module of claim 1, wherein the heat-resistant material comprises a polyamide-polypropylene copolymer. 6. The module of claim 5, wherein the polyamide comprises nylon units. 7. The module of claim 6, wherein the polyamide-polypropylene copolymer further comprises a filler including talc, glass, ceramic, mica, silicate, clay, aramid, lithopone, silicon carbide, diatomaceous earth, carbonates, metal or an alloy or oxide thereof, particulate carbonaceous material, hard particulate material, or combinations thereof. 8. The module of claim 1, wherein the electronic controller is a linear controller capable of facilitating temperature control in an environment. 9. The module of claim 1, wherein the enclosure is at least substantially rectangular having dimensions of about 3 cm to 8 cm in length, about 1 cm to 4 cm in height, and about 3 cm to 6 cm in width. 10. An electronic controller module comprising:an electronic controller that generates at least about 15 W of heat;an enclosure made of at least one heat-resistant material configured and dimensioned to surround and physically protect the controller;at least one electrically-conductive member to provide input or output of at least one electrical signal through the enclosure to the controller; anda heat sink operatively associated with the controller to receive heat therefrom, the heat sink being configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the controller and enclosure, wherein the enclosure is at least substantially rectangular having dimensions of about 3 cm to 8 cm in length, about 1 cm to 4 cm in height, and about 3 cm to 6 cm in width, and wherein the heat sink comprises at least two short fins having a length of about 0.25 cm to 1 cm and at least two long fins having a length of about 1.5 cm to 6 cm, each adjacent the enclosure at one end thereof and extending away therefrom. 11. The module of claim 10, wherein the at least two long heat fins comprise a first heat fin having a length of about 1.75 cm to 2.25 cm and a second heat fin having a length of about 3.5 cm to 4.5 cm. 12. The module of claim 2, wherein the lid and the enclosure are operatively associated via a plurality of projections and gaps to permit the lid to securely snap into place against the enclosure so as to collectively completely surround the electrical controller. 13. An electronic controller module comprising:an electronic controller that generates at least about 15 W of heat;an enclosure that includes a lid and is made of at least one heat-resistant material configured and dimensioned to surround and physically protect the controller;at least one electrically-conductive member to provide input or output of at least one electrical signal through the enclosure to the controller;a heat sink operatively associated with the controller to receive heat therefrom; the heat sink being configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the controller and enclosure; andfurther comprising an electrically insulating but thermally conductive member between the controller and the lid and in contact therewith to inhibit or avoid degradation of the controller. 14. The module of claim 13, wherein the electrically insulating but thermally conductive member comprises at least one silicone material that is not a grease and is sufficiently flexible to at least partially conform to the controller. 15. The module of claim 1 further comprising a thermal grout disposed between the heat fin assembly and the heat-resistant lid to inhibit or prevent the flow of water into the module. 16. An electronic controller module comprising:an electronic controller that generates at least about 15 W of heat;an enclosure made of at least one heat-resistant material configured and dimensioned to surround and physically protect the controller;at least one electrically-conductive member to provide input or output of at least one electrical signal through the enclosure to the controller; anda heat sink operatively associated with the controller to receive heat therefrom, the heat sink being configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the controller and enclosure, wherein the enclosure includes a lid which acts as the heat sink and comprises one or more of aluminum, copper, or thermally conductive plastic, and wherein the controller comprises a single circuit board having all controller components mounted thereon that is surrounded by the enclosure and the lid. 17. A method for dissipating heat from an electronic controller which comprises:providing an enclosure comprising an olefinic polymer including amide units around the electronic controller which generates at least about 15 W of heat during operation;associating a heat sink with the controller to receive heat therefrom; anddissipating a sufficient amount of heat to inhibit or avoid damage to the controller and enclosure. 18. The method of claim 17, wherein at least about 90 percent of the heat generated is dissipated via the heat sink. 19. The module of claim 5, wherein the olefinic polymer further comprises talc, mica, or glass.