IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0427479
(2003-05-01)
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발명자
/ 주소 |
- Duxbury, Guy A.
- Mistry, Balwantrei V.
- Lentz, Donald J.
|
출원인 / 주소 |
|
대리인 / 주소 |
Steubing and McGuiness & Manaras LLP
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
5 |
초록
▼
A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least parti
A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least partially thermally isolated from other heat sinks to mitigate heat flow from high-power components to heat sensitive components. Further, all of the heat sinks associated with the circuit package are electrically coupled to provide electromagnetic shielding. A thermally insulative and electrically conductive gasket is employed to couple adjacent heat sinks.
대표청구항
▼
1. A heat dissipating device for use with a circuit package having a plurality of components, comprising:a first heat dissipating portion for thermally coupling with a first component of the circuit package;a second heat dissipating portion for thermally coupling with a second component of the circu
1. A heat dissipating device for use with a circuit package having a plurality of components, comprising:a first heat dissipating portion for thermally coupling with a first component of the circuit package;a second heat dissipating portion for thermally coupling with a second component of the circuit package; andan electrically conductive and thermally insulative portion connected to the first and second heat dissipating portions for the purpose of electrically connecting and for the purpose of at least partially thermally isolating the first heat dissipating portion from the second heat dissipating portion. 2. The heat dissipating device of claim 1, wherein the first heat dissipating portion is substantially completely thermally isolated from the second heat dissipating portion. 3. The heat dissipating device of claim 1, wherein the electrically conductive and thermally insulative portion is made of a material selected from the group including CHO-SEAL® and Cho-Form®. 4. The heat dissipating device of claim 1, wherein the first and second heat dissipating portions are constructed of a material selected from the group including aluminum, alloys containing aluminum, copper and alloys containing copper. 5. The heat dissipating device of claim 1, wherein the first and second heat dissipating portions include pin shaped elements. 6. The heat dissipating device of claim 1, where the first heat dissipating portion dissipates heat at a first rate, and wherein the second heat dissipating portion dissipates heat at a second rate, and wherein the first rate is greater than the second rate during operation. 7. The heat-dissipating device of claim 6, wherein the second heat dissipating portion comprises a heat dissipating portion for thermally coupling with a laser. 8. The heat-dissipating device of claim 1, wherein the second heat dissipating portion comprises a heat dissipating portion for thermally coupling with a laser. 9. The heat-dissipating device of claim 1, wherein the first heat dissipating portion has a cavity adapted to receive the first component. 10. The heat-dissipating device of claim 9, wherein the second heat dissipating portion has a cavity adapted to receive the second component. 11. The heat-dissipating device of claim 1, wherein the electrically conductive and thermally insulative portion fills a gap between the first and second heat dissipating portions. 12. The heat-dissipating device of claim 1, wherein the first and second heat dissipating portions are heat sinks. 13. The heat-dissipating device of claim 1, wherein the electrically conductive and thermally insulative portion comprisesan electrically conductive portion connected to the first and second heat dissipating portions; anda thermally insulative portion. 14. The heat-dissipating device of claim 13, wherein the electrically conductive portion is located along a perimeter of the thermally insulative portion. 15. The heat-dissipating device of claim 14, wherein the electrically conductive portion is a plating applied to an edge of the thermally insulative portion. 16. The heat-dissipating device of claim 13, wherein the electrically conductive portion is at least one physical connection between the first and second heat dissipating portions. 17. The heat-dissipating device of claim 16, wherein the thermally insulative portion occupies at least a portion of a space between the first and second heat dissipating portions. 18. A circuit package, comprising:a first component;a first heat dissipating portion attached to and thermally coupled with the first component;a second component;a second heat dissipating portion attached to and thermally coupled with the second component; andan electrically conductive and thermally insulative portion coupled with the first and second heat dissipating portions for the purpose of electrically connecting and for the purpose of at least partially thermally isolating the first heat dissipating portion from the second heat dissipating portion. 19. The circuit package of claim 18, wherein the first heat dissipating portion is substantially completely thermally isolated from the second heat dissipating portion. 20. The circuit package of claim 18, wherein the electrically conductive and thermally insulative portion is made of a material selected from the group including CHO-SEAL® and Cho-Form®. 21. The circuit package of claim 18, wherein the first and second heat dissipating portions are constructed of a material selected from the group including aluminum, alloys containing aluminum, copper and alloys contain copper. 22. The circuit package of claim 18, wherein the first and second heat dissipating portions include pin shaped elements. 23. The circuit package of claim 18, wherein the first component and second component dissipate heat, and wherein the first component dissipates more heat than the second component during operation. 24. The circuit package of claim 23, further comprising an air mover that moves air such that the air is moved over the second heat dissipating portion before the air is moved over the first heat dissipating portion. 25. The circuit package of claim 18, wherein the second component comprises a laser. 26. The circuit package of claim 18, wherein the first heat dissipating portion has a cavity that receives the first component. 27. The circuit package of claim 26, wherein the second heat dissipating portion has a cavity that receives the second component. 28. The circuit package of claim 18, wherein the second heat dissipating portion has a cavity that receives the second component. 29. The circuit package of claim 18, wherein the electrically conductive and thermally insulative portion fills a gap between the first and second heat dissipating portions. 30. The circuit package of claim 18, wherein the first and second heat dissipating portions are heat sinks. 31. The circuit package of claim 18, wherein the electrically conductive and thermally insulative portion comprisesan electrically conductive portion connected to the first and second heat dissipating portions; anda thermally insulative portion. 32. The circuit package of claim 31, wherein the electrically conductive portion is located along a perimeter of the thermally insulative portion. 33. The circuit package of claim 32, wherein the electrically conductive portion is a plating applied to an edge of the thermally insulative portion. 34. The circuit package of claim 31, wherein the electrically conductive portion is at least one physical connection between the first and second heat dissipating portions. 35. The circuit package of claim 34, wherein the thermally insulative portion occupies at least a portion of a space between the first and second heat dissipating portions.
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