초록 ▼

A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force,

A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.

대표청구항 ▼

1. A method of holding a flat object, comprising:applying a periphery of an adhesive protection tape to a frame; adhering the flat object to the adhesive protection tape; fixing the frame on a holder having a flat object supporting area so that the flat object is supported on the flat object support

1. A method of holding a flat object, comprising:applying a periphery of an adhesive protection tape to a frame; adhering the flat object to the adhesive protection tape; fixing the frame on a holder having a flat object supporting area so that the flat object is supported on the flat object supporting area and the adhesive protection tape is located between the flat object and the flat object supporting area; placing the holder supporting the flat object on a chuck table; grinding the flat object supported by the holder on the chuck table using a grinding device; removing the holder supporting the flat object from the chuck table after completion of said grinding so as to thereby remove the flat object from the chuck table; and transporting the holder supporting the flat object away from the chuck table after said removing so as to thereby transport the flat object away from the chuck table. 2. The method of claim 1, wherein the frame has a central opening therein, said applying comprising applying only the periphery of the adhesive protection tape to the frame so that a portion of the adhesive protection tape covers and closes the central opening of the frame.3. The method of claim 2, wherein said adhering comprises adhering the flat object to the portion of the adhesive protection tape covering and closing the central opening of the frame.4. The method of claim 1, wherein said fixing the frame on the holder comprises fixing the frame on the holder so that the periphery of the adhesive protection tape applied to the frame is held between the frame and a periphery of the holder.5. The method of claim 1, wherein said placing the holder on the chuck table includes applying a negative pressure to the holder via the chuck table so as to hold the holder to the chuck table via the negative pressure.6. The method of claim 5, wherein the flat object supporting area of the holder is made of a porous material, said applying of the negative pressure to the holder comprises applying the negative pressure to the flat object supporting area of the holder to as to hold the flat object to the holder via the negative pressure and the adhesive protection tape.7. The method of claim 1, wherein the flat object supporting area of the holder is made of a porous material.8. The method of claim 1, further comprising:applying a die-attachment film to the flat object after said grinding of the flat object; applying a dicing tape to the die-attachment film; and applying a dicing frame onto a periphery of the dicing tape. 9. The method of claim 8, further comprising:after said applying of the dicing frame, removing the dicing frame, the holder, and then adhesive protection tape all together from the flat object. 10. The method of claim 1, wherein the flat object is one of a semiconductor wafer, a rearranged and wired semiconductor substrate, and a rearranged, wired, and resin-sealed semiconductor substrate.