$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Methods of bonding two aluminum-comprising masses to one another 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-00120
  • B23K-03102
  • C23C-01400
출원번호 US-0659867 (2000-09-12)
발명자 / 주소
  • Kim, Jaeyeon
출원인 / 주소
  • Honeywell International Inc.
대리인 / 주소
    Wells St. John P.S.
인용정보 피인용 횟수 : 22  인용 특허 : 52

초록

The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the

대표청구항

1. A method of bonding a first aluminum-comprising mass to a second aluminum-comprising mass, comprising:providing a first aluminum-comprising mass and a second aluminum-comprising mass, the first aluminum-comprising mass having a first surface and the second aluminum-comprising mass having a second

이 특허에 인용된 특허 (52)

  1. Blackmon James B. (Irvine CA) Drubka Robert E. (Huntington Beach CA) Kirby John S. (Long Beach CA) Johnson Dave (Riverside CA) Gerrick R. Andrew (Santa Ana CA) Ingersoll Thomas (Laguna Niguel CA) Jon, Advanced survivable radiator.
  2. Gentry Rebecca A. (Monroeville PA) Martukanitz Richard P. (Greensburg PA), Aluminum base copper-lithium-magnesium welding alloy for welding aluminum lithium alloys.
  3. Okabe Shinji (Saitama JPX) Iwasa Takashi (Saitama JPX) Irie Takushi (Saitama JPX) Furukawa Yuichi (Tochigi JPX) Iwai Ichiro (Tochigi JPX), Aluminum weldment and method of welding aluminum workpieces.
  4. Hartsough Larry D. (Berkeley CA), Apparatus and process for sputter deposition of reacted thin films.
  5. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
  6. Demaray Richard E. ; Herrera Manuel, Autoclave bonding of sputtering target assembly.
  7. Dumont Christian M. (Bornheim DEX) Schmitz Norberg W. (Euskirchem DEX) Quaderer Hans (Schaan LIX), Composite aluminum plate for physical coating processes and methods for producing composite aluminum plate and target.
  8. Ewing ; Jr. Joseph H. (Lake Park FL) Safai Saed (Vernon CT), Composite thermal insulation structure.
  9. Haixing Zheng ; Su-Jen Ting ; Cheng-Jye Chu, Composition useful for treating metal surfaces.
  10. Zhang Hao, Diffusion bonded sputter target assembly and method of making.
  11. Beier Anthony F. ; Kardokus Janine K. ; Strothers Susan D., Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same.
  12. Ferrando William A. (Arlington VA) Divecha Amarnath P. (Falls Church VA) Karmarkar Subhash D. (Great Falls VA), Diffusion bonding process for aluminum and aluminum alloys.
  13. Byrd Norman R. (Villa Park CA), Electrodeposition of coatings on metals to enhance adhesive bonding.
  14. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards and electronic components thereof.
  15. Giglia Robert D. (Rye NY), Flocked fabric laminate for protection against chemical agents.
  16. Enomoto Masatoshi,JPX ; Tasaki Seiji,JPX ; Nishikawa Naoki,JPX ; Hashimoto Takenori,JPX, Friction agitation jointing method of metal workpieces.
  17. Olsen Randall B. (Olivenhain CA), Graphite fiber thermal radiator.
  18. Dickinson Richard C. (Arlington Heights IL), Heat transfer element having the thermally conductive fibers.
  19. Brown Dennis Cockburn (Leamington Spa EN) Murray Reginald (Leamington Spa EN), Metallic bonding method.
  20. Hill Norris L. ; Lisenbardt Thomas L. ; Ronden Kevin D., Method and apparatus for minimizing the distortion in cold pressure welding.
  21. Kennedy James R. (Huntington NY) Ting Edmund Y. (Oyster Bay NY), Method for diffusion bonding of alloys having low solubility oxides.
  22. Kennedy James R. (Huntington NY) Ting Edmund Y. (Flushing NY), Method for diffusion bonding of metals and alloys using thermal spray deposition.
  23. Woods Ralph A. (Pleasanton CA) Scott Arthur C. (Livermore CA) Przybycien Dennis D. (Pleasanton CA), Method for improving the fillet-forming capability of aluminum vacuum brazing sheet products.
  24. Reboux Jean (Paris FRX) Lamote Jean-Pierre (Paris FRX), Method for induction butt-welding metal parts, in particular parts of irregular cross-section.
  25. Koon Robert W. ; Steelman Thomas E., Method for single filament transverse reinforcement in composite prepreg material.
  26. Edgington Robert E. (120 S. Genesse Bellaire MI 49615), Method for soldering aluminum.
  27. Mueller John J. (Hilliard OH) Stellrecht David E. (Columbus OH), Method of bonding a sputter target-backing plate assembly assemblies produced thereby.
  28. Gilman Paul S. ; Kulkarni Shailesh ; Blanchet Jean Pierre,FRX, Method of bonding a sputtering target to a backing plate.
  29. Ohashi Osamu (Sayama JPX) Sasabe Ken (Tokorozawa JPX), Method of diffusion bonding of aluminum or alumina ceramics.
  30. Cartossi Nando (Novara IT), Method of heat and pressure bonding of plates of heat conductive metal onto stainless steel surfaces.
  31. Yen ; Chia-Ming ; Schmatz ; Duane J., Method of joining metal, particularly aluminum or aluminum alloys, using bromine fluxing agent.
  32. Strothers Susan D. (Spokane WA) Delano Robert G. (Valleyford WA) Steed Garold L. (Spokane WA), Method of manufacturing sputtering target assembly.
  33. Fick Herbert J. (Northfield MN), Method of preparing interfacings of heat sinks with electrical devices.
  34. Stellrecht David E. (Columbus OH), Method of welding sputtering target/backing plate assemblies.
  35. Strukel Igor ; Banko William, Phacoemulsification handpiece, sleeve, and tip.
  36. Quon William (Alhambra CA) Tanzer Herbert J. (Topanga CA), Phase change cooling of semiconductor power modules.
  37. Demaray Richard Ernest ; Hosokawa Akihiro ; Herrera Manuel J., Preparation and bonding of workpieces to form sputtering targets and other assemblies.
  38. Melnyk Paul (Parma OH), Process for fabrication of high impact strength composites.
  39. Renshaw Theodore A. (North Babylon NY) Sarrantonio Albert (Woodbury NY), Progressive ultrasonic welding system.
  40. O\Donley Bobby (Sherman TX), Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound.
  41. Martorana Richard T. (Andover MA) Heimann Thomas D. (Methuen MA) Bimshas John (Winchester MA), Solid state directional thermal cable.
  42. Qamar, Sohail S.; Conard, Harry W.; Hamilton, Lowell E., Sputter target design.
  43. Hunt Thomas J. ; Gilman Paul S., Sputter target/backing plate assembly and method of making same.
  44. Hunt Thomas J. ; Gilman Paul S., Sputter target/backing plate assembly and method of making same.
  45. Fukasawa Yoshiharu (Yokohama JPX) Kawai Mituo (Yokohama JPX) Ishihara Hideo (Yokohama JPX) Yamanobe Takashi (Yokohama JPX), Sputtering target.
  46. Ohhashi Tateo (Kitaibaraka JPX) Fukuyo Hideaki (Kitaibaraka JPX) Sawamura Ichiroh (Kitaibaraka JPX) Nakamura Kenichirou (Kitaibaraka JPX) Fukushima Atsushi (Kitaibaraka JPX) Nagasawa Masaru (Kitaibar, Sputtering target assembly having solid-phase bonded interface.
  47. Shimomuki Hitoshi,JPX ; Sasaki Fumio,JPX ; Shimizu Eiichi,JPX, Sputtering target assembly production method.
  48. Dunlop John A. (Veradale WA) Yuan Jun (Santa Clara CA) Kardokus Janine K. (Otis Orchards WA) Emigh Roger A. (Post Falls ID), Sputtering target with ultra-fine, oriented grains and method of making same.
  49. Masuda Kaoru,JPX ; Taniguchi Shigeru,JPX ; Hiraki Akitoshi,JPX, Sputtering titanium target assembly and producing method thereof.
  50. Ghosh Amit K. (Thousand Oaks CA) Hamilton C. Howard (Thousand Oaks CA) Paton Neil E. (Allison Park PA), Structural metal matrix composite and method for making same.
  51. Lee James C. K. (Los Altos Hills CA) Amdahl Gene M. (Atherton CA) Beck Richard (Cupertino CA) Lee Chune (San Francisco CA) Hu Edward (Sunnyvale CA), System for detachably mounting semiconductors on conductor substrate.
  52. Browne James M. (21 Pillon Reef Pleasant Hill CA 94523), Thermally conductive joining film.

이 특허를 인용한 특허 (22)

  1. Schujman, Sandra B.; Rao, Shailaja P.; Bondokov, Robert T.; Morgan, Kenneth E.; Slack, Glen A.; Schowalter, Leo J., Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them.
  2. Schujman, Sandra B.; Rao, Shailaja P.; Bondokov, Robert T.; Morgan, Kenneth E.; Slack, Glen A.; Schowalter, Leo J., Aluminum nitride bulk crystals having high transparency to untraviolet light and methods of forming them.
  3. Hoffstaedter, Norbert; Spring, Markus, Composite metal object and method for producing a composite object.
  4. Slack, Glen A.; Schujman, Sandra B., Deep-eutectic melt growth of nitride crystals.
  5. Bondokov, Robert T.; Morgan, Kenneth E.; Schowalter, Leo J.; Slack, Glen A., Defect reduction in seeded aluminum nitride crystal growth.
  6. Bondokov, Robert T.; Morgan, Kenneth E.; Schowalter, Leo J.; Slack, Glen A., Defect reduction in seeded aluminum nitride crystal growth.
  7. Bondokov, Robert T.; Morgan, Kenneth E.; Schowalter, Leo J.; Stack, Glen A., Defect reduction in seeded aluminum nitride crystal growth.
  8. Bondokov, Robert T.; Schowalter, Leo J.; Morgan, Kenneth; Slack, Glen A.; Rao, Shailaja P.; Gibb, Shawn Robert, Defect reduction in seeded aluminum nitride crystal growth.
  9. Slack, Glen A.; Schowalter, Leo J., Doped aluminum nitride crystals and methods of making them.
  10. Slack, Glen A.; Schowalter, Leo J., Doped aluminum nitride crystals and methods of making them.
  11. Bondokov, Robert T.; Rao, Shailaja P.; Gibb, Shawn R.; Schowalter, Leo J., Growth of large aluminum nitride single crystals with thermal-gradient control.
  12. Bondokov, Robert T.; Rao, Shailaja P.; Gibb, Shawn Robert; Schowalter, Leo J., Growth of large aluminum nitride single crystals with thermal-gradient control.
  13. Schowalter, Leo J.; Slack, Glen A.; Rojo, J. Carlos, Method and apparatus for producing large, single-crystals of aluminum nitride.
  14. Schowalter, Leo; Slack, Glen A.; Rojo, Juan Carlos; Bondokov, Robert T.; Morgan, Kenneth E.; Smart, Joseph A., Method and apparatus for producing large, single-crystals of aluminum nitride.
  15. Daroff, Zachary B., Method for angular oscillation friction welding to an axially symmetric weld surface.
  16. Morgan, Kenneth E.; Schowalter, Leo J.; Slack, Glen A., Methods for controllable doping of aluminum nitride bulk crystals.
  17. Schowalter, Leo J.; Smart, Joseph A.; Liu, Shiwen; Morgan, Kenneth E.; Bondokov, Robert T.; Bettles, Timothy J.; Slack, Glen A., Nitride semiconductor heterostructures and related methods.
  18. Schowalter, Leo J.; Chen, Jianfeng; Grandusky, James R., Photon extraction from nitride ultraviolet light-emitting devices.
  19. Schowalter, Leo J.; Chen, Jianfeng; Grandusky, James R., Photon extraction from nitride ultraviolet light-emitting devices.
  20. Grandusky, James R.; Schowalter, Leo J.; Jamil, Muhammad; Mendrick, Mark C.; Gibb, Shawn R., Pseudomorphic electronic and optoelectronic devices having planar contacts.
  21. Schowalter, Leo J.; Smart, Joseph A.; Grandusky, James R.; Liu, Shiwen, Thick pseudomorphic nitride epitaxial layers.
  22. Yan, Jiuchun; Zhao, Weiwei; Xu, Huibin; Li, Dacheng; Xu, Zhiwu; Yang, Shiqin; Zhang, Yang; Ma, Zhipeng, Ultrasonic brazing of aluminum alloy and aluminum matrix composite.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로