IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0955722
(2001-09-18)
|
발명자
/ 주소 |
- Peterson, Kenneth A.
- Conley, William R.
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출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
40 인용 특허 :
11 |
초록
▼
The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the pro
The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.
대표청구항
▼
1. A temporarily protected, non-functioning MEMS device, comprising:a released MEMS device disposed on a substrate; and a temporary, immobilizing coating directly contacting and immobilizing the released MEMS device; wherein the temporary, immobilizing coating is selected from the group consisting o
1. A temporarily protected, non-functioning MEMS device, comprising:a released MEMS device disposed on a substrate; and a temporary, immobilizing coating directly contacting and immobilizing the released MEMS device; wherein the temporary, immobilizing coating is selected from the group consisting of parylene, carbon, amorphous carbon, diamond-like carbon, perfluoropolyether, and perfluorodecanoic carboxylic acid; wherein the temporary, immobilizing coating is sufficiently thick so as to immobilize any movable elements of the released MEMS device; and wherein the temporary, immobilizing coating is insoluble in water and organic solvents; and wherein said temporarily protected, non-functioning MEMS device represents an intermediate step in the process of fabricating a fully-functional MEMS device. 2. The temporarily protected, non-functioning MEMS device of claim 1, wherein the substrate comprises a wafer comprising a plurality of released MEMS devices coated directly with the protective temporary immobilizing coating.3. The temporarily protected, non-functioning MEMS device of claim 2, wherein the protective temporary, immobilizing coating is excluded from covering any wafer streets.4. The temporarily protected, non-functioning MEMS device of claim 1, wherein the substrate comprises a die.5. The temporarily protected, non-functioning MEMS device of claim 4, wherein the die is mechanically attached and electrically interconnected to a package.6. The temporarily protected, non-functioning MEMS device of claim 4, wherein the die is wirebonded to the package.7. The temporarily protected, non-functioning MEMS device of claim 4, wherein the die is flip-chip bonded to the package.8. The temporarily protected, non-functioning MEMS device of claim 1, wherein the temporary, immobilizing coating comprises parylene; and wherein the parylene coating comprises one or more polymers selected from the group consisting of poly-para-xylylene, poly-para-xylylene modified by the substitution of a chlorine atom for one aromatic hydrogen, and poly-para-xylylene modified by the substitution of a chlorine atom for two aromatic hydrogens.9. The temporarily protected, non-functioning MEMS device of claim 1, wherein the protective temporary, immobilizing coating comprises parylene; and wherein the parylene coating comprises a copolymer compound formed by blending a reactive parylene monomer with a reactive material.10. A temporarily protected, non-functioning MEMS device of claim 9, wherein the reactive material comprises a monomer comprising one or more elements selected from the group consisting of silicon, carbon, and fluorine.11. A temporarily protected, non-functioning wafer, comprising:a wafer comprising a plurality of released MEMS devices disposed on the wafer; and a protective temporary, immobilizing coating of parylene directly contacting and immobilizing the released MEMS devices; wherein the temporary, immobilizing coating is sufficiently thick so as to immobilize any movable elements of the released MEMS devices; and wherein the temporary, immobilizing coating protects the released MEMS devices during a die singulation step. 12. The temporarily protected, non-functioning wafer of claim 11, wherein the protective temporary, immobilizing coating of parylene is excluded from covering any wafer streets.13. A temporarily protected, non-functioning MEMS device, comprising:a released MEMS device disposed on a die; and a protective temporary, immobilizing coating of parylene directly contacting and immobilizing the released MEMS device; wherein the protective temporary, immobilizing coating is sufficiently thick so as to immobilize any movable elements of the released MEMS device; and wherein said temporarily protected, non-functioning MEMS device represents an intermediate step in the process of fabricating a fully-functional MEMS device. 14. The temporarily protected, non-functioning MEMS device of claim 13, wherein the die is mechanically attached and electrically interconnected to a package.15. The temporarily protected, non-functioning MEMS device of claim 14, wherein the die is wirebonded to the package.16. The temporarily protected, non-functioning MEMS device of claim 14, wherein the die is flip-chip bonded to the package.
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