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A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor

A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor chamber and increases the temperature of the fins for improved efficiency. The vapor chamber is defined between concentrically positioned tubes, and a tunnel region is located within the inner tube. Additional TEC elements within the tunnel region further dissipate heat. In two-phase natural convection embodiments, TEC elements may further cool liquid returning to the heat source. Parallel heat dissipation paths may also be provided. In a two-phase forced convection embodiment, a TEC element may further cool liquid returning to the heat source, and additional TEC elements may be provided on the condenser. In some embodiments, active feedback controls the amount of energy transferred by a TEC element.

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1. A heat-transfer device comprising:a sealed vapor chamber having a phase-change fluid therein; and a thermoelectric cooling (TEC) element having a first side in thermal contact with the vapor chamber and a second side in contact with heat-dissipation fins, the TEC element to decrease the temperatu

1. A heat-transfer device comprising:a sealed vapor chamber having a phase-change fluid therein; and a thermoelectric cooling (TEC) element having a first side in thermal contact with the vapor chamber and a second side in contact with heat-dissipation fins, the TEC element to decrease the temperature of the vapor chamber and increase the temperature of the fins to improve efficiency, wherein a heat source is in thermal contact with the vapor chamber, heat from the heat source to evaporate the phase-change fluid, the phase-change fluid to condense within the vapor chamber, the TEC element to cool the vapor chamber. 2. The device of claim 1 wherein the heat source is a processor, and wherein the TEC element is to decrease the temperature of the fluid in the vapor chamber to a temperature below an ambient temperature.3. A heat-transfer device comprising:a sealed vapor chamber having a phase-change fluid therein; and a thermoelectric cooling (TEC) element having a first side in thermal contact with the vapor chamber and a second side in contact with heat-dissipation fins, the TEC element to decrease the temperature of the vapor chamber and increase the temperature of the fins to improve efficiency, wherein the TEC element is responsive to an applied voltage to decrease the temperature of the vapor chamber and to increase the temperature of the fins, and wherein the device further comprises a controller to monitor a temperature of the heat source and to adjust the applied voltage based on the monitored temperature to maintain the heat source within a predetermined temperature range. 4. A heat-transfer device comprising:a sealed vapor chamber having a phase-change fluid therein; and a thermoelectric cooling (TEC) element having a first side in thermal contact with the vapor chamber and a second side in contact with heat-dissipation fins, the TEC element to decrease the temperature of the vapor chamber and increase the temperature of the fins to improve efficiency, wherein the vapor chamber is defined between an internal surface of a first tube and an external surface of a second tube positioned within the first tube. 5. The device of claim 4 further comprising a tunnel region having additional heat dissipation fins therein, the tunnel being within the second tube.6. The device of claim 5 wherein the additional heat dissipation fins are coupled to opposite sides of the tunnel region.7. The device of claim 4 further comprising:a tunnel region located within the second tube; first and second TEC elements within the tunnel region coupled to opposite internal surfaces of the second tube; and heat dissipation fins within the tunnel region between the first and second TEC elements, the first and second TEC elements to decrease a temperature of the internal surfaces of the second tube, and to increase a temperature of both ends of the fins within the tunnel region. 8. The device of claim 7 wherein the first and second TEC elements are responsive to an applied voltage to decrease the temperature of the vapor chamber and to increase the temperature of the fins, andwherein the device further comprises a controller to monitor a temperature of a heat source and to adjust the applied voltage applied based on the monitored temperature to maintain the heat source within a predetermined temperature range. 9. The device of claim 7 further comprising a fan to provide air flow across the heat dissipation fins within the tunnel region.10. The device of claim 4 wherein the first and second tubes have substantially a rectangular cross-section and the first and second tubes are held substantially concentric with each other by end caps to seal the vapor chamber.11. The device of claim 10 wherein at least one TEC element is coupled to an external surface of the first tube.12. The device of claim 4 wherein the tubes are comprised of copper or a copper alloy and the phase-change fluid comprises water.13. The device of claim 4 wherein the tubes are comprised of aluminum or an aluminum alloy and the phase change fluid comprises either a refrigerant or an alcohol.14. A heat transfer device comprising:an evaporator to absorb heat from a heat source and to convert a phase-change fluid to vapor; a heat exchanger to condense the vapor to liquid; a thermoelectric cooling (TEC) element to cool the liquid; heat dissipation fins coupled to a heated side of the TEC element; and a pump to move the liquid from the heat exchanger to the TEC element. 15. The device of claim 14 wherein the TEC element is coupled to a heat pipe in a heat transfer area between the pump and the evaporator to reduce the temperature of the liquid returning to the evaporator.16. The device of claim 15 further comprising an additional TEC element coupled to the heat exchanger to reduce a temperature of the heat exchanger to condense the phase-change fluid.17. The device of claim 14 wherein the TEC element is coupled to the heat exchanger to reduce a temperature of the heat exchanger to condense the phase-change fluid.18. A heat transfer device comprising:an evaporator to absorb heat from a heat source and to convert a phase-change fluid to vapor; a heat exchanger to condense the vapor to liquid; a thermoelectric cooling (TEC) element to cool the liquid, wherein the heat exchanger includes a forced convection heat exchanger for positioning above the evaporator, wherein gravity returns the condensed liquid from the heat exchanger to the TEC element. 19. The device of claim 15 wherein the TEC element has a cooled side that is externally coupled to a pipe having the liquid therein, the TEC element to cool the liquid within the pipe to a sub-ambient temperature.20. The device of claim 19 wherein the TEC element is responsive to an applied voltage to decrease the temperature of the pipe and to increase the temperature of the fins, andwherein the device further comprises a controller to monitor a temperature of the heat source and to adjust the applied voltage based on the monitored temperature to maintain the heat source within a predetermined temperature range. 21. A heat transfer device comprising:an evaporator to absorb heat from a heat source and to convert a phase-change fluid to vapor; a heat exchanger to condense the vapor to liquid; a thermoelectric cooling (TEC) element to cool the liquid, wherein the TEC element and the heat dissipation fins comprise a first TEC element and first heat dissipation fins to provide a first path to at least return the liquid to the evaporator within a first heat pipe, and wherein the device further comprises second heat dissipation fins coupled to a second TEC element to provide a second path to at least return the liquid to the evaporator within a second heat pipe. 22. The device of claim 21 further comprising first and second heat pipes that include wicking material therein to help draw the liquid to the evaporator.23. A method comprising:evaporating a phase-change fluid with heat from a heat source to generate a vapor; condensing the vapor with a thermoelectric cooling (TEC) element; sub-cool the fluid; and dissipating heat from the TEC element, wherein evaporating comprises evaporating the phase-change fluid within a chamber, and wherein condensing comprises cooling internal surfaces of the chamber with the TEC element. 24. The method of claim 23 wherein condensing comprises the TEC element cooling the temperature of the fluid in the chamber to a temperature below an ambient temperature.25. The method of claim 24 wherein condensing comprises the TEC element cooling the temperature of the fluid in the chamber based on an applied voltage, and wherein the method further includes:monitoring a temperature of the heat source; and adjusting the applied voltage based on the monitored temperature to maintain the heat source within a predetermined temperature range. 26. A method comprising:evaporating a phase-change fluid with heat from a heat source to generate a vapor; condensing the vapor with a thermoelectric cooling (TEC) element; sub-cool the fluid; and dissipating heat from the TEC element, wherein dissipating heat comprises the TEC element at least in part to heat fins for improved heat-dissipation efficiency.