초록 ▼

A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect t

A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.

대표청구항 ▼

1. An electronic system adapted for heat dissipation, said electronic system comprising:a heat sink positioned to transfer heat to air flowing from an upstream path, said heat sink comprising a support portion and a plurality of fins extending there from, said fins and said support portion together

1. An electronic system adapted for heat dissipation, said electronic system comprising:a heat sink positioned to transfer heat to air flowing from an upstream path, said heat sink comprising a support portion and a plurality of fins extending there from, said fins and said support portion together defining a channel having a portion angled with respect to the upstream path of flowing air, thereby facilitating redirection of the flowing air from the upstream path; said electronic system defining an aperture through which at least a portion of the flowing air passes, said heat sink being positioned closely adjacent to and upstream of said aperture, and said fins of said heat sink being configured to focus the path of the flowing air toward said aperture for flow there through. 2. An electronic system adapted for heat dissipation, said electronic system comprising:a heat sink positioned to transfer heat to air flowing from an upstream path, said heat sink comprising a support portion and a plurality of fins extending there from, said fins and said support portion together defining a channel having a portion angled with respect to the upstream path of flowing air, thereby facilitating redirection of the flowing air from the upstream path; said electronic system defining an aperture through which at least a portion of the flowing air passes, said heat sink being positioned closely adjacent to and downstream of said aperture, and said fins of said heat sink being configured to disburse air flowing from said aperture. 3. An electronic system adapted for heat dissipation, said electronic system defining an aperture through which flowing air passes, said electronic system comprising:a circuit board assembly having a plurality of electronic components; and a heat sink positioned upstream of said aperture and a heat sink positioned downstream of said aperture, each of said heat sinks comprising a support portion and a plurality of fins extending there from, said fins and said support portion together defining a channel having a portion angled with respect to the upstream path of flowing air, thereby facilitating redirection of the flowing air from the upstream path to a downstream path generally adjacent said circuit board assembly, said fins of said upstream heat sink being configured to focus the path of the flowing air toward said aperture for flow there through, and said fins of said downstream heat sink being configured to disburse air flowing from said aperture; wherein at least one of said components is positioned along said downstream path for heat dissipation by the redirected flowing air. 4. The electronic system of claim 3, said fins and said support portion together defining a plurality of channels, two or more of said channels having a portion angled with respect to the upstream path of flowing air.5. The electronic system of claim 4, said channels facilitating redirection of the flowing air to two or more downstream paths.6. The electronic system of claim 4, wherein axes of said channels are non-parallel.7. A method for dissipating heat from components of an electronic system, said method comprising the steps of:flowing air along an upstream path and toward an upstream edge portion of a heat sink having a substantially planar support portion and a plurality of fins defining a channel which extends from the upstream edge portion of the heat sink to a downstream edge portion of the heat sink, the channel having a portion angled with respect to the upstream path; redirecting the flowing air, by means of the channel of the heat sink, from the upstream path to a downstream path; preventing the flowing air at the downstream edge portion from flowing parallel to the flowing air at the upstream edge portion; and dissipating heat from one or more components positioned along the downstream path; said flowing step comprising flowing air through an aperture defined by the electronic system, and said redirecting step comprising redirecting air flowing into or out from the aperture. 8. A method for dissipating heat from components of an electronic system, said method comprising the steps of:flowing air along an upstream path toward a heat sink defining a channel having a portion angled with respect to the upstream path; focusing, by means of the channel of the heat sink, the path of the flowing air from the upstream path toward an aperture closely adjacent to and downstream of the heat sink for flow there through; and dissipating heat from one or more components positioned downstream from the aperture. 9. A method for dissipating heat from components of an electronic system, said method comprising the steps of:flowing air along an upstream path through an aperture defined by the electronic system and toward a heat sink closely adjacent to and downstream of the aperture, the heat sink defining a channel having a portion angled with respect to the upstream path; disbursing, by means of the channel of the heat sink, air flowing from the aperture; and dissipating heat from one or more components positioned downstream from the heat sink. 10. A method for dissipating heat from components of an electronic system, said method comprising the steps of:flowing air along an upstream path and toward an upstream edge portion of a heat sink having a substantially planar support portion and a plurality of fins defining a channel which extends from the upstream edge portion of the heat sink to a downstream edge portion of the heat sink, the channel having a portion angled with respect to the upstream path; redirecting the flowing air, by means of the channel of the heat sink, from the upstream path to a downstream path; preventing the flowing air at the downstream edge portion from flowing parallel to the flowing air at the upstream edge portion; and dissipating heat from one or more components positioned along the downstream path; said flowing step comprising flowing air toward an aperture, a heat sink positioned upstream from the aperture, and a heat sink positioned downstream from the aperture, and said redirecting step comprising focusing the path of the flowing air, by means of the upstream heat sink, toward the aperture for flow there through and disbursing air flowing from the aperture by means of the downstream heat sink.