초록 ▼

Microchip devices and methods of use are provided for the controlled exposure of a secondary device. In one embodiment, the microchip device include a substrate, a plurality of reservoirs in the substrate, a secondary device in one or more of the reservoirs, at least one barrier layer covering each

Microchip devices and methods of use are provided for the controlled exposure of a secondary device. In one embodiment, the microchip device include a substrate, a plurality of reservoirs in the substrate, a secondary device in one or more of the reservoirs, at least one barrier layer covering each of the reservoirs to isolate the secondary device from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component, and a microprocessor-controlled actuation means for rendering the barrier layer porous or permeable to the environmental component to expose the secondary device to said environmental component. The secondary device can comprise a sensor or sensing component (e.g., a biosensor). In other embodiments, microchip devices are provided for the controlled exposure of a reacting component, such as an enzyme. In still other embodiments, sensors are provided on the device outside of the reservoirs.

대표청구항 ▼

1. A microchip device for controlled exposure of a reacting component comprising:a substrate; a plurality of reservoirs in the substrate; a reacting component immobilized in the reservoirs; at least one barrier layer covering each of the reservoirs to isolate the reacting component from an environme

1. A microchip device for controlled exposure of a reacting component comprising:a substrate; a plurality of reservoirs in the substrate; a reacting component immobilized in the reservoirs; at least one barrier layer covering each of the reservoirs to isolate the reacting component from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component; and a microprocessor-controlled actuation means for disintegrating the barrier layer or for rendering the barrier layer porous or permeable to the environmental component, to expose the reacting component to said environmental component. 2. The microchip device of claim 1, wherein the reacting component comprises a catalyst.3. The microchip device of claim 2, wherein the catalyst is an enzyme.4. The microchip device of claim 1, further comprising a reaction control component mounted inside each of the reservoirs.5. A method of controlling exposure of a reacting component to an environmental component, the method comprising:providing at a site, which comprises an environmental component, a microchip device which comprises a substrate, a plurality of reservoirs in the substrate, a reacting component immobilized in the reservoirs, at least one barrier layer covering each of the reservoirs to isolate the reacting component from the environmental component outside the reservoirs and at the site, wherein the barrier layer is impermeable to the environmental component, and a microprocessor-controlled actuation means for disintegrating the barrier layer or rendering the barrier layer porous or permeable to the environmental component; and then selectively disintegrating the barrier layer, or selectively rendering the barrier layer porous or permeable to the environmental component, to expose the reacting component to the environmental component. 6. The method of claim 5, wherein the reacting component comprises an enzyme or other catalyst.7. The microchip device of claim 1, wherein the microprocessor-controlled actuation means is activated at a specified time, or upon receipt of a signal from another device, or upon detection of a specified sensed condition.8. The microchip device of claim 1, wherein the reacting component comprises an antibody.9. The microchip device of claim 1, wherein the reacting component is selected from the group consisting of cells, proteins, nucleic acids, and polysaccharides.10. The microchip device of claim 1, further comprising a cathode, wherein the barrier layer comprises an anode, whereby the barrier layer disintegrates upon application of an electric potential between the cathode and the anode.11. The microchip device of claim 1, wherein barrier layer disintegrates to expose the reacting component.12. The microchip device of claim 11, wherein the disintegration of the barrier layer occurs by loss of structural integrity due to a chemical reaction or phase change.13. The microchip device of claim 11, wherein the disintegration of the barrier layer occurs by rupturing or fracturing.14. The microchip device of claim 1, wherein the barrier layer comprises a metal layer.15. The microchip device of claim 14, wherein the metal layer comprises gold.16. The microchip device of claim 1, further comprising a layer of a dielectric material deposited on one or more surfaces of the device.17. The microchip device of claim 16, wherein the dielectric material comprises a silicon oxide or a silicon nitride.18. The microchip device of claim 1, wherein the reservoirs further include one or more microorganisms coated or immobilized on a surface inside the reservoirs.19. The microchip device of claim 1, wherein the microprocessor-controlled actuation means comprises control circuitry, memory, and a power source.20. The microchip device of claim 1, wherein the actuation means is operable using wireless transmission of power or data.21. The microchip device of claim 4, wherein the reaction control component comprises a resistive heater or a polarizable electrode.22. A microchip device comprising:a substrate; a plurality of reservoirs in the substrate; a reacting component immobilized in each of the reservoirs; at least one metal barrier layer covering each of the reservoirs to isolate the reacting component from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component; and control circuitry and power source for selectively disintegrating the barrier layer of each reservoir to expose the reacting component to said environmental component. 23. The microchip device of claim 22, wherein the control circuitry and power source cause the barrier layer to disintegrate by loss of structural integrity due to a chemical reaction or phase change.24. The microchip device of claim 22, wherein the control circuitry and power source cause the barrier layer to disintegrate by rupturing or fracturing.25. The method of claim 5, wherein the site is in vivo.26. The method of claim 5, wherein barrier layer is disintegrated to expose the reacting component.27. The method of claim 26, wherein the disintegration of the barrier layer occurs by loss of structural integrity due to a chemical reaction or phase change.28. The method of claim 26, wherein the disintegration of the barrier layer occurs by rupturing or fracturing.29. The method of claim 26, wherein the barrier layer comprises a metal layer.30. The microchip device of claim 1, which is encased in a biocompatible material.31. A device comprising:a substrate; an array of discrete reservoirs in the substrate; one or more reacting components immobilized in the reservoirs; discrete barrier layers covering the reservoirs to isolate the one or more reacting components from an environmental component outside the reservoirs, wherein the barrier layer is impermeable to the environmental component; and control circuitry and a power source for selectively disintegrating at least a portion of the barrier layers to expose the reacting component to said environmental component. 32. The device of claim 31, wherein the barrier layer covering a reservoir comprises two or more layers.33. The device of claim 32, wherein the barrier layer comprises an outer layer and an inner layer, the outer layer comprising a metal reservoir cap, which is the portion of the barrier layer that is selectively disintegrated.34. The device of claim 33, wherein the inner layer comprises a polymeric membrane permeable to the environmental component, and wherein the inner layer, after disintegration of the reservoir cap, remains disposed between the reaction component and the environment outside the reservoirs.35. The device of claim 31, wherein the substrate comprises two or more substrate portions bonded together.36. The device of claim 35, wherein at least one of the substrate portions comprises a silicon, ceramic, or glass.37. The device of claim 31, wherein the reacting component is in a mixture with one or more other materials.38. The device of claim 31, wherein the disintegration comprises a chemical reaction or phase change.